TW200635975A - Thermosetting composition for solder resist and cured product thereof - Google Patents

Thermosetting composition for solder resist and cured product thereof

Info

Publication number
TW200635975A
TW200635975A TW095105808A TW95105808A TW200635975A TW 200635975 A TW200635975 A TW 200635975A TW 095105808 A TW095105808 A TW 095105808A TW 95105808 A TW95105808 A TW 95105808A TW 200635975 A TW200635975 A TW 200635975A
Authority
TW
Taiwan
Prior art keywords
solder resist
thermosetting composition
cured product
resistance
thermosetting
Prior art date
Application number
TW095105808A
Other languages
English (en)
Inventor
Yoshio Miyajima
Tetsuo Wada
Ayako Nakamura
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200635975A publication Critical patent/TW200635975A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4207—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Epoxy Resins (AREA)
TW095105808A 2005-02-21 2006-02-21 Thermosetting composition for solder resist and cured product thereof TW200635975A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005043969A JP2006229127A (ja) 2005-02-21 2005-02-21 ソルダーレジスト用熱硬化性組成物及びその硬化物

Publications (1)

Publication Number Publication Date
TW200635975A true TW200635975A (en) 2006-10-16

Family

ID=36990189

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105808A TW200635975A (en) 2005-02-21 2006-02-21 Thermosetting composition for solder resist and cured product thereof

Country Status (6)

Country Link
EP (1) EP1858950A1 (zh)
JP (1) JP2006229127A (zh)
KR (1) KR20070103399A (zh)
CN (1) CN101124258A (zh)
TW (1) TW200635975A (zh)
WO (1) WO2006088230A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007105781A1 (en) * 2006-03-09 2007-09-20 Showa Denko K.K. Thermosetting resin composition and uses thereof
JP5417071B2 (ja) * 2009-07-21 2014-02-12 電気化学工業株式会社 回路基板
KR101804392B1 (ko) * 2011-03-15 2017-12-04 닛산 가가쿠 고교 가부시키 가이샤 레지스트 하층막 형성 조성물 및 이를 이용한 레지스트 패턴의 형성 방법
US9237645B2 (en) * 2011-04-28 2016-01-12 Kaneka Corporation Flexible printed circuit integrated with conductive layer
CN103140020B (zh) * 2011-12-05 2016-06-08 昆山雅森电子材料科技有限公司 挠性印刷电路板的覆盖膜、挠性印刷电路板结构及其制法
CN103140019B (zh) * 2011-12-05 2016-06-08 昆山雅森电子材料科技有限公司 软性电路板的黑色覆盖膜、软性印刷电路板结构及其制法
CN103140018B (zh) * 2011-12-05 2016-06-08 昆山雅森电子材料科技有限公司 软性印刷电路板的保护膜、软性印刷电路板结构及其制法
KR101293062B1 (ko) * 2011-12-06 2013-08-05 공선정 변성수지의 제조방법, 상기 방법으로 제조된 변성수지, 상기 변성수지를 포함하는 광경화성 감광성 유연수지조성물 및 상기 조성물로 인쇄된 솔더 레지스트를 포함하는 유연성전자회로기판
CN103338587A (zh) * 2013-07-10 2013-10-02 苏州联易昌工业材料有限公司 一种线路板及其制作工艺
CN105086365A (zh) * 2015-08-03 2015-11-25 广东生益科技股份有限公司 一种覆铜板用环氧树脂组合物及其应用
CN106117973A (zh) * 2016-06-23 2016-11-16 安徽酷米智能科技有限公司 一种线路板用环氧树脂组合物
JP6861282B2 (ja) * 2018-03-09 2021-04-21 Ｄｉｃグラフィックス株式会社 活性エネルギー線硬化型インキ、インキ硬化物の製造方法及び印刷物
CN111378409B (zh) * 2018-12-28 2022-02-11 北京科化新材料科技有限公司 透明的耐老化单组份环氧胶组合物和环氧胶粒料及其制造方法和应用
CN112266576A (zh) * 2020-11-04 2021-01-26 纽宝力精化(广州)有限公司 一种纸基板用溴化环氧树脂组合物
CN115304955A (zh) * 2022-08-25 2022-11-08 佛山市西伦化工有限公司 一种热固化防焊油墨及其制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330578A (ja) * 1986-07-24 1988-02-09 Shikoku Chem Corp エポキシ樹脂系レジストインク組成物
JPH0411261A (ja) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp 感光性組成物
JPH05327191A (ja) * 1992-05-26 1993-12-10 Matsushita Electric Works Ltd プリント配線板への印刷方法
JPH05327190A (ja) * 1992-05-26 1993-12-10 Matsushita Electric Works Ltd プリント配線板への印刷方法
JP3363232B2 (ja) * 1993-12-29 2003-01-08 東京応化工業株式会社 耐熱性感光性樹脂組成物およびこれを用いた感光性ドライフィルム
JP2707495B2 (ja) * 1996-03-11 1998-01-28 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物
JP2001098243A (ja) * 1999-09-30 2001-04-10 Arisawa Mfg Co Ltd カバーレイ用樹脂組成物及びカバーレイ
JP4016078B2 (ja) * 2000-01-18 2007-12-05 株式会社東亜電化 プリント配線板の製造方法および多層プリント配線板
JP3394029B2 (ja) * 2000-03-21 2003-04-07 大塚化学株式会社 難燃性エポキシ樹脂組成物、及びその成形物、及び電子部品
JP2003084429A (ja) * 2001-07-04 2003-03-19 Showa Denko Kk レジスト用硬化性難燃組成物およびその硬化物
JP2003246963A (ja) * 2001-12-17 2003-09-05 Kansai Paint Co Ltd 塗料組成物
JP2005029583A (ja) * 2002-07-30 2005-02-03 Kansai Paint Co Ltd 塗装方法
JP2004062057A (ja) * 2002-07-31 2004-02-26 Showa Denko Kk 感光性熱硬化性樹脂組成物及びその硬化物
JP2004182752A (ja) * 2002-11-29 2004-07-02 Dainippon Ink & Chem Inc エポキシ樹脂組成物およびエポキシ樹脂エマルジョン
JP4305062B2 (ja) * 2003-06-03 2009-07-29 Ｄｉｃ株式会社 エポキシ樹脂組成物及びエポキシ樹脂エマルジョン

Also Published As

Publication number Publication date
EP1858950A1 (en) 2007-11-28
JP2006229127A (ja) 2006-08-31
KR20070103399A (ko) 2007-10-23
CN101124258A (zh) 2008-02-13
WO2006088230A1 (en) 2006-08-24

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