TW200632628A - Heat dissipation fins structure and manufacturing method thereof - Google Patents

Heat dissipation fins structure and manufacturing method thereof

Info

Publication number
TW200632628A
TW200632628A TW094106364A TW94106364A TW200632628A TW 200632628 A TW200632628 A TW 200632628A TW 094106364 A TW094106364 A TW 094106364A TW 94106364 A TW94106364 A TW 94106364A TW 200632628 A TW200632628 A TW 200632628A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation fins
manufacturing
metal
heat
Prior art date
Application number
TW094106364A
Other languages
Chinese (zh)
Inventor
Ming-Hang Hwang
Yu-Chiang Cheng
Chao-Yi Chen
Ping-Feng Lee
Hsin-Lung Kuo
Bin Wei Lee
Wei Chung Hsiao
Original Assignee
Mitac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp
Priority to TW094106364A priority Critical patent/TW200632628A/en
Priority to JP2006027577A priority patent/JP2006245560A/en
Priority to DE102006009504A priority patent/DE102006009504A1/en
Publication of TW200632628A publication Critical patent/TW200632628A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This invention discloses a manufacturing method and the structure for heat dissipation fins. This heat dissipation fins structure includes a conjunctional bulk and several heat dissipation fins. The heat dissipation fins are often used in conducting the heat from chip. The heat dissipation fins and the conjunctional bulk can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.
TW094106364A 2005-03-02 2005-03-02 Heat dissipation fins structure and manufacturing method thereof TW200632628A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094106364A TW200632628A (en) 2005-03-02 2005-03-02 Heat dissipation fins structure and manufacturing method thereof
JP2006027577A JP2006245560A (en) 2005-03-02 2006-02-03 Structure of heat dissipation fin and its manufacturing process
DE102006009504A DE102006009504A1 (en) 2005-03-02 2006-02-27 Component module with cooling fins consisting of connector and numerous cooling fins and made of heat conductive materials containing metal and crystalline carbon with high heat conductive coefficient

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106364A TW200632628A (en) 2005-03-02 2005-03-02 Heat dissipation fins structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
TW200632628A true TW200632628A (en) 2006-09-16

Family

ID=36848332

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106364A TW200632628A (en) 2005-03-02 2005-03-02 Heat dissipation fins structure and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP2006245560A (en)
DE (1) DE102006009504A1 (en)
TW (1) TW200632628A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019376A1 (en) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Power radiator for e.g. insulated gate bipolar transistor component of inverter, has cooling plate, where one set of fins exhibits heat conductive material different from other set of fins and ends of fins are inserted into cooling plate
US20080298021A1 (en) * 2007-05-31 2008-12-04 Ali Ihab A Notebook computer with hybrid diamond heat spreader
US9524917B2 (en) * 2014-04-23 2016-12-20 Optiz, Inc. Chip level heat dissipation using silicon
IT201800005278A1 (en) * 2018-05-11 2019-11-11 Thermal slopes.

Also Published As

Publication number Publication date
JP2006245560A (en) 2006-09-14
DE102006009504A1 (en) 2006-09-07

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