KR101162524B1 - 다층 프린트 배선판 - Google Patents

다층 프린트 배선판 Download PDF

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Publication number
KR101162524B1
KR101162524B1 KR1020107013094A KR20107013094A KR101162524B1 KR 101162524 B1 KR101162524 B1 KR 101162524B1 KR 1020107013094 A KR1020107013094 A KR 1020107013094A KR 20107013094 A KR20107013094 A KR 20107013094A KR 101162524 B1 KR101162524 B1 KR 101162524B1
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KR
South Korea
Prior art keywords
hole
via hole
radius
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020107013094A
Other languages
English (en)
Korean (ko)
Other versions
KR20100077055A (ko
Inventor
유홍 오
Original Assignee
이비덴 가부시키가이샤
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Publication date
Application filed by 이비덴 가부시키가이샤 filed Critical 이비덴 가부시키가이샤
Publication of KR20100077055A publication Critical patent/KR20100077055A/ko
Application granted granted Critical
Publication of KR101162524B1 publication Critical patent/KR101162524B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020107013094A 2005-02-02 2006-01-30 다층 프린트 배선판 Expired - Fee Related KR101162524B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005026896A JP2006216711A (ja) 2005-02-02 2005-02-02 多層プリント配線板
JPJP-P-2005-026896 2005-02-02
PCT/JP2006/301453 WO2006082783A1 (ja) 2005-02-02 2006-01-30 多層プリント配線板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020077017827A Division KR101162523B1 (ko) 2005-02-02 2006-01-30 다층 프린트 배선판

Publications (2)

Publication Number Publication Date
KR20100077055A KR20100077055A (ko) 2010-07-06
KR101162524B1 true KR101162524B1 (ko) 2012-07-09

Family

ID=36777167

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020107013094A Expired - Fee Related KR101162524B1 (ko) 2005-02-02 2006-01-30 다층 프린트 배선판
KR1020077017827A Expired - Fee Related KR101162523B1 (ko) 2005-02-02 2006-01-30 다층 프린트 배선판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020077017827A Expired - Fee Related KR101162523B1 (ko) 2005-02-02 2006-01-30 다층 프린트 배선판

Country Status (7)

Country Link
US (1) US7402760B2 (enExample)
EP (1) EP1845761B1 (enExample)
JP (1) JP2006216711A (enExample)
KR (2) KR101162524B1 (enExample)
CN (1) CN101107892B (enExample)
TW (1) TW200635472A (enExample)
WO (1) WO2006082783A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
FI115601B (fi) * 2003-04-01 2005-05-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
JP2006216712A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
JP2006216713A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
KR20100065689A (ko) * 2008-12-08 2010-06-17 삼성전기주식회사 금속범프를 갖는 인쇄회로기판 및 그 제조방법
JP5603600B2 (ja) * 2010-01-13 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ
JP2015126053A (ja) * 2013-12-26 2015-07-06 富士通株式会社 配線基板、配線基板の製造方法及び電子装置
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
TW202245555A (zh) * 2021-03-10 2022-11-16 美商山姆科技公司 填充材料和填充通孔的方法
CN116347758A (zh) * 2023-04-17 2023-06-27 四川三益电子新材料有限公司 一种特殊导通结构的双面柔性线路板及制备工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000101246A (ja) 1998-09-17 2000-04-07 Ibiden Co Ltd 多層ビルドアップ配線板及び多層ビルドアップ配線板の製造方法
JP2001044640A (ja) 1996-03-04 2001-02-16 Ibiden Co Ltd 多層プリント配線板
JP2002094240A (ja) 2000-09-19 2002-03-29 Nippon Mektron Ltd 層間接続バイア・ホールを有する多層プリント基板の製造方法
JP2003152311A (ja) 2001-11-15 2003-05-23 Ngk Spark Plug Co Ltd 配線基板の製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828580B2 (ja) * 1993-04-21 1996-03-21 日本電気株式会社 配線基板構造及びその製造方法
US5539156A (en) * 1994-11-16 1996-07-23 International Business Machines Corporation Non-annular lands
US5699613A (en) * 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
US5875102A (en) * 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure
JP3202936B2 (ja) * 1996-03-04 2001-08-27 イビデン株式会社 多層プリント配線板
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
EP1030365A4 (en) * 1997-10-17 2007-05-09 Ibiden Co Ltd SUBSTRATE OF A HOUSING
JP2000022337A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Works Ltd 多層配線板及びその製造方法
JP2000165046A (ja) * 1998-09-24 2000-06-16 Ibiden Co Ltd 多層ビルドアップ配線板
MY128333A (en) * 1998-09-14 2007-01-31 Ibiden Co Ltd Printed wiring board and its manufacturing method
US6078013A (en) * 1998-10-08 2000-06-20 International Business Machines Corporation Clover-leaf solder mask opening
EP1744606A3 (en) * 1999-09-02 2007-04-11 Ibiden Co., Ltd. Printed circuit board and method for producing the printed circuit board
JP2001127435A (ja) 1999-10-26 2001-05-11 Ibiden Co Ltd 多層プリント配線板及び多層プリント配線板の製造方法
JP2001267747A (ja) * 2000-03-22 2001-09-28 Nitto Denko Corp 多層回路基板の製造方法
JP5004378B2 (ja) 2001-01-10 2012-08-22 イビデン株式会社 多層プリント配線板
JP2002290030A (ja) * 2001-03-23 2002-10-04 Ngk Spark Plug Co Ltd 配線基板
JP4488684B2 (ja) * 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
US7091424B2 (en) * 2002-10-10 2006-08-15 International Business Machines Corporation Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
TWI335195B (en) * 2003-12-16 2010-12-21 Ngk Spark Plug Co Multilayer wiring board
WO2005107350A1 (ja) * 2004-04-28 2005-11-10 Ibiden Co., Ltd. 多層プリント配線板
US7361847B2 (en) * 2005-12-30 2008-04-22 Motorola, Inc. Capacitance laminate and printed circuit board apparatus and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044640A (ja) 1996-03-04 2001-02-16 Ibiden Co Ltd 多層プリント配線板
JP2000101246A (ja) 1998-09-17 2000-04-07 Ibiden Co Ltd 多層ビルドアップ配線板及び多層ビルドアップ配線板の製造方法
JP2002094240A (ja) 2000-09-19 2002-03-29 Nippon Mektron Ltd 層間接続バイア・ホールを有する多層プリント基板の製造方法
JP2003152311A (ja) 2001-11-15 2003-05-23 Ngk Spark Plug Co Ltd 配線基板の製造方法

Also Published As

Publication number Publication date
KR20100077055A (ko) 2010-07-06
TWI294760B (enExample) 2008-03-11
KR101162523B1 (ko) 2012-07-10
US7402760B2 (en) 2008-07-22
EP1845761B1 (en) 2011-06-22
TW200635472A (en) 2006-10-01
CN101107892B (zh) 2010-07-07
WO2006082783A1 (ja) 2006-08-10
JP2006216711A (ja) 2006-08-17
EP1845761A1 (en) 2007-10-17
US20080060840A1 (en) 2008-03-13
KR20070094024A (ko) 2007-09-19
EP1845761A4 (en) 2009-11-25
CN101107892A (zh) 2008-01-16

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