TWI267178B - Flexible thermally enhanced chip-on-film (COF) package - Google Patents

Flexible thermally enhanced chip-on-film (COF) package

Info

Publication number
TWI267178B
TWI267178B TW094117086A TW94117086A TWI267178B TW I267178 B TWI267178 B TW I267178B TW 094117086 A TW094117086 A TW 094117086A TW 94117086 A TW94117086 A TW 94117086A TW I267178 B TWI267178 B TW I267178B
Authority
TW
Taiwan
Prior art keywords
connecting portion
cof
package
film
flexible substrate
Prior art date
Application number
TW094117086A
Other languages
Chinese (zh)
Other versions
TW200642060A (en
Inventor
Geng-Shin Shen
Kun-Hsien Tsai
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW094117086A priority Critical patent/TWI267178B/en
Priority to US11/202,820 priority patent/US20060208365A1/en
Application granted granted Critical
Publication of TWI267178B publication Critical patent/TWI267178B/en
Publication of TW200642060A publication Critical patent/TW200642060A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Abstract

A flexibly thermally enhanced chip-on-film (COF) package is disclosed. The COF package mainly includes a flexible substrate, a heat sink, a flip chip and a sealant. The flexible substrate has an input connecting portion, an output connecting portion and a flexible portion. The flip chip is disposed on an interior surface of the flexible substrate, and the heat sink is attached to an exterior surface of the flexible substrate. For example, the heat sink can be located at or adjacent to the input connecting portion such that the input connecting portion can be connected to a PCB with a shorted length. Also, it is easy to conduct heat to the input connecting portion.
TW094117086A 2005-03-17 2005-05-25 Flexible thermally enhanced chip-on-film (COF) package TWI267178B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094117086A TWI267178B (en) 2005-05-25 2005-05-25 Flexible thermally enhanced chip-on-film (COF) package
US11/202,820 US20060208365A1 (en) 2005-03-17 2005-08-12 Flip-chip-on-film package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094117086A TWI267178B (en) 2005-05-25 2005-05-25 Flexible thermally enhanced chip-on-film (COF) package

Publications (2)

Publication Number Publication Date
TWI267178B true TWI267178B (en) 2006-11-21
TW200642060A TW200642060A (en) 2006-12-01

Family

ID=38191775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117086A TWI267178B (en) 2005-03-17 2005-05-25 Flexible thermally enhanced chip-on-film (COF) package

Country Status (1)

Country Link
TW (1) TWI267178B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI604579B (en) * 2016-06-02 2017-11-01 南茂科技股份有限公司 Chip on film package structure
TWI824525B (en) * 2022-05-18 2023-12-01 頎邦科技股份有限公司 Tape able to prevent adhesive contamination and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103972201A (en) * 2013-01-30 2014-08-06 奇景光电股份有限公司 Package structure and display module
TWI664881B (en) * 2017-01-13 2019-07-01 日商村田製作所股份有限公司 Component module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI604579B (en) * 2016-06-02 2017-11-01 南茂科技股份有限公司 Chip on film package structure
TWI824525B (en) * 2022-05-18 2023-12-01 頎邦科技股份有限公司 Tape able to prevent adhesive contamination and manufacturing method thereof

Also Published As

Publication number Publication date
TW200642060A (en) 2006-12-01

Similar Documents

Publication Publication Date Title
WO2008105527A1 (en) Led device and illuminating apparatus
TW200631491A (en) Sandwiched thermal solution
TW200615501A (en) Thermal interface incorporating nanotubes
TW200711561A (en) Electronic apparatus and thermal dissipating module thereof
TW200614465A (en) Liquid metal thermal interface for an integrated circuit device
GB2475658B (en) Mainboard assembly including a package overlying a die directly attached to the mainboard
WO2007008342A3 (en) Thermal solution for portable electronic devices
TW200636956A (en) Heterogeneous thermal interface for cooling
TW200802782A (en) Chip module for complete power train
WO2006089033A3 (en) Led light module assembly
TW200631145A (en) A heat sink, an electronic component package, and a method of manufacturing a heat sink
WO2008119309A3 (en) Heat sink, and assembly or module unit comprising a heat sink
TW200635491A (en) Heat dissipater module and electronic device having the same
ATE476864T1 (en) COOLING ASSEMBLY
TW200729436A (en) Integrated circuit device
TW200719028A (en) Backlight module
TWI267178B (en) Flexible thermally enhanced chip-on-film (COF) package
SG128546A1 (en) Low cte substrates for use with low-k flip-chip package devices
TW200705582A (en) Semiconductor device and manufacturing method therefor
TW200802762A (en) Heat sink, electronic device, and tuner apparatus
TW200731490A (en) Chip assembly and method of manufacturing thereof
WO2008093549A1 (en) Substrate module
WO2004038795A3 (en) Thermal-conductive substrate package
TW200739862A (en) Module
TWI264127B (en) Chip package and substrate thereof