TW200637888A - Resin composition and semiconductor device using the same - Google Patents

Resin composition and semiconductor device using the same

Info

Publication number
TW200637888A
TW200637888A TW095113977A TW95113977A TW200637888A TW 200637888 A TW200637888 A TW 200637888A TW 095113977 A TW095113977 A TW 095113977A TW 95113977 A TW95113977 A TW 95113977A TW 200637888 A TW200637888 A TW 200637888A
Authority
TW
Taiwan
Prior art keywords
viscosity
resin composition
pas
frequency
polar solvent
Prior art date
Application number
TW095113977A
Other languages
Chinese (zh)
Inventor
Hiroyuki Kawakami
Takuya Imai
Reiko Mashino
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200637888A publication Critical patent/TW200637888A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

This invention provides a resin composition having excellent pattern embedding properties, adhesion, heat resistance, flexibility and printing properties, and a semiconductor device using the same. The resin composition comprises (A) an aromatic thermoplastic resin which is soluble in a polar solvent at room temperature, (B) an aromatic thermoplastic resin which is insoluble in a polar solvent at room temperature but is soluble in a polar solvent upon heating, (C) a filler possessing rubber elasticity and having an average particle diameter of 0.1 to 6 μ and a particle diameter distribution of 0.01 to 15 μ, and (D) a polar solvent. For the resin composition, the viscosity as measured with a rheometer under conditions of shear stress 13 Pa and frequency 5 Hz and the viscosity as measured with a rheometer under conditions of shear stress 13 Pa and frequency 50 Hz are less than 400 Pas and not less than 3 Pas, respectively, and the viscosity ratio (viscosity at a frequency of 5 Hz (Pas)/viscosity at a frequency of 50 Hz (Pas)) is not less than 2.
TW095113977A 2005-04-19 2006-04-19 Resin composition and semiconductor device using the same TW200637888A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005120985 2005-04-19
JP2005198002 2005-07-06

Publications (1)

Publication Number Publication Date
TW200637888A true TW200637888A (en) 2006-11-01

Family

ID=37214745

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113977A TW200637888A (en) 2005-04-19 2006-04-19 Resin composition and semiconductor device using the same

Country Status (3)

Country Link
JP (1) JP4748155B2 (en)
TW (1) TW200637888A (en)
WO (1) WO2006115124A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008138159A (en) * 2006-11-07 2008-06-19 Hitachi Chem Co Ltd Resin composition and semiconductor device using the same
JP4473916B2 (en) 2008-01-09 2010-06-02 日立マグネットワイヤ株式会社 Polyamideimide resin insulating paint and insulated wire using the same
JP5365899B2 (en) 2008-06-04 2013-12-11 日立金属株式会社 Polyamideimide resin insulating paint and insulated wire using the same
JP2011057880A (en) * 2009-09-11 2011-03-24 Sumitomo Bakelite Co Ltd Resin varnish, resin film, semiconductor device and displaying device
JP5081258B2 (en) * 2010-02-05 2012-11-28 日立マグネットワイヤ株式会社 Polyamideimide resin insulating paint and insulated wire using the same
WO2012133415A1 (en) * 2011-03-30 2012-10-04 日立化成工業株式会社 Resin paste, solar cell, method for manufacturing solar cell, resin film, and semiconductor device
JP5427276B2 (en) * 2012-07-17 2014-02-26 日立金属株式会社 Polyamideimide resin insulating paint and insulated wire using the same
JP7233071B2 (en) * 2018-04-24 2023-03-06 ユニチカ株式会社 Polyamideimide composition and use thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY131961A (en) * 2000-03-06 2007-09-28 Hitachi Chemical Co Ltd Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
JP2005023185A (en) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd Resin composition and semiconductor device obtained by using the same
JP2005023184A (en) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd Resin composition and semiconductor device obtained by using the same
JP2005023183A (en) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd Resin composition and semiconductor device obtained by using the same
JP2005023186A (en) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd Resin composition and semiconductor device obtained by using the same

Also Published As

Publication number Publication date
JPWO2006115124A1 (en) 2008-12-18
JP4748155B2 (en) 2011-08-17
WO2006115124A1 (en) 2006-11-02

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