TW200631175A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TW200631175A TW200631175A TW094117026A TW94117026A TW200631175A TW 200631175 A TW200631175 A TW 200631175A TW 094117026 A TW094117026 A TW 094117026A TW 94117026 A TW94117026 A TW 94117026A TW 200631175 A TW200631175 A TW 200631175A
- Authority
- TW
- Taiwan
- Prior art keywords
- silicon substrate
- mixed crystal
- sige mixed
- insulation film
- crystal regions
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 5
- 238000009413 insulation Methods 0.000 abstract 5
- 229910052710 silicon Inorganic materials 0.000 abstract 5
- 239000010703 silicon Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 5
- 229910000577 Silicon-germanium Inorganic materials 0.000 abstract 3
- 239000013078 crystal Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66628—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation recessing the gate by forming single crystalline semiconductor material at the source or drain location
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66636—Lateral single gate silicon transistors with source or drain recessed by etching or first recessed by etching and then refilled
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7834—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a non-planar structure, e.g. the gate or the source or the drain being non-planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7843—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being an applied insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7848—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the source/drain region, e.g. SiGe source and drain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823814—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823878—Complementary field-effect transistors, e.g. CMOS isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005042870A JP4369379B2 (ja) | 2005-02-18 | 2005-02-18 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200631175A true TW200631175A (en) | 2006-09-01 |
TWI269445B TWI269445B (en) | 2006-12-21 |
Family
ID=36353769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094117026A TWI269445B (en) | 2005-02-18 | 2005-05-25 | Semiconductor device |
Country Status (6)
Country | Link |
---|---|
US (1) | US7816766B2 (zh) |
EP (1) | EP1693897B1 (zh) |
JP (1) | JP4369379B2 (zh) |
KR (1) | KR100690542B1 (zh) |
CN (1) | CN100459160C (zh) |
TW (1) | TWI269445B (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7538002B2 (en) * | 2006-02-24 | 2009-05-26 | Freescale Semiconductor, Inc. | Semiconductor process integrating source/drain stressors and interlevel dielectric layer stressors |
US7282406B2 (en) * | 2006-03-06 | 2007-10-16 | Semiconductor Companents Industries, L.L.C. | Method of forming an MOS transistor and structure therefor |
DE102006015077B4 (de) * | 2006-03-31 | 2010-12-23 | Advanced Micro Devices, Inc., Sunnyvale | Transistor mit abgesenkten Drain- und Source-Gebieten und Verfahren zur Herstellung desselben |
JP5080844B2 (ja) * | 2006-05-19 | 2012-11-21 | パナソニック株式会社 | 半導体装置及びその製造方法 |
US8354726B2 (en) | 2006-05-19 | 2013-01-15 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
JP2008071890A (ja) * | 2006-09-13 | 2008-03-27 | Toshiba Corp | 半導体装置及びその製造方法 |
KR101026479B1 (ko) * | 2006-12-28 | 2011-04-01 | 주식회사 하이닉스반도체 | 반도체 소자 및 그의 제조 방법 |
JP2008171999A (ja) * | 2007-01-11 | 2008-07-24 | Toshiba Corp | 半導体装置およびその製造方法 |
CN101641792B (zh) * | 2007-02-22 | 2012-03-21 | 富士通半导体股份有限公司 | 半导体器件及其制造方法 |
JP5003515B2 (ja) | 2007-03-20 | 2012-08-15 | ソニー株式会社 | 半導体装置 |
JP5286701B2 (ja) | 2007-06-27 | 2013-09-11 | ソニー株式会社 | 半導体装置および半導体装置の製造方法 |
KR20090008568A (ko) * | 2007-07-18 | 2009-01-22 | 주식회사 동부하이텍 | 반도체 소자의 제조방법 |
JP2009123960A (ja) | 2007-11-15 | 2009-06-04 | Toshiba Corp | 半導体装置 |
WO2009093328A1 (ja) * | 2008-01-25 | 2009-07-30 | Fujitsu Microelectronics Limited | 半導体装置及びその製造方法 |
JP5147471B2 (ja) * | 2008-03-13 | 2013-02-20 | パナソニック株式会社 | 半導体装置 |
JP5163311B2 (ja) * | 2008-06-26 | 2013-03-13 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
US20100109044A1 (en) * | 2008-10-30 | 2010-05-06 | Tekleab Daniel G | Optimized Compressive SiGe Channel PMOS Transistor with Engineered Ge Profile and Optimized Silicon Cap Layer |
US8216904B2 (en) * | 2008-12-31 | 2012-07-10 | St Microelectronics, Inc. | Strained transistor and method for forming the same |
JP5668277B2 (ja) | 2009-06-12 | 2015-02-12 | ソニー株式会社 | 半導体装置 |
US8638594B1 (en) * | 2009-12-02 | 2014-01-28 | Altera Corporation | Integrated circuits with asymmetric transistors |
CN102569383A (zh) * | 2010-12-14 | 2012-07-11 | 中国科学院微电子研究所 | 一种mos管及其制造方法 |
CN102881694A (zh) | 2011-07-14 | 2013-01-16 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
US9601594B2 (en) * | 2011-11-14 | 2017-03-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device with enhanced strain |
CN103165440A (zh) * | 2011-12-09 | 2013-06-19 | 中芯国际集成电路制造(上海)有限公司 | 高介电常数金属栅极半导体器件制造方法 |
JP5712985B2 (ja) * | 2012-08-27 | 2015-05-07 | ソニー株式会社 | 半導体装置 |
US8962430B2 (en) | 2013-05-31 | 2015-02-24 | Stmicroelectronics, Inc. | Method for the formation of a protective dual liner for a shallow trench isolation structure |
US8895381B1 (en) * | 2013-08-15 | 2014-11-25 | International Business Machines Corporation | Method of co-integration of strained-Si and relaxed Si or strained SiGe FETs on insulator with planar and non-planar architectures |
US9368626B2 (en) | 2013-12-04 | 2016-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device with strained layer |
KR102152285B1 (ko) | 2014-12-08 | 2020-09-04 | 삼성전자주식회사 | 스트레서를 갖는 반도체 소자 및 그 형성 방법 |
CN108400169B (zh) * | 2018-03-19 | 2021-02-12 | 电子科技大学 | 一种具有表面应力调制结构的应变pmosfet |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2964925B2 (ja) | 1994-10-12 | 1999-10-18 | 日本電気株式会社 | 相補型mis型fetの製造方法 |
US5710450A (en) * | 1994-12-23 | 1998-01-20 | Intel Corporation | Transistor with ultra shallow tip and method of fabrication |
TW368727B (en) * | 1998-03-17 | 1999-09-01 | United Microelectronics Corp | Manufacturing method for shallow trench isolation structure |
JP2003086708A (ja) | 2000-12-08 | 2003-03-20 | Hitachi Ltd | 半導体装置及びその製造方法 |
US6531781B2 (en) * | 2000-12-13 | 2003-03-11 | Vanguard International Semiconductor Corporation | Fabrication of transistor having elevated source-drain and metal silicide |
JP2003060076A (ja) | 2001-08-21 | 2003-02-28 | Nec Corp | 半導体装置及びその製造方法 |
US6621131B2 (en) * | 2001-11-01 | 2003-09-16 | Intel Corporation | Semiconductor transistor having a stressed channel |
JP2003179157A (ja) | 2001-12-10 | 2003-06-27 | Nec Corp | Mos型半導体装置 |
JP2004031753A (ja) | 2002-06-27 | 2004-01-29 | Renesas Technology Corp | 半導体装置の製造方法 |
US6800910B2 (en) * | 2002-09-30 | 2004-10-05 | Advanced Micro Devices, Inc. | FinFET device incorporating strained silicon in the channel region |
KR100499159B1 (ko) * | 2003-02-28 | 2005-07-01 | 삼성전자주식회사 | 리세스 채널을 갖는 반도체장치 및 그 제조방법 |
US20040262683A1 (en) * | 2003-06-27 | 2004-12-30 | Bohr Mark T. | PMOS transistor strain optimization with raised junction regions |
US7101742B2 (en) * | 2003-08-12 | 2006-09-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained channel complementary field-effect transistors and methods of manufacture |
US6939814B2 (en) * | 2003-10-30 | 2005-09-06 | International Business Machines Corporation | Increasing carrier mobility in NFET and PFET transistors on a common wafer |
US7662689B2 (en) * | 2003-12-23 | 2010-02-16 | Intel Corporation | Strained transistor integration for CMOS |
US7023018B2 (en) * | 2004-04-06 | 2006-04-04 | Texas Instruments Incorporated | SiGe transistor with strained layers |
US7053400B2 (en) * | 2004-05-05 | 2006-05-30 | Advanced Micro Devices, Inc. | Semiconductor device based on Si-Ge with high stress liner for enhanced channel carrier mobility |
US7190036B2 (en) * | 2004-12-03 | 2007-03-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistor mobility improvement by adjusting stress in shallow trench isolation |
US7335959B2 (en) * | 2005-01-06 | 2008-02-26 | Intel Corporation | Device with stepped source/drain region profile |
-
2005
- 2005-02-18 JP JP2005042870A patent/JP4369379B2/ja not_active Expired - Fee Related
- 2005-05-18 EP EP05010736.6A patent/EP1693897B1/en not_active Expired - Fee Related
- 2005-05-18 US US11/131,211 patent/US7816766B2/en not_active Expired - Fee Related
- 2005-05-25 TW TW094117026A patent/TWI269445B/zh not_active IP Right Cessation
- 2005-05-30 KR KR1020050045502A patent/KR100690542B1/ko active IP Right Grant
- 2005-06-10 CN CNB2005100763865A patent/CN100459160C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100459160C (zh) | 2009-02-04 |
JP2006229071A (ja) | 2006-08-31 |
US7816766B2 (en) | 2010-10-19 |
EP1693897A2 (en) | 2006-08-23 |
KR100690542B1 (ko) | 2007-03-09 |
EP1693897A3 (en) | 2008-08-06 |
JP4369379B2 (ja) | 2009-11-18 |
US20060186436A1 (en) | 2006-08-24 |
CN1822392A (zh) | 2006-08-23 |
TWI269445B (en) | 2006-12-21 |
KR20060092799A (ko) | 2006-08-23 |
EP1693897B1 (en) | 2018-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200631175A (en) | Semiconductor device | |
TW200623414A (en) | Semiconductor device and fabrication method thereof | |
TW200625642A (en) | Semiconductor integrated circuit device and fabrication porcess thereof | |
TW200701460A (en) | Semiconductor device and production method thereof | |
GB2486839A (en) | Method and structure for forming high-performance fets with embedded stressors | |
TW200746412A (en) | Virtual body-contacted trigate | |
WO2009063588A1 (ja) | 半導体装置及びその製造方法 | |
TW200625633A (en) | High-mobility bulk silicon PFET | |
TW200742045A (en) | Semiconductor device having a recess channel transistor | |
WO2008123352A1 (ja) | 半導体装置 | |
TW200620662A (en) | Semiconductor device with multiple semiconductor layers | |
WO2008063543A3 (en) | Stress enhanced mos transistor and methods for its fabrication | |
GB2497060A (en) | Method and structure for pFET junction profile with SiGe channel | |
TW200633125A (en) | Semiconductor device and method of semiconductor device | |
SG166085A1 (en) | Semiconductor device including a mos transistor and production method therefor | |
EP1777737A4 (en) | HIGH ELECTRON MOBILITY TRANSISTOR, FIELD EFFECT TRANSISTOR, EPITAXIAL SUBSTRATE, METHOD OF MAKING THE EPITAXIAL SUBSTRATE, AND METHOD FOR PRODUCING A GROUP III NITRIDE TRANSISTOR | |
SG138528A1 (en) | Mosfets comprising source/drain regions with slanted upper surfaces, and method for fabricating the same | |
TW200625630A (en) | Hybrid substrate technology for high-mobility planar and multiple-gate MOSFETs | |
GB2491778A (en) | A P-Fet with a strained nanowire channel and embedded sige source and drain stressors | |
WO2009105466A3 (en) | Reduced leakage current field-effect transistor having asymmetric doping and fabrication method therefor | |
TW200741976A (en) | Methods for fabricating a stressed MOS device | |
SG143174A1 (en) | Method to form selective strained si using lateral epitaxy | |
WO2011133339A3 (en) | Monolayer dopant embedded stressor for advanced cmos | |
TWI268539B (en) | Improved isolation structure for strained channel transistors | |
WO2011162977A3 (en) | Delta monolayer dopants epitaxy for embedded source/drain silicide |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |