WO2008093549A1 - Substrate module - Google Patents

Substrate module Download PDF

Info

Publication number
WO2008093549A1
WO2008093549A1 PCT/JP2008/050627 JP2008050627W WO2008093549A1 WO 2008093549 A1 WO2008093549 A1 WO 2008093549A1 JP 2008050627 W JP2008050627 W JP 2008050627W WO 2008093549 A1 WO2008093549 A1 WO 2008093549A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
power circuit
region
resin case
substrate module
Prior art date
Application number
PCT/JP2008/050627
Other languages
French (fr)
Japanese (ja)
Inventor
Norio Sakae
Original Assignee
Daikin, Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin, Industries, Ltd. filed Critical Daikin, Industries, Ltd.
Publication of WO2008093549A1 publication Critical patent/WO2008093549A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires

Abstract

A use quantity of a sealant is reduced. A power module is provided with a power circuit board (10), and a resin case (30) having the power circuit board (10) arranged on an inner side. In the resin case (30), a partitioning wall (34) is formed to separate a region (A), which includes a portion whereupon the power circuit board (10) is arranged on the inner side of the resin case (30), from a region (B), which includes only a portion whereupon the power circuit board (10) is not arranged. The region (A) surrounded by the partitioning wall (34) is filled with a sealant (40) for sealing a bare chip and the like of the power circuit board (10).
PCT/JP2008/050627 2007-02-02 2008-01-18 Substrate module WO2008093549A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007024242A JP4315203B2 (en) 2007-02-02 2007-02-02 Board module
JP2007-024242 2007-02-02

Publications (1)

Publication Number Publication Date
WO2008093549A1 true WO2008093549A1 (en) 2008-08-07

Family

ID=39673862

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050627 WO2008093549A1 (en) 2007-02-02 2008-01-18 Substrate module

Country Status (2)

Country Link
JP (1) JP4315203B2 (en)
WO (1) WO2008093549A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023634A (en) * 2009-07-17 2011-02-03 Diamond Electric Mfg Co Ltd Block type power module and power conversion device
JP2011023635A (en) * 2009-07-17 2011-02-03 Diamond Electric Mfg Co Ltd Block type power module and power conversion device
JP2011023633A (en) * 2009-07-17 2011-02-03 Diamond Electric Mfg Co Ltd Block type power module and power conversion device
JP2018195714A (en) * 2017-05-17 2018-12-06 富士電機株式会社 Power semiconductor module and power semiconductor device
US11756868B2 (en) 2019-11-06 2023-09-12 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017022157A (en) * 2015-07-07 2017-01-26 カルソニックカンセイ株式会社 Power semiconductor device
JP2021052094A (en) 2019-09-25 2021-04-01 株式会社ミツバ driver

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784747U (en) * 1980-11-14 1982-05-25
JPH0634256U (en) * 1992-10-12 1994-05-06 株式会社三社電機製作所 Semiconductor module
JPH09120852A (en) * 1995-10-27 1997-05-06 Toshiba Corp Semiconductor device with connector built in case
JP2006186144A (en) * 2004-12-28 2006-07-13 Daikin Ind Ltd Power module and air-conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784747U (en) * 1980-11-14 1982-05-25
JPH0634256U (en) * 1992-10-12 1994-05-06 株式会社三社電機製作所 Semiconductor module
JPH09120852A (en) * 1995-10-27 1997-05-06 Toshiba Corp Semiconductor device with connector built in case
JP2006186144A (en) * 2004-12-28 2006-07-13 Daikin Ind Ltd Power module and air-conditioner

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023634A (en) * 2009-07-17 2011-02-03 Diamond Electric Mfg Co Ltd Block type power module and power conversion device
JP2011023635A (en) * 2009-07-17 2011-02-03 Diamond Electric Mfg Co Ltd Block type power module and power conversion device
JP2011023633A (en) * 2009-07-17 2011-02-03 Diamond Electric Mfg Co Ltd Block type power module and power conversion device
JP2018195714A (en) * 2017-05-17 2018-12-06 富士電機株式会社 Power semiconductor module and power semiconductor device
US11756868B2 (en) 2019-11-06 2023-09-12 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
JP2008192742A (en) 2008-08-21
JP4315203B2 (en) 2009-08-19

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