TW200633164A - Chip heat dissipation system and manufacturing method and structure of heat dissipation device thereof - Google Patents

Chip heat dissipation system and manufacturing method and structure of heat dissipation device thereof

Info

Publication number
TW200633164A
TW200633164A TW094106354A TW94106354A TW200633164A TW 200633164 A TW200633164 A TW 200633164A TW 094106354 A TW094106354 A TW 094106354A TW 94106354 A TW94106354 A TW 94106354A TW 200633164 A TW200633164 A TW 200633164A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
heat
chip
dissipation device
manufacturing
Prior art date
Application number
TW094106354A
Other languages
Chinese (zh)
Other versions
TWI283052B (en
Inventor
Ming-Hang Hwang
Yu-Chiang Cheng
Chao-Yi Chen
Ping-Feng Lee
Hsin-Lung Kuo
Bin Wei Lee
Wei Chung Hsiao
Original Assignee
Mitac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp
Priority to TW94106354A priority Critical patent/TWI283052B/en
Priority to DE200610004636 priority patent/DE102006004636A1/en
Priority to JP2006043032A priority patent/JP2006245568A/en
Publication of TW200633164A publication Critical patent/TW200633164A/en
Application granted granted Critical
Publication of TWI283052B publication Critical patent/TWI283052B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/14—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes molded
    • F28F2255/143—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes molded injection molded
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This invention discloses a chip heat dissipation system for chip heat dissipation and a manufacturing method and structure of heat dissipation device thereof. Said chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. Said heat dissipation device is used for receiving a waste heat from said chip, and said heat dissipation device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element; said heat exchange device is used for discharging said waste heat; said pipes are used for connecting at least two joints of said heat dissipation device and said heat exchange device; and said pump assembly device is used for circulating a fluid between said heat dissipation device and said heat exchange device by said pipes. Said bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency. Said manufacturing method for said thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, melting or the other materials preparation method. The bracket structure of carbon element can coat on said metal material surface and also can be mixed into said metal material.
TW94106354A 2005-03-02 2005-03-02 Chip heat dissipation system and manufacturing method and structure of heat dissipation device thereof TWI283052B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW94106354A TWI283052B (en) 2005-03-02 2005-03-02 Chip heat dissipation system and manufacturing method and structure of heat dissipation device thereof
DE200610004636 DE102006004636A1 (en) 2005-03-02 2006-01-31 Cooling system for electronic microchips has a heat sink, a heat exchanger and a pump to circulate a liquid between the heat sink and the heat exchanger via connection tubes
JP2006043032A JP2006245568A (en) 2005-03-02 2006-02-20 System for cooling semiconductor chip, and structure and manufacturing method of cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94106354A TWI283052B (en) 2005-03-02 2005-03-02 Chip heat dissipation system and manufacturing method and structure of heat dissipation device thereof

Publications (2)

Publication Number Publication Date
TW200633164A true TW200633164A (en) 2006-09-16
TWI283052B TWI283052B (en) 2007-06-21

Family

ID=36848285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94106354A TWI283052B (en) 2005-03-02 2005-03-02 Chip heat dissipation system and manufacturing method and structure of heat dissipation device thereof

Country Status (3)

Country Link
JP (1) JP2006245568A (en)
DE (1) DE102006004636A1 (en)
TW (1) TWI283052B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080298021A1 (en) * 2007-05-31 2008-12-04 Ali Ihab A Notebook computer with hybrid diamond heat spreader
EP2056345A1 (en) * 2007-11-02 2009-05-06 Plansee Se Heat sink module for electronic components or circuits and method for its manufacture
JP5259559B2 (en) * 2009-11-30 2013-08-07 株式会社ティラド heatsink
CN110798965B (en) * 2019-11-13 2022-10-14 重庆大学 Controllable active fluid heat dissipation system of electronic component integrated on PCB

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11126870A (en) * 1997-10-21 1999-05-11 Denso Corp Heat sink with integrated fin and production thereof
JP2001024372A (en) * 1999-07-12 2001-01-26 Matsushita Electric Ind Co Ltd Cooling device and electronic equipment using the same
JP2001339022A (en) * 1999-12-24 2001-12-07 Ngk Insulators Ltd Heat sink material and its manufacturing method
AT7382U1 (en) * 2003-03-11 2005-02-25 Plansee Ag HEAT SINK WITH HIGH HEAT-CONDUCTIVITY
JP2005045003A (en) * 2003-07-22 2005-02-17 Matsushita Electric Ind Co Ltd Radiator

Also Published As

Publication number Publication date
TWI283052B (en) 2007-06-21
JP2006245568A (en) 2006-09-14
DE102006004636A1 (en) 2006-09-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees