JPH09120852A - Semiconductor device with connector built in case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device which is convenient for users to use and which can easily be mounted in and demounted from a connector case, by forming a power element accommodation part and a connector accommodation part by a partitioning plate in the case, and pouring a potting agent only into the power element accommodation part for the purpose of securing the insulativeness. SOLUTION: In a case 304 a power element accommodation part 308 and a connector accommodation part 309 are formed by a partitioning plate 307. In the accommodation part 308 a power semiconductor element 303 is installed on the metal base 301 and a potting agent 310 is poured for the purpose of securing the insulating properties. In the case 304 of the other accommodation part 309 a connector 317 is installed and the element 303 and connector 317 are connected together through a conductor 312 which is provided as molding with the partitioning plate 307. Thus a semiconductor device is accomplished, which can easily be mounted in the connector 317 removably and allows the user to use conveniently.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a connector built in a case, which is convenient for a user to use.

[0002]

2. Description of the Related Art The appearance of a conventional high power semiconductor device is shown, for example, in FIG. 9 or FIG. FIG. 9 shows the power terminal 1
01 and the signal terminal 102 are drawn out on the surface of the semiconductor device body. As the signal terminal 102, a female faston terminal is attached to and electrically connected to a male terminal shown in the figure. The case is shown.

The known example shown in FIG. 9 is, for example, the document "Large Power 1700V IGBT" Toshiba Review 199.
3, Vol. 48, No. 12, p875-p878,
Or, "TOSHIBA IGBT DATA BOO
K 1995 "p28-p34.

In FIG. 10, the signal terminal 202 is erected on the side surface of the semiconductor device body as a pin terminal with respect to the power terminal 101, and is connected to the wiring of the printed board 203 by soldering.

The known example shown in FIG. 10 is disclosed, for example, in the document "Mitsubishi Intelligent Power Module", Mitsubishi Electric Technical Report, Vol. 67, No. 9, 1993, p107. However, in the embodiment shown in FIG. 9, when connecting with an external device, it is necessary to individually connect the necessary female Faston terminals to the corresponding male terminals, which is troublesome for the user. there were.
Further, in the embodiment of FIG. 10, once the pin terminals are soldered to the printed circuit board, it is difficult to replace them when the semiconductor device fails.

[0006]

SUMMARY OF THE INVENTION The present invention solves the problems described above, and a semiconductor device having a connector inside a case, which is convenient for the user to connect the signal line of the semiconductor device to an external device. The purpose is to provide.

[0007]

In order to achieve the above object,
A semiconductor device having a connector of the present invention built in a case comprises a power element housing portion and a connector housing portion, the power element housing portion surrounding a metal base and the metal base, and the power element housing portion and the power element housing portion. A case having a partition plate that forms a connector accommodating portion, at least one power semiconductor element having an electrode mounted on an insulating substrate on a metal base accommodated in the power element accommodating portion, and the insulation Power terminals fixed on a holder supported by a flexible substrate via a support, a potting agent injected into the case for ensuring insulation of the power semiconductor element, and a connector accommodating portion. A signal wiring connecting connector in which a main body is housed, mounted through the case and partially connected to the outside, and the power semiconductor element and the connector with the partition plate interposed therebetween. And connection means for connecting, more composed.

[0008]

DETAILED DESCRIPTION OF THE INVENTION A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of a semiconductor device in which the connector of the present invention is incorporated in a case, and FIG. 2 is a partial sectional view taken along the line II-II of FIG. 1, which will be described with reference to both figures. . A plurality of, for example, two insulating substrates 302 are mounted on the metal base 301, and a power semiconductor element 303 is mounted on each substrate 302.

The electrodes of the power semiconductor element 303 and the substrate 302 are connected to each other using bonding wires 320. The metal base 301 is surrounded by a case 304, and the power semiconductor element 303 is housed in the case. The case 304 forms a power semiconductor device housing 308 and a connector housing 309 using a partition plate 307. In the power semiconductor device housing 308, a plurality of power terminals 305 are fixed to a holder 306. Holder 30
6 is supported on the substrate 302 by a support 321.

A potting agent 310 is injected into the case 304 forming the power semiconductor device housing 308 to secure the insulation of the power semiconductor device 303. An epoxy resin 315 is further injected on the potting material 310 to increase the mechanical strength of the power terminals 305 and the holder 306.

The potting agent 3 is injected.
Only 10 and the epoxy resin 315 may be omitted. The signal wire connecting connector 317 is attached to a side wall of the case forming the connector housing 309, and a part of the connector 317 penetrates the case 304 to communicate with the outside.

The base of the partition slope 307 is a conductor 316.
Is molded to form an electrical connection portion between the power element storage portion 308 and the connector storage portion 309. Pins 311 and 312 are led out to the power device housing 308 and the connector housing 309, respectively, through the conductor 316 with the partition plate 307 interposed therebetween. The pin 311 is connected to the power semiconductor device unit 308 via a jumper wire 313.
, And the pins 312 are connected to the connectors 317 via jumper wires 314.

The connector 317 is exposed to the outside of the case 304, and a desired external device is accommodated through the connector 317 by inserting a plug matching the user's request from the outside into the connector 317. It can be connected to any of the power semiconductor elements 303 of section 308.

By using the partition plate 307,
In the connector housing 309, potting agent 310,
Since the epoxy resin 315 and the like do not enter, the connector 317 can be easily attached and detached.

The semiconductor element portion in the power element housing 308 has a potting agent 310 and an epoxy resin 3.
A material with high heat resistance is selected because 15 is heat-cured, but the connector 317 may be attached to the case 304 of the connector housing 309 after heat-cured, so the housing of the connector is made of a material with low heat resistance. Of course, commercially available connectors can be used. Next, a second embodiment of the semiconductor device of the present invention will be described with reference to the sectional view of FIG.

The same parts as those shown in FIG. 2 are designated by the same reference numerals, and the description thereof will be omitted. In the connector housing 309, the pin 312 and the outer lead 402 of the connector are electrically connected via the printed board 401.

FIG. 4 is a sectional view for explaining a third embodiment of the semiconductor device of the present invention. Pins and jumper wires shown in FIGS. 2 and 3 are omitted, and a lead wire 501 is provided on the partition plate 307. The substrate 302 and the connector 3 on which the terminals of this lead wire are directly passed and the power semiconductor element is mounted.
Connect to 17. In this case, an adhesive is applied to prevent a gap from being formed between the partition plate 307 and the lead wire 501.

The other structure is the same as that shown in FIG. 2, and the description of the structure is omitted. FIG. 5 is a sectional view illustrating a fourth embodiment of the semiconductor device of the present invention,
A flexible printed circuit board 601 may be used instead of the lead wire 501 shown in FIG.

The other structure is the same as that shown in FIG. 2, and the description of the structure is omitted. Also in this embodiment, in order to prevent a gap from being formed between the partition plate 307 and the flexible printed board 601, it is preferable to apply an adhesive.

FIG. 6 is a perspective view for explaining a fifth embodiment of the semiconductor device of the present invention. The connector 317 is attached to the case 304 at the side surface of the case as shown in FIGS. Not limited to this, it may be the upper surface of the connector storage portion 309 of the case 304.

FIG. 7 is a perspective view illustrating a fifth embodiment of the semiconductor device of the present invention, and FIG. 8 is a view of VIII in FIG.
FIG. 8 is a sectional view taken along line VIII. The main difference from the first embodiment shown in FIG. 2 is that a printed board 815 is housed inside the power device housing 308.
15 is that the control unit 816 and the protection circuit 817 are mounted.

The printed circuit board 815 has a support member 81.
Supported by 9. A potting agent 310 is provided inside the power device housing 308 to secure insulation between electrodes.
Store and heat cure. The power terminal 305 is arranged on a case 304 having a thickness. An upper lid 410 closes the upper surface of the power element housing 308.

A plug 819 is inserted into the connector 317 from the outside. Other configurations are shown in FIG. 2 or
The configuration is partially the same as that shown in FIG. 3, and the description of the configuration is omitted.

According to this aspect, since the number of signal terminals for power input and error signal output of the control unit 816 and the protection circuit 817 is increased, it is effective in simplifying the connection with the external device by forming a connector. .

[0025]

As described above, in the semiconductor device in which the connector of the present invention is built in the case, the case is divided by the partition plate, and the power element housing portion and the connector housing portion are divided into the power element housing portion. In order to secure the insulation between the electrodes, the potting agent is stored and heat-cured. Therefore,
Potting agent does not enter the connector storage section,
The connector can be easily stored in and removed from the case.

Further, since the electric element storage portion and the connector storage portion can be easily electrically connected to each other through the partition plate, there is no obstacle in disposing the connector in the connector storage portion. Absent.

Further, since the connector is housed in the connector housing portion after the thermosetting process of potting agent or the like in the power device housing portion, the connector housing is made of a material having low heat resistance. May be used, which has the advantage that the range of selection of materials is large.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a semiconductor device having a connector according to the present invention built in a case.

FIG. 2 is a partial cross-sectional view taken along the line II-II of FIG. 1, showing a first embodiment of the semiconductor device of the present invention.

FIG. 3 is a partial cross-sectional view taken along the line III-III of FIG. 1, showing a second embodiment of the semiconductor device of the present invention.

FIG. 4 is a partial cross-sectional view taken along the line IV-IV of FIG. 1, showing a third embodiment of the semiconductor device of the present invention.

FIG. 5 is a partial cross-sectional view taken along the line VV of FIG. 1 showing a fourth embodiment of the semiconductor device of the present invention.

FIG. 6 is an external perspective view showing a fifth embodiment of the semiconductor device of the present invention.

FIG. 7 is an external perspective view showing a sixth embodiment of the semiconductor device of the present invention.

FIG. 8 is a partial sectional view of the semiconductor device of the present invention taken along the line VIII-VIII shown in FIG.

FIG. 9 is a perspective view showing an example of a conventional high-power semiconductor device.

FIG. 10 is a perspective view showing another example of a conventional high-power semiconductor device.

[Explanation of symbols]

308 ... Power element storage section, 309 ... Connector storage section, 3
01 ... Metal base, 307 ... Partition plate, 303 ... Power semiconductor element, 305 ... Power terminal, 304 ... Case, 316
... conductor, 317 ... connector, 310 ... potting agent

Claims (6)

[Claims] 1. A power supply device housing part and a connector housing part, wherein the power device housing part encloses the metal base and the metal base, and forms a partition plate which forms the power device housing part and the connector housing part. A case, an electric power semiconductor element having at least one electrode mounted on an insulating substrate on a metal base housed in the power element housing, and supported on the insulating substrate via a support. A plurality of power terminals fixed on the holder, a potting agent injected into the case for ensuring insulation of the power semiconductor element, and a main body stored in the connector storage portion,
A signal wiring connecting connector that is mounted through the case and is partially connected to the outside; and a connecting means that connects the power semiconductor element and the connector with the partition plate interposed therebetween. A semiconductor device with a built-in connector inside the case. 2. A semiconductor device having a connector according to claim 1, wherein an epoxy resin is further injected on the potting agent injected into the power element housing portion. 3. The connecting means comprises a conductor molded in the partition plate, and a connecting wire for connecting the power semiconductor element and the connector through the conductor and sandwiching the partition plate. A semiconductor device having the connector according to claim 1 built in a case. 4. The connecting means penetrates through the partition plate,
The semiconductor device having the connector according to claim 1 built in a case, comprising a connection line connecting the power semiconductor element and the connector. 5. The connector according to claim 1, wherein the connecting means comprises a flexible printed circuit board that penetrates the partition plate and connects the power semiconductor element and the connector. Semiconductor device. 6. A semiconductor device having a connector according to claim 1, wherein a printed circuit board on which a control unit and a protection circuit are mounted is further housed in the power element housing unit. .