TW200639276A - Plating approach of sheet-like products - Google Patents

Plating approach of sheet-like products

Info

Publication number
TW200639276A
TW200639276A TW094147354A TW94147354A TW200639276A TW 200639276 A TW200639276 A TW 200639276A TW 094147354 A TW094147354 A TW 094147354A TW 94147354 A TW94147354 A TW 94147354A TW 200639276 A TW200639276 A TW 200639276A
Authority
TW
Taiwan
Prior art keywords
plating
sheet
tub
sideways
conveyance
Prior art date
Application number
TW094147354A
Other languages
English (en)
Chinese (zh)
Other versions
TWI305804B (cg-RX-API-DMAC10.html
Inventor
Atsushi Tateno
Masakazu Suzuki
Tetsuya Takahashi
Kunihiko Azeyanagi
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200639276A publication Critical patent/TW200639276A/zh
Application granted granted Critical
Publication of TWI305804B publication Critical patent/TWI305804B/zh

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW094147354A 2005-05-13 2005-12-29 Plating approach of sheet-like products TW200639276A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005140980A JP4700406B2 (ja) 2005-05-13 2005-05-13 シート状製品のめっき方法

Publications (2)

Publication Number Publication Date
TW200639276A true TW200639276A (en) 2006-11-16
TWI305804B TWI305804B (cg-RX-API-DMAC10.html) 2009-02-01

Family

ID=37424661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147354A TW200639276A (en) 2005-05-13 2005-12-29 Plating approach of sheet-like products

Country Status (3)

Country Link
JP (1) JP4700406B2 (cg-RX-API-DMAC10.html)
CN (1) CN1865520B (cg-RX-API-DMAC10.html)
TW (1) TW200639276A (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101054701B (zh) * 2007-02-08 2010-12-08 上海美维科技有限公司 提高电镀均匀性的方法
KR101070841B1 (ko) 2011-06-02 2011-10-06 장병원 박판 인쇄 회로 기판의 동 도금라인에 있어서, 박판 인쇄 회로 기판의 도금방법 및 그 장치
KR101080896B1 (ko) 2011-06-10 2011-11-07 장병원 인쇄 회로 기판 제조 공정중 하나인 전기동 도금 라인의 전기동 도금조 내에서 인쇄 회로 기판에 도금액 흐름성을 좋게 하고 인쇄 회로 기판 표면의 동도금을 균일하게 할 수 있도록 한 고정구
JP5731917B2 (ja) * 2011-06-30 2015-06-10 上村工業株式会社 表面処理装置およびめっき槽
CN102286770A (zh) * 2011-08-26 2011-12-21 珠海市祥芝电子有限公司 电镀专用夹具
KR101300325B1 (ko) * 2011-12-21 2013-08-28 삼성전기주식회사 기판 도금 장치 및 그 제어 방법
CN103305896B (zh) * 2012-03-07 2015-09-09 昆山东威电镀设备技术有限公司 连续电镀液体导电装置及连续液体电镀方法
TW201416302A (zh) * 2012-10-19 2014-05-01 Manz Taiwan Ltd 夾具及輸送系統
CN103374744A (zh) * 2013-07-11 2013-10-30 皆利士多层线路版(中山)有限公司 Pcb电镀铜附槽
CN105239143B (zh) * 2015-09-30 2018-11-20 东莞市威力固电路板设备有限公司 电镀设备入料系统及其控制方法
JP6305485B2 (ja) * 2016-09-14 2018-04-04 本田技研工業株式会社 搬送装置
JP6329681B1 (ja) * 2017-10-31 2018-05-23 株式会社荏原製作所 めっき装置及びめっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142937A (ja) * 1984-08-07 1986-03-01 Fujitsu Ltd 集積回路基板の製造方法
JPH0385849A (ja) * 1989-08-30 1991-04-11 Hitachi Ltd ファクシミリ装置
JPH05148693A (ja) * 1992-01-14 1993-06-15 Toshiba Corp 電気銅鍍金用治具
JP2728338B2 (ja) * 1992-05-21 1998-03-18 上村工業株式会社 プリント基板のマスキング装置
DE19736352C1 (de) * 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
JP3677488B2 (ja) * 2002-05-14 2005-08-03 丸仲工業株式会社 電気メッキ装置におけるクリップ式のワークハンガー
CN1223708C (zh) * 2001-12-27 2005-10-19 丸仲工业株式会社 电镀处理装置的产品导引机构

Also Published As

Publication number Publication date
TWI305804B (cg-RX-API-DMAC10.html) 2009-02-01
CN1865520B (zh) 2010-09-29
JP2006316322A (ja) 2006-11-24
JP4700406B2 (ja) 2011-06-15
CN1865520A (zh) 2006-11-22

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