WO2006019219A3 - Cooling apparatus of looped heat pipe structure - Google Patents

Cooling apparatus of looped heat pipe structure Download PDF

Info

Publication number
WO2006019219A3
WO2006019219A3 PCT/KR2005/001827 KR2005001827W WO2006019219A3 WO 2006019219 A3 WO2006019219 A3 WO 2006019219A3 KR 2005001827 W KR2005001827 W KR 2005001827W WO 2006019219 A3 WO2006019219 A3 WO 2006019219A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling apparatus
heat pipe
pipe structure
wick
looped heat
Prior art date
Application number
PCT/KR2005/001827
Other languages
French (fr)
Other versions
WO2006019219A2 (en
Inventor
Kyo-Seok Chun
Original Assignee
Thermalforce
Kyo-Seok Chun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalforce, Kyo-Seok Chun filed Critical Thermalforce
Priority to US11/660,480 priority Critical patent/US20070284088A1/en
Publication of WO2006019219A2 publication Critical patent/WO2006019219A2/en
Publication of WO2006019219A3 publication Critical patent/WO2006019219A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A coolant phase changeable cooling apparatus using a capillary action is provided. The cooling apparatus prevents a generation of bubbles inside a wick of an evaporator (100) or an inverse flow of a vaporized gaseous coolant through a wick. Also, a thermal contact area can be widened by using at least one groove of a gaseous coolant flow passage unit (139). Based on these provided effects, cooling efficiency of the cooling apparatus can be improved.
PCT/KR2005/001827 2004-08-18 2005-06-15 Cooling apparatus of looped heat pipe structure WO2006019219A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/660,480 US20070284088A1 (en) 2004-08-18 2005-06-15 Cooling Apparatus of Looped Heat Pipe Structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2004-0065102 2004-08-18
KR20040065102 2004-08-18

Publications (2)

Publication Number Publication Date
WO2006019219A2 WO2006019219A2 (en) 2006-02-23
WO2006019219A3 true WO2006019219A3 (en) 2006-11-23

Family

ID=35907807

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2005/001827 WO2006019219A2 (en) 2004-08-18 2005-06-15 Cooling apparatus of looped heat pipe structure

Country Status (3)

Country Link
US (1) US20070284088A1 (en)
KR (1) KR100623641B1 (en)
WO (1) WO2006019219A2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7848624B1 (en) * 2004-10-25 2010-12-07 Alliant Techsystems Inc. Evaporator for use in a heat transfer system
CN100445685C (en) * 2007-07-17 2008-12-24 山东省科学院能源研究所 Compound heat-exchanger
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
WO2010058520A1 (en) * 2008-11-18 2010-05-27 日本電気株式会社 Boiling and cooling device
JP2010243035A (en) * 2009-04-03 2010-10-28 Sony Corp Heat transport device, electronic apparatus and method of manufacturing the heat transport device
KR101054092B1 (en) * 2009-09-25 2011-08-03 잘만테크 주식회사 Evaporator for Loop Heat Pipe System
CN102834688B (en) * 2010-03-29 2015-07-15 日本电气株式会社 Phase change cooler and electronic equipment provided with same
EP2568789B1 (en) * 2011-09-06 2014-04-16 ABB Research Ltd. Heat exchanger
JP6197651B2 (en) * 2012-01-04 2017-09-20 日本電気株式会社 Cooling system
KR20130096045A (en) * 2012-02-21 2013-08-29 엘지전자 주식회사 Porous metal structure and fabrication method thereof
TW201346500A (en) * 2012-05-02 2013-11-16 Microtips Electronics Co Ltd Heat dissipation device
JPWO2014049805A1 (en) * 2012-09-28 2016-08-22 株式会社日立製作所 COOLING SYSTEM AND ELECTRIC DEVICE USING THE SAME
EP3176532B1 (en) * 2014-07-29 2022-07-20 Kyocera Corporation Heat exchanger
US10729040B2 (en) * 2015-09-14 2020-07-28 Mitsubishi Electric Corporation Cooler, power conversion apparatus, and cooling system
JP6560425B1 (en) * 2018-11-09 2019-08-14 古河電気工業株式会社 heat pipe
JP7271170B2 (en) * 2018-12-27 2023-05-11 川崎重工業株式会社 Evaporator and loop heat pipe
CN112304138B (en) * 2019-08-02 2022-07-26 营邦企业股份有限公司 Loop type thermosiphon heat sink
KR102347506B1 (en) * 2020-03-09 2022-01-06 효성중공업 주식회사 Evaporating apparatus for cooling
TWI719884B (en) * 2020-04-13 2021-02-21 萬在工業股份有限公司 Gravity-type high-efficiency heat-exchange device
US11326836B1 (en) * 2020-10-22 2022-05-10 Asia Vital Components Co., Ltd. Vapor/liquid condensation system
KR20230013835A (en) * 2021-07-20 2023-01-27 엘지전자 주식회사 Battery Heat Exchanger
WO2024147701A1 (en) * 2023-01-06 2024-07-11 주식회사 케이엠더블유 Active heat dissipation apparatus and manufacturing method of same
WO2024147709A1 (en) * 2023-01-06 2024-07-11 주식회사 케이엠더블유 Active heat dissipation apparatus and manufacturing method of same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
EP0989795A2 (en) * 1998-09-24 2000-03-29 Sun Microsystems, Inc. Refrigeration system for electronic components
US6550530B1 (en) * 2002-04-19 2003-04-22 Thermal Corp. Two phase vacuum pumped loop

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258296A (en) * 1988-08-23 1990-02-27 Fujitsu Ltd Cooling device
KR20010045825A (en) * 1999-11-08 2001-06-05 이목형 Heat transfer device for using refrigerant
JP2004022682A (en) 2002-06-13 2004-01-22 Sony Corp Liquid flow structure, cooling device, electronic equipment, and manufacturing method of porous alumina
KR100492707B1 (en) * 2002-10-10 2005-06-07 주식회사 에이팩 Cooling means of pdp(plasma display panel)

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
EP0989795A2 (en) * 1998-09-24 2000-03-29 Sun Microsystems, Inc. Refrigeration system for electronic components
US6550530B1 (en) * 2002-04-19 2003-04-22 Thermal Corp. Two phase vacuum pumped loop

Also Published As

Publication number Publication date
KR20060049770A (en) 2006-05-19
WO2006019219A2 (en) 2006-02-23
US20070284088A1 (en) 2007-12-13
KR100623641B1 (en) 2006-09-19

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