JP7301948B1 - 放熱構造、放熱構造の製造方法、および電子機器 - Google Patents
放熱構造、放熱構造の製造方法、および電子機器 Download PDFInfo
- Publication number
- JP7301948B1 JP7301948B1 JP2021213311A JP2021213311A JP7301948B1 JP 7301948 B1 JP7301948 B1 JP 7301948B1 JP 2021213311 A JP2021213311 A JP 2021213311A JP 2021213311 A JP2021213311 A JP 2021213311A JP 7301948 B1 JP7301948 B1 JP 7301948B1
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation structure
- grease
- liquid metal
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000000034 method Methods 0.000 title claims description 17
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 79
- 239000004519 grease Substances 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims description 38
- 230000004888 barrier function Effects 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 description 16
- 239000011810 insulating material Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 239000013013 elastic material Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26122—Auxiliary members for layer connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/26125—Reinforcing structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/29105—Gallium [Ga] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/83447—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
12 携帯用情報機器(電子機器)
16 ベーパーチャンバ(放熱体)
22 サブストレート
24 ダイ
24b 遠隔縁
24aa 中央部
24a 表面
26 基板
28 キャパシタ(電気素子)
30 液体金属
32 グリス(障囲体)
32a 排気隙間
34 絶縁材
36 弾性材
θ 角度間隔
θmax 最大間隔
Claims (8)
- 発熱する電気部品の放熱構造であって、
前記電気部品の表面に沿って設けられる放熱体と、
前記電気部品と前記放熱体との間に介在するように設けられる液体金属と、
前記電気部品と前記放熱体との間で押しつぶされた状態で介在し、前記液体金属を囲うように設けられる障囲体と、
基板および該基板に実装された半導体チップと、
を有し、
前記半導体チップはサブストレートおよびダイを備え、
前記電気部品は前記ダイであり、
前記障囲体には側方に開口する排気隙間が形成されている
ことを特徴とする放熱構造。 - 請求項1に記載の放熱構造において、
前記障囲体はグリスである
ことを特徴とする放熱構造。 - 請求項1または2に記載の放熱構造において、
前記サブストレートには1以上の電気素子が設けられており、
前記排気隙間は、前記ダイの中心を基準として前記電気素子の配置されている角度間隔が最も大きい範囲に設けられている
ことを特徴とする放熱構造。 - 請求項1~3のいずれか1項に記載の放熱構造において、
前記ダイの表面は中央部が周囲よりも盛り上がっている形状である
ことを特徴とする放熱構造。 - 請求項1~4のいずれか1項に記載の放熱構造を備える
ことを特徴とする電子機器。 - 発熱する電気部品の放熱構造の製造方法であって、
電気部品の表面の周囲にグリスを塗布するグリス塗布工程と、
前記電気部品の前記表面における前記グリスで囲まれた範囲に液体金属を塗布する液体金属塗布工程と、
放熱体を前記電気部品の表面に押し付けて前記グリスを押しつぶしながら前記液体金属を前記放熱体に接触させる放熱体接触工程と、
を有し、
前記グリス塗布工程では、前記放熱体接触工程で余分の空気を排出させる排気隙間を形成しておく
ことを特徴とする放熱構造の製造方法。 - 請求項6に記載の放熱構造の製造方法において、
前記液体金属塗布工程では、前記グリスとの間に隙間をもって前記液体金属を塗布する
ことを特徴とする放熱構造の製造方法。 - 請求項6または7に記載の放熱構造の製造方法において、
前記グリス塗布工程では、前記グリスをシルクスクリーンによって塗布する
ことを特徴とする放熱構造の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021213311A JP7301948B1 (ja) | 2021-12-27 | 2021-12-27 | 放熱構造、放熱構造の製造方法、および電子機器 |
US17/983,561 US12002733B2 (en) | 2021-12-27 | 2022-11-09 | Heat dissipation structure, manufacturing method for heat dissipation structure, and electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021213311A JP7301948B1 (ja) | 2021-12-27 | 2021-12-27 | 放熱構造、放熱構造の製造方法、および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7301948B1 true JP7301948B1 (ja) | 2023-07-03 |
JP2023098741A JP2023098741A (ja) | 2023-07-11 |
Family
ID=86897116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021213311A Active JP7301948B1 (ja) | 2021-12-27 | 2021-12-27 | 放熱構造、放熱構造の製造方法、および電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US12002733B2 (ja) |
JP (1) | JP7301948B1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001325576A (ja) | 2000-05-16 | 2001-11-22 | Dainippon Printing Co Ltd | Icカード |
JP2004311905A (ja) | 2003-04-10 | 2004-11-04 | Denso Corp | 半導体モジュール実装構造 |
JP2006528434A (ja) | 2003-05-13 | 2006-12-14 | パーカー−ハニフイン・コーポレーシヨン | 熱管理材料 |
JP2009290118A (ja) | 2008-05-30 | 2009-12-10 | Toshiba Corp | 電子機器 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03148199A (ja) * | 1989-11-02 | 1991-06-24 | Uchu Tsushin Kiso Gijutsu Kenkyusho:Kk | 実装ケースの伝熱構造 |
US6108208A (en) * | 1997-12-08 | 2000-08-22 | Unisys Corporation | Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules |
US6665186B1 (en) | 2002-10-24 | 2003-12-16 | International Business Machines Corporation | Liquid metal thermal interface for an electronic module |
WO2005024940A1 (ja) * | 2003-08-28 | 2005-03-17 | Fujitsu Limited | パッケージ構造、それを搭載したプリント基板、並びに、かかるプリント基板を有する電子機器 |
US7160758B2 (en) * | 2004-03-31 | 2007-01-09 | Intel Corporation | Electronic packaging apparatus and method |
US7663227B2 (en) * | 2005-10-11 | 2010-02-16 | Macris Chris G | Liquid metal thermal interface material system |
US20080068803A1 (en) * | 2006-09-18 | 2008-03-20 | Shyh-Ming Chen | Heat dissipating device holder structure with a thin film thermal conducting medium coating |
US11031319B2 (en) * | 2016-10-06 | 2021-06-08 | Hewlett-Packard Development Company, L.P. | Thermal interface materials with adhesive selant for electronic components |
US10319609B2 (en) * | 2017-06-21 | 2019-06-11 | International Business Machines Corporation | Adhesive-bonded thermal interface structures |
US10912224B2 (en) * | 2018-05-30 | 2021-02-02 | Amazon Technologies, Inc. | Thermally conductive vibration isolating connector |
US20190393118A1 (en) * | 2018-06-22 | 2019-12-26 | Intel Corporation | Semiconductor package with sealed thermal interface cavity with low thermal resistance liquid thermal interface material |
US11177193B2 (en) * | 2019-05-01 | 2021-11-16 | Yuci Shen | Reservoir structure and system forming gap for liquid thermal interface material |
US10643924B1 (en) * | 2019-05-01 | 2020-05-05 | Yuci Shen | Heat-dissipating lid with reservoir structure and associated lidded flip chip package allowing for liquid thermal interfacing materials |
TWI698287B (zh) * | 2019-08-27 | 2020-07-11 | 華碩電腦股份有限公司 | 液態金屬散熱膏塗佈方法及使用液態金屬散熱膏的散熱模組 |
CN113113369A (zh) * | 2020-01-13 | 2021-07-13 | 华为技术有限公司 | 散热结构及其制造方法、芯片结构以及电子设备 |
TWI760232B (zh) * | 2021-05-24 | 2022-04-01 | 矽品精密工業股份有限公司 | 電子封裝件及其散熱結構與製法 |
CN115003102B (zh) * | 2021-10-27 | 2023-05-23 | 荣耀终端有限公司 | 电子元件散热结构的制造方法、散热结构及电子设备 |
-
2021
- 2021-12-27 JP JP2021213311A patent/JP7301948B1/ja active Active
-
2022
- 2022-11-09 US US17/983,561 patent/US12002733B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001325576A (ja) | 2000-05-16 | 2001-11-22 | Dainippon Printing Co Ltd | Icカード |
JP2004311905A (ja) | 2003-04-10 | 2004-11-04 | Denso Corp | 半導体モジュール実装構造 |
JP2006528434A (ja) | 2003-05-13 | 2006-12-14 | パーカー−ハニフイン・コーポレーシヨン | 熱管理材料 |
JP2009290118A (ja) | 2008-05-30 | 2009-12-10 | Toshiba Corp | 電子機器 |
Also Published As
Publication number | Publication date |
---|---|
US12002733B2 (en) | 2024-06-04 |
JP2023098741A (ja) | 2023-07-11 |
US20230207419A1 (en) | 2023-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20150097281A1 (en) | Semiconductor device | |
US8908373B2 (en) | Cooling structure for an electronic component and electronic instrument | |
TW201437590A (zh) | 具整合式蒸汽腔之散熱器 | |
JP2023118943A (ja) | 半導体装置、絶縁シート、及び半導体装置の製造方法 | |
CN213907324U (zh) | 具有防电磁波干扰的散热装置 | |
JPH10260230A (ja) | 発熱体の冷却装置 | |
JP2006245356A (ja) | 電子デバイスの冷却装置 | |
TWM452595U (zh) | 薄型散熱裝置與使用該薄型散熱裝置之裝置結構 | |
JP7301948B1 (ja) | 放熱構造、放熱構造の製造方法、および電子機器 | |
KR20050019232A (ko) | 방열시트 및 그 제조방법 | |
JP2019192755A (ja) | 基板放熱構造 | |
KR101044351B1 (ko) | 히트 쿨러 | |
CN215266269U (zh) | 一种电路板组件、散热器和电子设备 | |
JP2008091817A (ja) | 電子装置及び照明器具 | |
US7188667B2 (en) | Liquid cooling structure for electronic device | |
JP7242824B1 (ja) | 放熱構造および電子機器 | |
JP4482824B2 (ja) | 両面冷却型半導体装置 | |
JP7397921B1 (ja) | 放熱構造、および電子機器 | |
JP2022072518A (ja) | 放熱構造体 | |
JP7472224B1 (ja) | 放熱構造、電子機器、および伝熱構造体 | |
JP7282929B1 (ja) | 放熱構造の製造方法 | |
CN217336236U (zh) | 均温散热装置的结构 | |
CN115458488A (zh) | 散热构造及电子设备 | |
WO2023071705A1 (zh) | 散热组件、车辆模块及车辆 | |
TWM652149U (zh) | 電子裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211227 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20220818 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230419 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230613 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230621 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7301948 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |