JP7397921B1 - 放熱構造、および電子機器 - Google Patents
放熱構造、および電子機器 Download PDFInfo
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- JP7397921B1 JP7397921B1 JP2022108640A JP2022108640A JP7397921B1 JP 7397921 B1 JP7397921 B1 JP 7397921B1 JP 2022108640 A JP2022108640 A JP 2022108640A JP 2022108640 A JP2022108640 A JP 2022108640A JP 7397921 B1 JP7397921 B1 JP 7397921B1
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- heating element
- heat dissipation
- heat
- dissipation structure
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 238000010438 heat treatment Methods 0.000 claims abstract description 65
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 44
- 239000011148 porous material Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 41
- 229910052802 copper Inorganic materials 0.000 abstract description 41
- 239000010949 copper Substances 0.000 abstract description 41
- 238000012546 transfer Methods 0.000 abstract description 9
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 description 14
- 238000012986 modification Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000004519 grease Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000013529 heat transfer fluid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
Description
12 携帯用情報機器(電子機器)
14 GPU(電気部品)
16 ベーパーチャンバ(放熱体)
21,40,44 銅板(放熱体)
21a,40a,44a 窪み部
22 サブストレート
24 ダイ
28 キャパシタ
30,42,46 メッシュ(多孔質材)
30a,42a,46a 発熱体当接範囲部
30b,42b,46b 発熱体非当接範囲部
32 液体金属
34 絶縁材
36 スポンジテープ(帯状粘着材)
38,48 粘着テープ(帯状粘着材)
Claims (8)
- 発熱する電気部品の放熱構造であって、
前記電気部品の表面に当接する多孔質材と、
前記多孔質材が嵌り込む窪み部を備え、前記電気部品の表面との間に前記多孔質材を挟持する放熱体と、
を有し、
前記多孔質材は、
伝熱性流体が含浸されていて、前記電気部品の表面に当接して受熱する発熱体当接範囲部と、
前記発熱体当接範囲部と連続して形成され、前記電気部品の表面と当接しない発熱体非当接範囲部と、
を備え、
前記発熱体非当接範囲部は帯状粘着材によって前記放熱体に固定されている
ことを特徴とする放熱構造。 - 請求項1に記載の放熱構造において、
前記発熱体非当接範囲部は前記発熱体当接範囲部から突出する形状であって、複数が対称位置に設けられており、
前記帯状粘着材は前記発熱体非当接範囲部を横断するように設けられている
ことを特徴とする放熱構造。 - 請求項1に記載の放熱構造において、
基板および該基板に実装された半導体チップを備え、
前記半導体チップはサブストレートおよびダイを備え、
前記電気部品は前記ダイである
ことを特徴とする放熱構造。 - 請求項3に記載の放熱構造において、
前記帯状粘着材はスポンジ状であり、前記ダイの周囲で前記放熱体と前記サブストレートとの間を塞いでいる
ことを特徴とする放熱構造。 - 請求項1に記載の放熱構造において、
前記伝熱性流体は液体金属である
ことを特徴とする放熱構造。 - 請求項1に記載の放熱構造において、
前記多孔質材はメッシュである
ことを特徴とする放熱構造。 - 請求項1に記載の放熱構造において、
前記多孔質材は金属材であり、少なくとも表面がニッケルである
ことを特徴とする放熱構造。 - 放熱構造を備える電子機器であって、
発熱する電気部品と、
前記電気部品の表面に当接する多孔質材と、
前記多孔質材が嵌り込む窪み部を備え、前記電気部品の表面との間に前記多孔質材を挟持する放熱体と、
を有し、
前記多孔質材は、
伝熱性流体が含浸されていて、前記電気部品の表面に当接して受熱する発熱体当接範囲部と、
前記発熱体当接範囲部と連続して形成され、前記電気部品の表面と当接しない発熱体非当接範囲部と、
を備え、
前記発熱体非当接範囲部が帯状粘着材によって前記放熱体に固定されている
ことを特徴とする電子機器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022108640A JP7397921B1 (ja) | 2022-07-05 | 2022-07-05 | 放熱構造、および電子機器 |
EP23176804.5A EP4303914A1 (en) | 2022-07-05 | 2023-06-01 | Heat radiating structure and electronic apparatus |
US18/332,816 US20240014098A1 (en) | 2022-07-05 | 2023-06-12 | Heat radiating structure and electronic apparatus |
CN202310806804.XA CN117355085A (zh) | 2022-07-05 | 2023-07-03 | 散热构造以及电子设备 |
KR1020230086554A KR20240005604A (ko) | 2022-07-05 | 2023-07-04 | 방열 구조물 및 전자 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022108640A JP7397921B1 (ja) | 2022-07-05 | 2022-07-05 | 放熱構造、および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7397921B1 true JP7397921B1 (ja) | 2023-12-13 |
JP2024007261A JP2024007261A (ja) | 2024-01-18 |
Family
ID=86657028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022108640A Active JP7397921B1 (ja) | 2022-07-05 | 2022-07-05 | 放熱構造、および電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240014098A1 (ja) |
EP (1) | EP4303914A1 (ja) |
JP (1) | JP7397921B1 (ja) |
KR (1) | KR20240005604A (ja) |
CN (1) | CN117355085A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003332505A (ja) | 2002-05-15 | 2003-11-21 | Fujitsu Ltd | 冷却構造体および伝熱部材 |
JP2008527737A (ja) | 2005-01-18 | 2008-07-24 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 冷却用複合熱インタフェース |
JP2019079914A (ja) | 2017-10-24 | 2019-05-23 | 株式会社豊田中央研究所 | 半導体モジュールおよび半導体モジュールの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4233645A (en) * | 1978-10-02 | 1980-11-11 | International Business Machines Corporation | Semiconductor package with improved conduction cooling structure |
JPH08508611A (ja) * | 1993-03-31 | 1996-09-10 | ユニシス・コーポレイション | 液体金属熱伝導部材およびそれを組入れた集積回路パッケージ |
US6665186B1 (en) | 2002-10-24 | 2003-12-16 | International Business Machines Corporation | Liquid metal thermal interface for an electronic module |
US8477500B2 (en) * | 2010-05-25 | 2013-07-02 | General Electric Company | Locking device and method for making the same |
US11832419B2 (en) * | 2019-12-20 | 2023-11-28 | Intel Corporation | Full package vapor chamber with IHS |
-
2022
- 2022-07-05 JP JP2022108640A patent/JP7397921B1/ja active Active
-
2023
- 2023-06-01 EP EP23176804.5A patent/EP4303914A1/en active Pending
- 2023-06-12 US US18/332,816 patent/US20240014098A1/en active Pending
- 2023-07-03 CN CN202310806804.XA patent/CN117355085A/zh active Pending
- 2023-07-04 KR KR1020230086554A patent/KR20240005604A/ko unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003332505A (ja) | 2002-05-15 | 2003-11-21 | Fujitsu Ltd | 冷却構造体および伝熱部材 |
JP2008527737A (ja) | 2005-01-18 | 2008-07-24 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 冷却用複合熱インタフェース |
JP2019079914A (ja) | 2017-10-24 | 2019-05-23 | 株式会社豊田中央研究所 | 半導体モジュールおよび半導体モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20240005604A (ko) | 2024-01-12 |
US20240014098A1 (en) | 2024-01-11 |
CN117355085A (zh) | 2024-01-05 |
JP2024007261A (ja) | 2024-01-18 |
EP4303914A1 (en) | 2024-01-10 |
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