TW200632268A - Dissipation heat pipe structure and manufacturing method thereof (I) - Google Patents

Dissipation heat pipe structure and manufacturing method thereof (I)

Info

Publication number
TW200632268A
TW200632268A TW094106363A TW94106363A TW200632268A TW 200632268 A TW200632268 A TW 200632268A TW 094106363 A TW094106363 A TW 094106363A TW 94106363 A TW94106363 A TW 94106363A TW 200632268 A TW200632268 A TW 200632268A
Authority
TW
Taiwan
Prior art keywords
heat pipe
dissipation heat
manufacturing
metal
pipe structure
Prior art date
Application number
TW094106363A
Other languages
Chinese (zh)
Inventor
Ming-Hang Hwang
Yu-Chiang Cheng
Chao-Yi Chen
Ping-Feng Lee
Hsin-Lung Kuo
Bin Wei Lee
Wei Chung Hsiao
Original Assignee
Mitac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp
Priority to TW094106363A priority Critical patent/TW200632268A/en
Priority to DE200610003755 priority patent/DE102006003755A1/en
Priority to JP2006047851A priority patent/JP2006245569A/en
Publication of TW200632268A publication Critical patent/TW200632268A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

This invention discloses a manufacturing method and the structure for a dissipation heat pipe. This dissipation heat pipe includes a hollow closed pipe, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.
TW094106363A 2005-03-02 2005-03-02 Dissipation heat pipe structure and manufacturing method thereof (I) TW200632268A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094106363A TW200632268A (en) 2005-03-02 2005-03-02 Dissipation heat pipe structure and manufacturing method thereof (I)
DE200610003755 DE102006003755A1 (en) 2005-03-02 2006-01-25 Heat-radiation pipe structure for semiconductor chip, has tubular element including carbon coating having diamond structure
JP2006047851A JP2006245569A (en) 2005-03-02 2006-02-24 Heat dissipation conduit structure for semiconductor chip and its production process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106363A TW200632268A (en) 2005-03-02 2005-03-02 Dissipation heat pipe structure and manufacturing method thereof (I)

Publications (1)

Publication Number Publication Date
TW200632268A true TW200632268A (en) 2006-09-16

Family

ID=36934022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106363A TW200632268A (en) 2005-03-02 2005-03-02 Dissipation heat pipe structure and manufacturing method thereof (I)

Country Status (3)

Country Link
JP (1) JP2006245569A (en)
DE (1) DE102006003755A1 (en)
TW (1) TW200632268A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100139885A1 (en) * 2008-12-09 2010-06-10 Renewable Thermodynamics, Llc Sintered diamond heat exchanger apparatus
WO2019123020A1 (en) * 2017-12-19 2019-06-27 Panasonic Intellectual Property Management Co., Ltd. Diamond-coated composite heat sinks for high-power laser systems

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6483683A (en) * 1987-09-25 1989-03-29 Toshiba Corp Production of cylindrical part by electrocasting
JPH06129784A (en) * 1992-10-20 1994-05-13 Furukawa Electric Co Ltd:The Cooler for functionally gradient material plate
JP2001010874A (en) * 1999-03-27 2001-01-16 Nippon Hybrid Technologies Kk Production of composite material of inorganic material with metal containing aluminum and product related to the same
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
KR20030065686A (en) * 2002-01-30 2003-08-09 삼성전기주식회사 Heat pipe and method thereof
JP3867632B2 (en) * 2002-07-22 2007-01-10 住友電気工業株式会社 Conduit for fluid flow path and heat exchanger provided with the conduit

Also Published As

Publication number Publication date
JP2006245569A (en) 2006-09-14
DE102006003755A1 (en) 2006-09-21

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