TW200632128A - Heat dissipation metal of surface plating film structure and manufacturing method thereof - Google Patents
Heat dissipation metal of surface plating film structure and manufacturing method thereofInfo
- Publication number
- TW200632128A TW200632128A TW094106361A TW94106361A TW200632128A TW 200632128 A TW200632128 A TW 200632128A TW 094106361 A TW094106361 A TW 094106361A TW 94106361 A TW94106361 A TW 94106361A TW 200632128 A TW200632128 A TW 200632128A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation metal
- surface plating
- plating film
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
This invention discloses a manufacturing method and the structure for surface plating film on heat dissipation metal. This surface plating film structure on heat dissipation metal includes a heat dissipation metal and a film. The heat dissipation metal of surface plating film structure is often used in dissipation the heat from the electronics device. The film is composed of a bracket structure of carbon element which has high thermal conductivity so as to improve the heat dissipation efficiency of heat dissipation metal. The corresponding manufacturing method for this film can be made with chemical vapor deposition, physical vapor deposition or the other materials preparation method.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094106361A TW200632128A (en) | 2005-03-02 | 2005-03-02 | Heat dissipation metal of surface plating film structure and manufacturing method thereof |
JP2006027578A JP2006245561A (en) | 2005-03-02 | 2006-02-03 | Thin film structure on heat dissipation metal surface and its production process |
DE200610007527 DE102006007527A1 (en) | 2005-03-02 | 2006-02-16 | Coated metal element for cooler of electronic installation consisting of at least one metal element and one coating formed of crystalline carbon with high thermal conductivity coefficient |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094106361A TW200632128A (en) | 2005-03-02 | 2005-03-02 | Heat dissipation metal of surface plating film structure and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200632128A true TW200632128A (en) | 2006-09-16 |
Family
ID=36848306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094106361A TW200632128A (en) | 2005-03-02 | 2005-03-02 | Heat dissipation metal of surface plating film structure and manufacturing method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006245561A (en) |
DE (1) | DE102006007527A1 (en) |
TW (1) | TW200632128A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105386003A (en) * | 2015-12-02 | 2016-03-09 | 哈尔滨工业大学 | Preparation method for three-dimensional structure graphene reinforced copper matrix composite material |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160021788A1 (en) * | 2014-07-16 | 2016-01-21 | General Electric Company | Electronic device assembly |
-
2005
- 2005-03-02 TW TW094106361A patent/TW200632128A/en unknown
-
2006
- 2006-02-03 JP JP2006027578A patent/JP2006245561A/en active Pending
- 2006-02-16 DE DE200610007527 patent/DE102006007527A1/en not_active Ceased
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105386003A (en) * | 2015-12-02 | 2016-03-09 | 哈尔滨工业大学 | Preparation method for three-dimensional structure graphene reinforced copper matrix composite material |
CN105386003B (en) * | 2015-12-02 | 2018-01-30 | 哈尔滨工业大学 | A kind of preparation method of three-dimensional structure graphene enhancing Cu-base composites |
Also Published As
Publication number | Publication date |
---|---|
DE102006007527A1 (en) | 2006-09-07 |
JP2006245561A (en) | 2006-09-14 |
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