TW200636956A - Heterogeneous thermal interface for cooling - Google Patents

Heterogeneous thermal interface for cooling

Info

Publication number
TW200636956A
TW200636956A TW095100295A TW95100295A TW200636956A TW 200636956 A TW200636956 A TW 200636956A TW 095100295 A TW095100295 A TW 095100295A TW 95100295 A TW95100295 A TW 95100295A TW 200636956 A TW200636956 A TW 200636956A
Authority
TW
Taiwan
Prior art keywords
liquid
mesh
heat source
thermal interface
cooling
Prior art date
Application number
TW095100295A
Other languages
English (en)
Inventor
Jeffrey D Gelorme
Supratik Guha
Nancy C Labianca
Yves Martin
Theodore G Van Kessel
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200636956A publication Critical patent/TW200636956A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW095100295A 2005-01-18 2006-01-04 Heterogeneous thermal interface for cooling TW200636956A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/037,913 US7219713B2 (en) 2005-01-18 2005-01-18 Heterogeneous thermal interface for cooling

Publications (1)

Publication Number Publication Date
TW200636956A true TW200636956A (en) 2006-10-16

Family

ID=36682679

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100295A TW200636956A (en) 2005-01-18 2006-01-04 Heterogeneous thermal interface for cooling

Country Status (6)

Country Link
US (1) US7219713B2 (zh)
EP (1) EP1839468A4 (zh)
JP (1) JP2008527737A (zh)
CN (1) CN100576988C (zh)
TW (1) TW200636956A (zh)
WO (1) WO2006078334A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11515231B2 (en) 2019-08-27 2022-11-29 Asustek Computer Inc. Coating method for liquid metal thermal grease and heat dissipation module

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060180926A1 (en) * 2005-02-11 2006-08-17 Rambus, Inc. Heat spreader clamping mechanism for semiconductor modules
US20060231237A1 (en) * 2005-03-21 2006-10-19 Carlos Dangelo Apparatus and method for cooling ICs using nano-rod based chip-level heat sinks
US8232091B2 (en) 2006-05-17 2012-07-31 California Institute Of Technology Thermal cycling system
WO2007142273A1 (ja) * 2006-06-08 2007-12-13 International Business Machines Corporation 高熱伝導で柔軟なシート
US20080007915A1 (en) * 2006-07-06 2008-01-10 Chao-Chuan Chen Heat sink device for a heat generating element
CA2666815C (en) * 2006-10-17 2013-05-28 Purdue Research Foundation Electrothermal interface material enhancer
US8334592B2 (en) * 2007-09-11 2012-12-18 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
US20100328895A1 (en) * 2007-09-11 2010-12-30 Dorab Bhagwagar Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use
US20090084435A1 (en) * 2007-10-01 2009-04-02 International Business Machines Corporation Techniques for Cooling Solar Concentrator Devices
US8919428B2 (en) * 2007-10-17 2014-12-30 Purdue Research Foundation Methods for attaching carbon nanotubes to a carbon substrate
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
US7684194B2 (en) * 2008-06-04 2010-03-23 International Business Machines Corporation Systems and methods for cooling an electronic device
US8022535B2 (en) * 2008-06-06 2011-09-20 Coolsilicon Llc Systems, devices, and methods for semiconductor device temperature management
US7731079B2 (en) * 2008-06-20 2010-06-08 International Business Machines Corporation Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled
TWM351450U (en) * 2008-07-24 2009-02-21 Yi-Min Lin Integrated circuit having porous ceramic heat dissipation plate
US8541058B2 (en) * 2009-03-06 2013-09-24 Timothy S. Fisher Palladium thiolate bonding of carbon nanotubes
US7964951B2 (en) * 2009-03-16 2011-06-21 Ati Technologies Ulc Multi-die semiconductor package with heat spreader
CN202830041U (zh) * 2009-04-03 2013-03-27 Illumina公司 用于加热生物样本的设备
US8459334B2 (en) * 2009-07-31 2013-06-11 International Business Machines Corporation Containment for a patterned metal thermal interface
US8987685B2 (en) * 2009-09-09 2015-03-24 Pcr Max Limited Optical system for multiple reactions
DE102009042519A1 (de) * 2009-09-16 2011-03-24 Esw Gmbh Vorrichtung zur Kühlung von Halbleitern
JP5178759B2 (ja) * 2010-03-12 2013-04-10 三菱電機株式会社 半導体装置
US20110228481A1 (en) * 2010-03-19 2011-09-22 Domintech Co., Ltd. Thermally conductive interface means
US20110240279A1 (en) * 2010-03-30 2011-10-06 International Business Machines Corporation Hybrid liquid metal-solder thermal interface
JP2013528319A (ja) * 2010-05-21 2013-07-08 ノキア シーメンス ネットワークス オサケユキチュア ヒートシンクを部品に熱的に結合する方法及び装置
US8477500B2 (en) * 2010-05-25 2013-07-02 General Electric Company Locking device and method for making the same
US8953314B1 (en) * 2010-08-09 2015-02-10 Georgia Tech Research Corporation Passive heat sink for dynamic thermal management of hot spots
TW201209552A (en) * 2010-08-19 2012-03-01 Hon Hai Prec Ind Co Ltd Heat dissipation device
CN101984510A (zh) * 2010-08-20 2011-03-09 符建 基于液态金属基底的软性连接的led装置
US8983019B2 (en) 2010-08-31 2015-03-17 Massachusetts Institute Of Technology Superwetting surfaces for diminishing leidenfrost effect, methods of making and devices incorporating the same
CN101980390A (zh) * 2010-09-03 2011-02-23 苏州中泽光电科技有限公司 一种利用液体金属导热的led封装工艺
CN102412210B (zh) * 2011-07-20 2015-01-14 杭州玄冰科技有限公司 流固耦合散热器及散热方法
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
US8617927B1 (en) 2011-11-29 2013-12-31 Hrl Laboratories, Llc Method of mounting electronic chips
US20130224510A1 (en) * 2012-02-29 2013-08-29 General Electric Company System including thermal interface material
US20130308273A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Laser sintered matching set radiators
US20130306293A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Extruded matching set radiators
CN103147117A (zh) * 2013-04-01 2013-06-12 东方电气集团东方汽轮机有限公司 一种高温合金的定向凝固装置及其使用方法
JP2014212182A (ja) * 2013-04-18 2014-11-13 三菱電機株式会社 熱伝導性接合材及び熱伝導性接合材を用いた半導体装置
CN104140786B (zh) * 2013-05-09 2017-04-19 中国科学院理化技术研究所 一种复合相变储热材料
GB2514830B (en) * 2013-06-06 2016-04-06 Isis Innovation Pulse tube cooler
JP6023885B2 (ja) * 2013-06-19 2016-11-09 アモグリーンテック カンパニー リミテッド ハイブリッド断熱シートおよびこれを備えた電子機器
US10079160B1 (en) 2013-06-21 2018-09-18 Hrl Laboratories, Llc Surface mount package for semiconductor devices with embedded heat spreaders
US20150204625A1 (en) * 2013-10-09 2015-07-23 United Technologies Corporation High temperature heat transfer interface
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
US20150176915A1 (en) * 2013-12-19 2015-06-25 Shankar Krishnan Interfacial thermal transfer structure
JP2015130375A (ja) * 2014-01-06 2015-07-16 富士通株式会社 熱伝導シートおよび電子装置
US9615486B2 (en) * 2014-03-26 2017-04-04 General Electric Company Thermal interface devices
FR3023975A1 (fr) * 2014-07-18 2016-01-22 Thales Sa Dispositif d'interface thermique avec joint microporeux capable d'empecher la migration de graisse thermique
US9337124B1 (en) * 2014-11-04 2016-05-10 Hrl Laboratories, Llc Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers
US11060805B2 (en) * 2014-12-12 2021-07-13 Teledyne Scientific & Imaging, Llc Thermal interface material system
US9385083B1 (en) 2015-05-22 2016-07-05 Hrl Laboratories, Llc Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
CN105038716B (zh) * 2015-07-03 2018-11-16 中国科学院理化技术研究所 一种各向异性导热材料及其制备方法
CN105138725A (zh) * 2015-07-21 2015-12-09 厦门大学 一种制备热整流元器件的方法
US10026672B1 (en) 2015-10-21 2018-07-17 Hrl Laboratories, Llc Recursive metal embedded chip assembly
US9508652B1 (en) 2015-11-24 2016-11-29 Hrl Laboratories, Llc Direct IC-to-package wafer level packaging with integrated thermal heat spreaders
CN106052452A (zh) * 2016-06-03 2016-10-26 清华大学 一种基于低熔点金属相变材料的复合式相变热沉
CN108251063B (zh) * 2016-12-28 2021-05-11 有研工程技术研究院有限公司 一种高性能复合相变材料及其制备方法
US10385469B2 (en) * 2017-09-11 2019-08-20 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal stress compensation bonding layers and power electronics assemblies incorporating the same
CN108192576B (zh) * 2017-12-05 2021-02-02 云南靖创液态金属热控技术研发有限公司 一种液态金属热界面材料及其制备方法和应用
US10292307B1 (en) * 2018-01-04 2019-05-14 Juniper Networks, Inc. Thermal heatsink
US10667433B2 (en) 2018-06-04 2020-05-26 International Business Machines Corporation Implementing contained thermal interface material for pluggable applications
US10950562B1 (en) 2018-11-30 2021-03-16 Hrl Laboratories, Llc Impedance-matched through-wafer transition using integrated heat-spreader technology
US11037860B2 (en) 2019-06-27 2021-06-15 International Business Machines Corporation Multi layer thermal interface material
US11774190B2 (en) 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions
CN112538336B (zh) * 2020-12-08 2021-10-12 中国科学院工程热物理研究所 一种液态金属固液耦合式多层热界面材料及其制备方法
US20220319954A1 (en) * 2021-03-31 2022-10-06 Texas Instruments Incorporated Package heat dissipation
DE102021129092A1 (de) 2021-11-09 2023-05-11 Rolls-Royce Deutschland Ltd & Co Kg Wärmeleitmatte
JP7282929B1 (ja) * 2022-01-07 2023-05-29 レノボ・シンガポール・プライベート・リミテッド 放熱構造の製造方法
WO2023168144A1 (en) * 2022-03-02 2023-09-07 Liquid Wire Inc. Thermal interface appliques
EP4300571A1 (en) * 2022-06-27 2024-01-03 Infineon Technologies Austria AG Power semiconductor module arrangement and method for forming the same
JP7397921B1 (ja) 2022-07-05 2023-12-13 レノボ・シンガポール・プライベート・リミテッド 放熱構造、および電子機器
JP7285993B1 (ja) * 2022-07-28 2023-06-02 レノボ・シンガポール・プライベート・リミテッド 放熱部品および電子機器
JP7362854B1 (ja) * 2022-07-28 2023-10-17 レノボ・シンガポール・プライベート・リミテッド 放熱構造および電子機器
CN115584447B (zh) * 2022-08-22 2023-11-14 中国有研科技集团有限公司 一种多尺度复合镓基金属热界面材料及其制备方法
JP7472224B1 (ja) 2022-10-05 2024-04-22 レノボ・シンガポール・プライベート・リミテッド 放熱構造、電子機器、および伝熱構造体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2628229A1 (de) * 1975-06-24 1977-01-20 Torres Silvestre Sanchez Katalytischer nachbrenner fuer die umwandlung von luftverunreinigenden gasen in nichtluftverunreinigende gase
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
US5198189A (en) * 1989-08-03 1993-03-30 International Business Machines Corporation Liquid metal matrix thermal paste
CA2018930C (en) * 1989-08-03 1999-11-09 Richard B. Booth Liquid metal matrix thermal paste
US5056706A (en) * 1989-11-20 1991-10-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
JPH04206555A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 電子機器の冷却装置
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
JPH07249717A (ja) * 1994-03-08 1995-09-26 Toho Kinzoku Kk 放熱基板材料
US6037658A (en) * 1997-10-07 2000-03-14 International Business Machines Corporation Electronic package with heat transfer means
US6301109B1 (en) 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
US6984685B2 (en) * 2000-04-05 2006-01-10 The Bergquist Company Thermal interface pad utilizing low melting metal with retention matrix
AU2002335883A1 (en) * 2002-02-06 2003-09-02 Parker Hannifin Corporation Thermal management materials having a phase change dispersion
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
JP2003332505A (ja) * 2002-05-15 2003-11-21 Fujitsu Ltd 冷却構造体および伝熱部材
US6665186B1 (en) * 2002-10-24 2003-12-16 International Business Machines Corporation Liquid metal thermal interface for an electronic module
WO2005053021A2 (en) * 2003-11-19 2005-06-09 Heat Technology, Inc. Thermal interface and method of making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11515231B2 (en) 2019-08-27 2022-11-29 Asustek Computer Inc. Coating method for liquid metal thermal grease and heat dissipation module

Also Published As

Publication number Publication date
EP1839468A1 (en) 2007-10-03
EP1839468A4 (en) 2011-06-08
JP2008527737A (ja) 2008-07-24
US20060157223A1 (en) 2006-07-20
US7219713B2 (en) 2007-05-22
CN100576988C (zh) 2009-12-30
CN101103658A (zh) 2008-01-09
WO2006078334A1 (en) 2006-07-27

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