TW200635472A - Multilayered printed circuit board - Google Patents

Multilayered printed circuit board

Info

Publication number
TW200635472A
TW200635472A TW095103777A TW95103777A TW200635472A TW 200635472 A TW200635472 A TW 200635472A TW 095103777 A TW095103777 A TW 095103777A TW 95103777 A TW95103777 A TW 95103777A TW 200635472 A TW200635472 A TW 200635472A
Authority
TW
Taiwan
Prior art keywords
hole
via hole
circuit board
printed circuit
radius
Prior art date
Application number
TW095103777A
Other languages
English (en)
Chinese (zh)
Other versions
TWI294760B (enExample
Inventor
You-Hong Wu
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200635472A publication Critical patent/TW200635472A/zh
Application granted granted Critical
Publication of TWI294760B publication Critical patent/TWI294760B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW095103777A 2005-02-02 2006-02-03 Multilayered printed circuit board TW200635472A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005026896A JP2006216711A (ja) 2005-02-02 2005-02-02 多層プリント配線板

Publications (2)

Publication Number Publication Date
TW200635472A true TW200635472A (en) 2006-10-01
TWI294760B TWI294760B (enExample) 2008-03-11

Family

ID=36777167

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103777A TW200635472A (en) 2005-02-02 2006-02-03 Multilayered printed circuit board

Country Status (7)

Country Link
US (1) US7402760B2 (enExample)
EP (1) EP1845761B1 (enExample)
JP (1) JP2006216711A (enExample)
KR (2) KR101162524B1 (enExample)
CN (1) CN101107892B (enExample)
TW (1) TW200635472A (enExample)
WO (1) WO2006082783A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI759259B (zh) * 2014-11-14 2022-04-01 日商凸版印刷股份有限公司 配線電路基板、半導體裝置、配線電路基板之製造方法、半導體裝置之製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
FI115601B (fi) * 2003-04-01 2005-05-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
JP2006216714A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
JP2006216713A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
KR20100065689A (ko) * 2008-12-08 2010-06-17 삼성전기주식회사 금속범프를 갖는 인쇄회로기판 및 그 제조방법
JP5603600B2 (ja) * 2010-01-13 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ
JP2015126053A (ja) * 2013-12-26 2015-07-06 富士通株式会社 配線基板、配線基板の製造方法及び電子装置
TW202245555A (zh) 2021-03-10 2022-11-16 美商山姆科技公司 填充材料和填充通孔的方法
CN116347758B (zh) * 2023-04-17 2026-01-27 四川三益电子新材料有限公司 一种特殊导通结构的双面柔性线路板及制备工艺
CN119208288B (zh) * 2024-08-27 2026-05-08 中国科学院微电子研究所 一种玻璃基板及其制造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828580B2 (ja) * 1993-04-21 1996-03-21 日本電気株式会社 配線基板構造及びその製造方法
US5539156A (en) * 1994-11-16 1996-07-23 International Business Machines Corporation Non-annular lands
US5699613A (en) * 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
US5875102A (en) * 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure
JP2000315867A (ja) * 1996-03-04 2000-11-14 Ibiden Co Ltd 多層プリント配線板
JP3202936B2 (ja) * 1996-03-04 2001-08-27 イビデン株式会社 多層プリント配線板
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
US6392898B1 (en) * 1997-10-17 2002-05-21 Ibiden Co., Ltd. Package substrate
JP2000022337A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Works Ltd 多層配線板及びその製造方法
JP2000165046A (ja) * 1998-09-24 2000-06-16 Ibiden Co Ltd 多層ビルドアップ配線板
MY128333A (en) * 1998-09-14 2007-01-31 Ibiden Co Ltd Printed wiring board and its manufacturing method
JP2000101246A (ja) 1998-09-17 2000-04-07 Ibiden Co Ltd 多層ビルドアップ配線板及び多層ビルドアップ配線板の製造方法
US6078013A (en) * 1998-10-08 2000-06-20 International Business Machines Corporation Clover-leaf solder mask opening
CN101232776B (zh) * 1999-09-02 2011-04-20 揖斐电株式会社 印刷布线板
JP2001127435A (ja) 1999-10-26 2001-05-11 Ibiden Co Ltd 多層プリント配線板及び多層プリント配線板の製造方法
JP2001267747A (ja) * 2000-03-22 2001-09-28 Nitto Denko Corp 多層回路基板の製造方法
JP2002094240A (ja) * 2000-09-19 2002-03-29 Nippon Mektron Ltd 層間接続バイア・ホールを有する多層プリント基板の製造方法
JP5004378B2 (ja) 2001-01-10 2012-08-22 イビデン株式会社 多層プリント配線板
JP2002290030A (ja) * 2001-03-23 2002-10-04 Ngk Spark Plug Co Ltd 配線基板
JP2003152311A (ja) * 2001-11-15 2003-05-23 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP4488684B2 (ja) * 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
US7091424B2 (en) * 2002-10-10 2006-08-15 International Business Machines Corporation Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
TWI335195B (en) * 2003-12-16 2010-12-21 Ngk Spark Plug Co Multilayer wiring board
KR100827266B1 (ko) * 2004-04-28 2008-05-07 이비덴 가부시키가이샤 다층 프린트 배선판
US7361847B2 (en) * 2005-12-30 2008-04-22 Motorola, Inc. Capacitance laminate and printed circuit board apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI759259B (zh) * 2014-11-14 2022-04-01 日商凸版印刷股份有限公司 配線電路基板、半導體裝置、配線電路基板之製造方法、半導體裝置之製造方法

Also Published As

Publication number Publication date
CN101107892A (zh) 2008-01-16
CN101107892B (zh) 2010-07-07
EP1845761A4 (en) 2009-11-25
EP1845761B1 (en) 2011-06-22
EP1845761A1 (en) 2007-10-17
US7402760B2 (en) 2008-07-22
US20080060840A1 (en) 2008-03-13
TWI294760B (enExample) 2008-03-11
JP2006216711A (ja) 2006-08-17
KR20100077055A (ko) 2010-07-06
WO2006082783A1 (ja) 2006-08-10
KR101162523B1 (ko) 2012-07-10
KR20070094024A (ko) 2007-09-19
KR101162524B1 (ko) 2012-07-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees