WO2009054461A1 - Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification - Google Patents

Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification Download PDF

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Publication number
WO2009054461A1
WO2009054461A1 PCT/JP2008/069248 JP2008069248W WO2009054461A1 WO 2009054461 A1 WO2009054461 A1 WO 2009054461A1 JP 2008069248 W JP2008069248 W JP 2008069248W WO 2009054461 A1 WO2009054461 A1 WO 2009054461A1
Authority
WO
WIPO (PCT)
Prior art keywords
production
ceramic filter
radiation structure
susceptor
heat radiation
Prior art date
Application number
PCT/JP2008/069248
Other languages
French (fr)
Japanese (ja)
Inventor
Chihiro Kawai
Original Assignee
Sumitomo Electric Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries, Ltd. filed Critical Sumitomo Electric Industries, Ltd.
Publication of WO2009054461A1 publication Critical patent/WO2009054461A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D39/00—Filtering material for liquid or gaseous fluids
    • B01D39/14—Other self-supporting filtering material ; Other filtering material
    • B01D39/20—Other self-supporting filtering material ; Other filtering material of inorganic material, e.g. asbestos paper, metallic filtering material of non-woven wires
    • B01D39/2068—Other inorganic materials, e.g. ceramics
    • B01D39/2093—Ceramic foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • H05B3/50—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
    • F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
    • F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
    • F01N3/021—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H01C17/06546—Oxides of zinc or cadmium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Filtering Materials (AREA)

Abstract

The invention aims to provide a heat radiation structure which has high heat conductivity and can come into close contact even with recesses and projections present in the surface of a heating element; and a heat sink, a susceptor and a diesel particulate filter which are made by utilizing the structure. The invention relates to a heat radiation structure which comprises a substrate and a layer made of a heat-conducting whisker-like substance grown from at least part of the surface of the substrate. It is particularly preferable that the whisker-like substance be any of ZnO, TiO2 or carbon nanotube and be grown nearly perpendicularly to the surface of the substrate for the growth of the substance.
PCT/JP2008/069248 2007-10-23 2008-10-23 Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification WO2009054461A1 (en)

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
JP2007274610 2007-10-23
JP2007-274610 2007-10-23
JP2008018730 2008-01-30
JP2008-018730 2008-01-30
JP2008-020166 2008-01-31
JP2008-020168 2008-01-31
JP2008020168 2008-01-31
JP2008-020165 2008-01-31
JP2008020167 2008-01-31
JP2008020165 2008-01-31
JP2008020166 2008-01-31
JP2008-020167 2008-01-31
JP2008-047140 2008-02-28
JP2008047140 2008-02-28
JP2008079986 2008-03-26
JP2008-079986 2008-03-26

Publications (1)

Publication Number Publication Date
WO2009054461A1 true WO2009054461A1 (en) 2009-04-30

Family

ID=40579563

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069248 WO2009054461A1 (en) 2007-10-23 2008-10-23 Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification

Country Status (1)

Country Link
WO (1) WO2009054461A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010038793A1 (en) * 2008-09-30 2010-04-08 凸版印刷株式会社 Nano-carbon material composite substrate and method for manufacturing same
CN101826494A (en) * 2010-04-13 2010-09-08 北京大学 Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method
JP2011051888A (en) * 2009-08-25 2011-03-17 Qinghua Univ Structure and method for manufacturing carbon nanotube heat dissipating device
WO2011095854A1 (en) * 2010-02-08 2011-08-11 Sony Ericsson Mobile Communications Ab Touchscreen displays for an electronic device that include separate carbon nanotube layers for determining location and force, respectively
WO2011147283A1 (en) * 2010-05-25 2011-12-01 方方 Heat radiation dissipation film structure and method for making the same
JP2011256100A (en) * 2010-06-07 2011-12-22 Inst Technologii Materialow Elektronicznych Method for manufacturing graphene
JP2013133262A (en) * 2011-12-27 2013-07-08 Fujikura Ltd Carbon nanofiber structure, carbon nanofiber electrode, and method for manufacturing the carbon nanofiber structure
CN106211711A (en) * 2016-07-15 2016-12-07 中国空间技术研究院 A kind of radiator with high performance based on aligned carbon nanotube film and preparation method
JP2017126697A (en) * 2016-01-15 2017-07-20 日東電工株式会社 Holder member
JP2018174195A (en) * 2017-03-31 2018-11-08 富士通株式会社 Heat dissipator, method of manufacturing heat dissipator, and electronic device
JP2021111688A (en) * 2020-01-10 2021-08-02 日本特殊陶業株式会社 Retainer
JP7495821B2 (en) 2019-09-24 2024-06-05 日本特殊陶業株式会社 Manufacturing method for semiconductor module components, and semiconductor module components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007182352A (en) * 2006-01-06 2007-07-19 National Institute Of Advanced Industrial & Technology Bulk assembly of oriented carbon nanotube, method of manufacturing the same and application thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007182352A (en) * 2006-01-06 2007-07-19 National Institute Of Advanced Industrial & Technology Bulk assembly of oriented carbon nanotube, method of manufacturing the same and application thereof

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010038793A1 (en) * 2008-09-30 2010-04-08 凸版印刷株式会社 Nano-carbon material composite substrate and method for manufacturing same
US8741419B2 (en) 2008-09-30 2014-06-03 Toppan Printing Co., Ltd. Nanocarbon material-composite substrate and manufacturing method thereof
JP2011051888A (en) * 2009-08-25 2011-03-17 Qinghua Univ Structure and method for manufacturing carbon nanotube heat dissipating device
WO2011095854A1 (en) * 2010-02-08 2011-08-11 Sony Ericsson Mobile Communications Ab Touchscreen displays for an electronic device that include separate carbon nanotube layers for determining location and force, respectively
CN101826494A (en) * 2010-04-13 2010-09-08 北京大学 Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method
WO2011147283A1 (en) * 2010-05-25 2011-12-01 方方 Heat radiation dissipation film structure and method for making the same
JP2011256100A (en) * 2010-06-07 2011-12-22 Inst Technologii Materialow Elektronicznych Method for manufacturing graphene
JP2013133262A (en) * 2011-12-27 2013-07-08 Fujikura Ltd Carbon nanofiber structure, carbon nanofiber electrode, and method for manufacturing the carbon nanofiber structure
US10879103B2 (en) 2016-01-15 2020-12-29 Nitto Denko Corporation Mounting member
JP2017126697A (en) * 2016-01-15 2017-07-20 日東電工株式会社 Holder member
WO2017122622A1 (en) * 2016-01-15 2017-07-20 日東電工株式会社 Mounting member
CN106211711A (en) * 2016-07-15 2016-12-07 中国空间技术研究院 A kind of radiator with high performance based on aligned carbon nanotube film and preparation method
JP2018174195A (en) * 2017-03-31 2018-11-08 富士通株式会社 Heat dissipator, method of manufacturing heat dissipator, and electronic device
JP7495821B2 (en) 2019-09-24 2024-06-05 日本特殊陶業株式会社 Manufacturing method for semiconductor module components, and semiconductor module components
JP2021111688A (en) * 2020-01-10 2021-08-02 日本特殊陶業株式会社 Retainer
JP7441046B2 (en) 2020-01-10 2024-02-29 日本特殊陶業株式会社 holding device

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