TW200620716A - High power LED package with universal bonding pads and interconnect arrangement - Google Patents

High power LED package with universal bonding pads and interconnect arrangement

Info

Publication number
TW200620716A
TW200620716A TW094137990A TW94137990A TW200620716A TW 200620716 A TW200620716 A TW 200620716A TW 094137990 A TW094137990 A TW 094137990A TW 94137990 A TW94137990 A TW 94137990A TW 200620716 A TW200620716 A TW 200620716A
Authority
TW
Taiwan
Prior art keywords
packages
bonding pads
led
high power
led package
Prior art date
Application number
TW094137990A
Other languages
English (en)
Other versions
TWI277227B (en
Inventor
xian-tao Yan
Original Assignee
Ledengin Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ledengin Inc filed Critical Ledengin Inc
Publication of TW200620716A publication Critical patent/TW200620716A/zh
Application granted granted Critical
Publication of TWI277227B publication Critical patent/TWI277227B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW094137990A 2004-10-29 2005-10-28 High power LED package with universal bonding pads and interconnect arrangement TWI277227B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US62326004P 2004-10-29 2004-10-29
US62326604P 2004-10-29 2004-10-29
US62317104P 2004-10-29 2004-10-29
US11/036,559 US8134292B2 (en) 2004-10-29 2005-01-13 Light emitting device with a thermal insulating and refractive index matching material

Publications (2)

Publication Number Publication Date
TW200620716A true TW200620716A (en) 2006-06-16
TWI277227B TWI277227B (en) 2007-03-21

Family

ID=36261019

Family Applications (4)

Application Number Title Priority Date Filing Date
TW094134804A TWI298208B (en) 2004-10-29 2005-10-05 Light emitting device with a thermal insulating and refractive index matching material
TW094137992A TWI373855B (en) 2004-10-29 2005-10-28 Led package with structure and materials for high heat dissipation
TW094137990A TWI277227B (en) 2004-10-29 2005-10-28 High power LED package with universal bonding pads and interconnect arrangement
TW094137991A TWI270993B (en) 2004-10-29 2005-10-28 Method of manufacturing ceramic LED packages

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW094134804A TWI298208B (en) 2004-10-29 2005-10-05 Light emitting device with a thermal insulating and refractive index matching material
TW094137992A TWI373855B (en) 2004-10-29 2005-10-28 Led package with structure and materials for high heat dissipation

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW094137991A TWI270993B (en) 2004-10-29 2005-10-28 Method of manufacturing ceramic LED packages

Country Status (3)

Country Link
US (1) US8134292B2 (zh)
JP (1) JP2006128700A (zh)
TW (4) TWI298208B (zh)

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* Cited by examiner, † Cited by third party
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TWI402460B (zh) * 2010-04-09 2013-07-21 Biao Qin LED wick and LED chip and manufacturing method
US8637890B2 (en) 2009-12-22 2014-01-28 Kabushiki Kaisha Toshiba Light emitting device

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TWI402460B (zh) * 2010-04-09 2013-07-21 Biao Qin LED wick and LED chip and manufacturing method

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US20060091788A1 (en) 2006-05-04
TW200620717A (en) 2006-06-16
TWI270993B (en) 2007-01-11
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JP2006128700A (ja) 2006-05-18
TW200629600A (en) 2006-08-16

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