TW200637888A - Resin composition and semiconductor device using the same - Google Patents
Resin composition and semiconductor device using the sameInfo
- Publication number
- TW200637888A TW200637888A TW095113977A TW95113977A TW200637888A TW 200637888 A TW200637888 A TW 200637888A TW 095113977 A TW095113977 A TW 095113977A TW 95113977 A TW95113977 A TW 95113977A TW 200637888 A TW200637888 A TW 200637888A
- Authority
- TW
- Taiwan
- Prior art keywords
- viscosity
- resin composition
- pas
- frequency
- polar solvent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005120985 | 2005-04-19 | ||
| JP2005198002 | 2005-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200637888A true TW200637888A (en) | 2006-11-01 |
Family
ID=37214745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095113977A TW200637888A (en) | 2005-04-19 | 2006-04-19 | Resin composition and semiconductor device using the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4748155B2 (ja) |
| TW (1) | TW200637888A (ja) |
| WO (1) | WO2006115124A1 (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008138159A (ja) * | 2006-11-07 | 2008-06-19 | Hitachi Chem Co Ltd | 樹脂組成物及びこれを用いた半導体装置 |
| JP4473916B2 (ja) | 2008-01-09 | 2010-06-02 | 日立マグネットワイヤ株式会社 | ポリアミドイミド樹脂絶縁塗料及びそれを用いた絶縁電線 |
| JP5365899B2 (ja) | 2008-06-04 | 2013-12-11 | 日立金属株式会社 | ポリアミドイミド樹脂絶縁塗料及びそれを用いた絶縁電線 |
| JP2011057880A (ja) * | 2009-09-11 | 2011-03-24 | Sumitomo Bakelite Co Ltd | 樹脂ワニス、樹脂膜、半導体装置および表示体装置 |
| JP5081258B2 (ja) * | 2010-02-05 | 2012-11-28 | 日立マグネットワイヤ株式会社 | ポリアミドイミド樹脂絶縁塗料及びそれを用いた絶縁電線 |
| WO2012133415A1 (ja) * | 2011-03-30 | 2012-10-04 | 日立化成工業株式会社 | 樹脂ペースト、太陽電池及びその製造方法、樹脂膜並びに半導体装置 |
| JP5427276B2 (ja) * | 2012-07-17 | 2014-02-26 | 日立金属株式会社 | ポリアミドイミド樹脂絶縁塗料及びそれを用いた絶縁電線 |
| JP7233071B2 (ja) * | 2018-04-24 | 2023-03-06 | ユニチカ株式会社 | ポリアミドイミド組成物およびその使用 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY131961A (en) * | 2000-03-06 | 2007-09-28 | Hitachi Chemical Co Ltd | Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof |
| JP2005023186A (ja) * | 2003-07-01 | 2005-01-27 | Hitachi Chem Co Ltd | 樹脂組成物及びこれを用いた半導体装置 |
| JP2005023185A (ja) * | 2003-07-01 | 2005-01-27 | Hitachi Chem Co Ltd | 樹脂組成物及びこれを用いた半導体装置 |
| JP2005023184A (ja) * | 2003-07-01 | 2005-01-27 | Hitachi Chem Co Ltd | 樹脂組成物及びこれを用いた半導体装置 |
| JP2005023183A (ja) * | 2003-07-01 | 2005-01-27 | Hitachi Chem Co Ltd | 樹脂組成物及びこれを用いた半導体装置 |
-
2006
- 2006-04-18 JP JP2007514608A patent/JP4748155B2/ja active Active
- 2006-04-18 WO PCT/JP2006/308133 patent/WO2006115124A1/ja active Application Filing
- 2006-04-19 TW TW095113977A patent/TW200637888A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP4748155B2 (ja) | 2011-08-17 |
| JPWO2006115124A1 (ja) | 2008-12-18 |
| WO2006115124A1 (ja) | 2006-11-02 |
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