JP2005045003A

JP2005045003A - Radiator

Info

Publication number: JP2005045003A
Application number: JP2003277384A
Authority: JP
Inventors: Hiromasa Ashitani; 博正芦谷; Masao Nakano; 雅夫中野; Tsutomu Tsujimoto; 力辻本
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2003-07-22
Filing date: 2003-07-22
Publication date: 2005-02-17
Also published as: US20050016720A1; CN1577212A; TW200506293A

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiator that can maintain a prescribed heat radiating performance by preventing the excessive deformation of a heat absorber even when a high-pressure refrigerant is used by constituting the heat absorber in a pressure-resistant structure. <P>SOLUTION: The heat absorber is constituted of a main heat-exchange 8 and a cover 10, and contains a refrigerant flowing space 9. The space 9 contains a joint 35. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、コンピュータなどの電子機器に搭載される半導体素子などの発熱体からの熱を電子機器外に放熱させる放熱装置に関するものである。 The present invention relates to a heat dissipation device that dissipates heat from a heating element such as a semiconductor element mounted on an electronic device such as a computer to the outside of the electronic device.

従来、コンピュータなどの電子機器に搭載される半導体素子などの発熱体からの熱を電子機器外に放熱させる放熱装置が提案されている（例えば特許文献１参照）。 2. Description of the Related Art Conventionally, there has been proposed a heat dissipation device that dissipates heat from a heating element such as a semiconductor element mounted on an electronic device such as a computer to the outside of the electronic device (see, for example, Patent Document 1).

以下、従来の放熱装置について図３を用いて説明する。図３は従来の放熱装置を示す模式図である。図３において、電子機器内に収納された発熱体に密着させた吸熱器１０１と、吸熱器１０１に接続されたポンプ１０３と、吸熱器１０１及びポンプ１０３に接続された放熱器１０２とを備え、吸熱器１０１と放熱器１０２とポンプ１０３の間は管で接続して形成した循環サイクルを循環する流体冷媒からなっている。吸熱器１０１と、放熱器１０２、ポンプ１０３といった構成は、同じながら、一般には取り扱いの容易な、水系の冷媒が適用されており、その内部の圧力は、略大気圧の比較的圧力の低いものであった。
特開２００１−２４３７２号公報 A conventional heat dissipation device will be described below with reference to FIG. FIG. 3 is a schematic view showing a conventional heat dissipation device. In FIG. 3, a heat absorber 101 closely attached to a heating element housed in an electronic device, a pump 103 connected to the heat absorber 101, and a heat radiator 102 connected to the heat absorber 101 and the pump 103 are provided. The heat absorber 101, the heat radiator 102, and the pump 103 are composed of fluid refrigerant that circulates in a circulation cycle formed by connecting pipes. Although the configuration of the heat absorber 101, the radiator 102, and the pump 103 is the same, a water-based refrigerant that is generally easy to handle is applied, and the internal pressure thereof is a relatively low pressure of approximately atmospheric pressure. Met.
JP 2001-24372 A

しかしながら前記従来の構成では、電子機器の放熱装置として、さらなる低熱抵抗による放熱性能の向上を実現するために、潜熱効果を利用するフルオロカーボン系などの高圧冷媒を使用した場合、吸熱器１０１の耐圧強度が考慮された構成ではなく、吸熱器１０１の、電子機器に搭載された発熱体との接面の平面度の悪化を引き起こし、高放熱性能性が損なわれる可能性が高いという問題点を有していた。 However, in the conventional configuration, when a high-pressure refrigerant such as a fluorocarbon type using a latent heat effect is used as a heat dissipation device for an electronic device in order to realize an improvement in heat dissipation performance due to further low thermal resistance, the pressure resistance strength of the heat absorber 101 However, the heat sink 101 has a problem that the flatness of the contact surface of the heat sink 101 with the heating element mounted on the electronic device is deteriorated and the high heat radiation performance is likely to be impaired. It was.

本発明は、前記従来の問題点を解決するもので、吸熱器の構成を、内部の冷媒流路空間における、受圧面積を減少させ、冷媒流路空間の面にかかる荷重を低減し、吸熱器の変形を極小化させることによって、高圧冷媒の適用を可能にできる吸熱器を有する放熱装置を提供することを目的とする。 The present invention solves the above-mentioned conventional problems. The structure of the heat absorber reduces the pressure receiving area in the internal refrigerant flow space and reduces the load applied to the surface of the refrigerant flow space. An object of the present invention is to provide a heat radiating device having a heat absorber capable of applying a high-pressure refrigerant by minimizing the deformation of the above.

この目的を達成するために本発明の放熱装置は、吸熱器の熱交換主体部とは別に設けたカバー部を、外周を接合させて形成される冷媒流路空間の中に接合部を有する構成とすることによって、この冷媒流路空間における、受圧面積を減少させ、冷媒流路空間の面にかかる荷重を低減することによって、熱交換主体部の発熱体との接面の平面度の悪化を防止する。 In order to achieve this object, the heat dissipating device of the present invention has a structure in which a cover part provided separately from the heat exchange main part of the heat absorber has a joining part in a refrigerant flow path space formed by joining the outer periphery. By reducing the pressure receiving area in the refrigerant flow path space and reducing the load applied to the surface of the refrigerant flow path space, the flatness of the contact surface with the heating element of the heat exchange main body portion is deteriorated. To prevent.

以上のように、本発明の放熱装置によれば、吸熱器について、冷媒流路空間の中に単数あるいは複数の接合部を有することによって、炉中ロー付けによる強度低下を、再び高強度にするのに、炉中ロー付け後の後工程において、硬化させる必要もなく、吸熱器の部分を完成させることができる。 As described above, according to the heat radiating device of the present invention, the heat absorber has a single or a plurality of joints in the refrigerant flow space, thereby reducing the strength reduction due to brazing in the furnace again to high strength. However, in the subsequent process after brazing in the furnace, it is not necessary to cure, and the heat absorber portion can be completed.

以下、本発明の実施の形態について、図面を参照しながら説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（実施の形態１）
図１は本発明の実施の形態１における放熱装置の回路図であり、図２は本発明の実施の形態１における吸熱器の半断面図である。 (Embodiment 1)
1 is a circuit diagram of a heat dissipation device according to Embodiment 1 of the present invention, and FIG. 2 is a half cross-sectional view of a heat absorber according to Embodiment 1 of the present invention.

図中、吸熱器１と放熱器２とポンプ４とは閉回路として配管５で連結されており、内部に封入された高圧冷媒をポンプ４で圧送し、吸熱器１、放熱器２、再びポンプ４の順に循環する。吸熱器１は、コンピュータなどの電子機器に搭載された半導体素子などの外部発熱体７に相対して密着するように設置され、この外部発熱体７からの発せられる熱Ｑｉｎ３４は塗膜材部３３を介して受熱する。さらに、この熱Ｑｉｎ３４は高熱伝導性を有する銅製やアルミ製などの熱交換主体部８を介して、高圧冷媒に伝える。その後、受熱した高圧冷媒は放熱器２に運ばれる。放熱器２に流通する高圧冷媒は、この放熱器２を介してファン６によって強制空冷されることで、熱Ｑｏｕｔ１１として外部空気に排熱せられる。その後、高圧冷媒はポンプ４へ再び還流するように、放熱装置１２は、閉回路を成す。 In the figure, the heat absorber 1, the radiator 2 and the pump 4 are connected by a pipe 5 as a closed circuit, and the high pressure refrigerant sealed inside is pumped by the pump 4, and the heat absorber 1, the radiator 2 and the pump are pumped again. It circulates in order of 4. The heat absorber 1 is installed so as to be in close contact with an external heating element 7 such as a semiconductor element mounted on an electronic device such as a computer. The heat Qin 34 generated from the external heating element 7 is applied to the coating material part 33. It receives heat through. Further, the heat Qin34 is transmitted to the high-pressure refrigerant through the heat exchange main body 8 made of copper or aluminum having high thermal conductivity. Thereafter, the received high-pressure refrigerant is carried to the radiator 2. The high-pressure refrigerant flowing through the radiator 2 is exhausted to the outside air as heat Qout11 by being forcedly air-cooled by the fan 6 via the radiator 2. Thereafter, the heat dissipating device 12 forms a closed circuit so that the high-pressure refrigerant returns to the pump 4 again.

この吸熱器１における、外部発熱体７から冷媒への熱交換、およびこの放熱器２における、冷媒から空気への熱交換に際し、冷媒としては、フルオロカーボン系のＲ１３４などの高圧冷媒を利用することで、電子機器でのこの種の放熱装置で通常起り得るこの冷媒の温度範囲０〜９５度で、主に沸騰、凝縮現象といった潜熱効果を利用することによって、吸熱、放熱過程における高い熱交換性能を実現し、放熱装置１２全体の低熱抵抗の向上を図ることができる。この温度範囲中、冷媒の圧力は、略３ＭＰａに至るほど高圧となり、放熱器１２全体で耐圧強度が重要となる。 When heat is exchanged from the external heating element 7 to the refrigerant in the heat absorber 1 and heat is exchanged from the refrigerant to the air in the radiator 2, a high-pressure refrigerant such as fluorocarbon R134 is used as the refrigerant. High heat exchange performance in the process of heat absorption and heat dissipation by utilizing the latent heat effect such as boiling and condensation phenomenon mainly in the temperature range of this refrigerant that can occur in this kind of heat dissipation device in electronic equipment. This can be achieved and the low thermal resistance of the entire heat dissipation device 12 can be improved. In this temperature range, the pressure of the refrigerant increases as it reaches approximately 3 MPa, and the pressure resistance is important for the entire radiator 12.

この吸熱器１は、熱交換主体部８と、冷媒流路空間９を形成するように相対的に接合して設置されたカバー部１０、冷媒が流通する吸熱器入口配管３１、吸熱器出口配管３２からなる。このカバー部１０をこの熱交換主体部８に接合させるのに、ロー材などを炉中で溶解させ、接合させる必要がある。しかしながら、ここに使用すべきロー材の性質などから、炉中の温度は略９００度に至り、熱交換主体部８だけでなく、カバー部１０も同じ銅製などの材質にすれば、耐圧強度は著しく低下するため、高圧冷媒の使用下では、吸熱器１の外部発熱体７との接面の変形を促し、平面度を維持できないことにより、塗膜材部３３の熱伝導に掛かる厚みが部分的に増加してしまうことで、熱抵抗の悪化を招いてしまう。 The heat absorber 1 includes a heat exchange main body portion 8, a cover portion 10 which is relatively joined so as to form a refrigerant flow path space 9, a heat absorber inlet pipe 31 through which refrigerant flows, and a heat absorber outlet pipe. 32. In order to join the cover part 10 to the heat exchange main part 8, it is necessary to melt and join a brazing material or the like in a furnace. However, because of the properties of the brazing material to be used here, the temperature in the furnace reaches approximately 900 degrees, and if the cover portion 10 is made of the same material such as copper as well as the heat exchange main portion 8, the pressure resistance strength is Since the thickness of the coating material material 33 is partially reduced by using a high-pressure refrigerant, deformation of the contact surface of the heat absorber 1 with the external heating element 7 is promoted and flatness cannot be maintained. If it increases, thermal resistance will be deteriorated.

そこで、このカバー部１０と、熱交換主体部８は、内部に冷媒流路空間９を形成するように接合され、またこの冷媒流路空間９の中にも単数あるいは複数の接合部３５を設ける。この結果、内部の冷媒流路空間９における、高圧による荷重支持点として、この接合部３５をこの冷媒流路空間９の中に設けることで、この荷重支持点間で形成される面の受圧面積を減少させ、総じて冷媒流路空間９の面にかかる荷重を低減することによって、特に熱交換主体部８の曲げ強度を向上し、熱交換主体部８の、発熱体に相対する接面の平面度の悪化を防止することができる。 Therefore, the cover part 10 and the heat exchange main part 8 are joined so as to form a refrigerant flow path space 9 therein, and a single or plural joining parts 35 are also provided in the refrigerant flow path space 9. . As a result, the pressure receiving area of the surface formed between the load support points is provided in the coolant channel space 9 as a load support point due to high pressure in the internal coolant channel space 9. In particular, the bending strength of the heat exchange main body 8 is improved by reducing the load applied to the surface of the refrigerant passage space 9 as a whole, and the plane of the contact surface of the heat exchange main body 8 facing the heating element is improved. Deterioration of the degree can be prevented.

本発明の実施の形態１における放熱装置の回路図Circuit diagram of heat dissipation device in Embodiment 1 of the present invention 本発明の実施の形態１における吸熱器の半断面図Half sectional view of heat sink in Embodiment 1 of the present invention 従来の放熱装置の模式図Schematic diagram of a conventional heat dissipation device

Explanation of symbols

１吸熱器
２放熱器
４ポンプ
５配管
７外部発熱体
８熱交換主体部
９冷媒流路空間
１０カバー部
１２放熱装置
３５接合部

DESCRIPTION OF SYMBOLS 1 Heat absorber 2 Radiator 4 Pump 5 Piping 7 External heat generating body 8 Heat exchange main part 9 Refrigerant channel space 10 Cover part 12 Radiation device 35 Joint part

Claims

A heat dissipation device that connects a heat absorber, a heat radiator, and a pump as a closed circuit with piping, and that pumps high-pressure refrigerant sealed inside by the pump, and circulates the heat absorber, the heat radiator, and the pump again in this order. The heat absorber is opposed to the heat exchange main body so as to have a heat exchange main body for converting heat from an external heating element into the high-pressure refrigerant, and a refrigerant passage space inside the heat absorber. And a cover part configured by joining the outer periphery of the refrigerant flow path space, and having a joint part between the heat exchange main part and the cover part in the refrigerant flow path space.