TW200621460A - A sheet cutting method and a sheet mounting method - Google Patents

A sheet cutting method and a sheet mounting method

Info

Publication number
TW200621460A
TW200621460A TW094138279A TW94138279A TW200621460A TW 200621460 A TW200621460 A TW 200621460A TW 094138279 A TW094138279 A TW 094138279A TW 94138279 A TW94138279 A TW 94138279A TW 200621460 A TW200621460 A TW 200621460A
Authority
TW
Taiwan
Prior art keywords
sheet
semiconductor wafer
stuck
wafer
condition
Prior art date
Application number
TW094138279A
Other languages
English (en)
Chinese (zh)
Inventor
Masaki Tsujimoto
Takahisa Yoshioka
Kenji Kobayashi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200621460A publication Critical patent/TW200621460A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
TW094138279A 2004-11-11 2005-11-01 A sheet cutting method and a sheet mounting method TW200621460A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004327409A JP2006140251A (ja) 2004-11-11 2004-11-11 シート切断方法及びマウント方法

Publications (1)

Publication Number Publication Date
TW200621460A true TW200621460A (en) 2006-07-01

Family

ID=36336367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138279A TW200621460A (en) 2004-11-11 2005-11-01 A sheet cutting method and a sheet mounting method

Country Status (3)

Country Link
JP (1) JP2006140251A (ja)
TW (1) TW200621460A (ja)
WO (1) WO2006051684A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8833423B2 (en) 2010-06-24 2014-09-16 Nec Engineering, Ltd. Film attachment apparatus and attachment method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100874953B1 (ko) 2006-09-20 2008-12-19 삼성전자주식회사 반도체 웨이퍼 고정 장치
JP4927582B2 (ja) * 2007-02-07 2012-05-09 株式会社ディスコ ウエーハの裏面に装着された接着フィルムの破断方法
JP5006176B2 (ja) * 2007-12-11 2012-08-22 リンテック株式会社 シート切断方法
JP5296604B2 (ja) * 2009-05-29 2013-09-25 リンテック株式会社 シート貼付装置及び貼付方法
JP5670209B2 (ja) * 2011-01-13 2015-02-18 株式会社ディスコ 樹脂塗布装置
JP6302765B2 (ja) * 2014-06-25 2018-03-28 株式会社ディスコ テープ貼着装置
JP6099799B1 (ja) * 2016-07-26 2017-03-22 株式会社 エイブル 切断システム及び切断方法
JP6833542B2 (ja) * 2017-02-08 2021-02-24 日東電工株式会社 テープ回収方法およびテープ回収装置
JP2020203326A (ja) * 2019-06-14 2020-12-24 リンテック株式会社 切断装置および切断方法
KR102330850B1 (ko) * 2020-07-21 2021-12-01 창원대학교 산학협력단 복합 적층판 전용 절단기

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2589678B2 (ja) * 1986-09-03 1997-03-12 松下電子工業株式会社 半導体基板の裏面処理方法
JP3515917B2 (ja) * 1998-12-01 2004-04-05 シャープ株式会社 半導体装置の製造方法
JP4311522B2 (ja) * 2002-03-07 2009-08-12 日東電工株式会社 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法
JP2004079768A (ja) * 2002-08-19 2004-03-11 Lintec Corp 貼付装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8833423B2 (en) 2010-06-24 2014-09-16 Nec Engineering, Ltd. Film attachment apparatus and attachment method
TWI505937B (zh) * 2010-06-24 2015-11-01 Nec Engineering Ltd 膜片貼附裝置及貼附方法

Also Published As

Publication number Publication date
WO2006051684A1 (ja) 2006-05-18
JP2006140251A (ja) 2006-06-01

Similar Documents

Publication Publication Date Title
TW200621460A (en) A sheet cutting method and a sheet mounting method
TW200514188A (en) Mounting device and mounting method
MY125340A (en) Process for producing semiconductor device
CN101529577A (zh) 固定夹具及芯片的拾取方法以及拾取装置
CA2541733A1 (en) Saw blade with multiple bore sizes
AR035841A1 (es) Elemento de corte en o para unidad de afeitadora de seguridad estructura de hoja unitaria en o para dicha unidad y metodo de fabricacion del elemento de corte
EP2267763A3 (en) Method for cutting semiconductor substrate
SG126885A1 (en) Semiconductor wafer and processing method for same
MY143700A (en) Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension
TW200616773A (en) Cutting process of laminated material, cutting mechanism and cutting board of laminated material
EP1521299A3 (en) Method of mounting a semiconductor chip with an adhesive film and apparatus using the same
KR20150131963A (ko) 웨이퍼 가공 방법
CN105789126A (zh) 晶片的加工方法
JP2007110014A (ja) シート剥離装置及び剥離方法
JP2007173770A (ja) テープの貼り替え方法及び該テープの貼り替え方法を使用した基板の分割方法
JP5361634B2 (ja) 半導体ウェーハ用チャックテーブル及び半導体ウェーハの加工方法
CN101850538B (zh) 晶圆的支撑治具与研磨、输送及切割晶圆的方法
TW200600257A (en) Wire saw
TW200520080A (en) Method for dicing a wafer
JP2009206475A (ja) バンプが形成されたウェーハを処理するウェーハ処理方法およびウェーハ処理装置
JP2004193241A (ja) 半導体ウエーハの分割方法
US6746022B2 (en) Chuck for holding a workpiece
CN1771177A (zh) 带的粘贴方法及粘贴装置
MY143145A (en) Semiconductor package singulating system and method
TW200644103A (en) Method for machining a wafer