TW200620716A - High power LED package with universal bonding pads and interconnect arrangement - Google Patents
High power LED package with universal bonding pads and interconnect arrangementInfo
- Publication number
- TW200620716A TW200620716A TW094137990A TW94137990A TW200620716A TW 200620716 A TW200620716 A TW 200620716A TW 094137990 A TW094137990 A TW 094137990A TW 94137990 A TW94137990 A TW 94137990A TW 200620716 A TW200620716 A TW 200620716A
- Authority
- TW
- Taiwan
- Prior art keywords
- packages
- bonding pads
- led
- high power
- led package
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62326004P | 2004-10-29 | 2004-10-29 | |
US62326604P | 2004-10-29 | 2004-10-29 | |
US62317104P | 2004-10-29 | 2004-10-29 | |
US11/036,559 US8134292B2 (en) | 2004-10-29 | 2005-01-13 | Light emitting device with a thermal insulating and refractive index matching material |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200620716A true TW200620716A (en) | 2006-06-16 |
TWI277227B TWI277227B (en) | 2007-03-21 |
Family
ID=36261019
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094134804A TWI298208B (en) | 2004-10-29 | 2005-10-05 | Light emitting device with a thermal insulating and refractive index matching material |
TW094137992A TWI373855B (en) | 2004-10-29 | 2005-10-28 | Led package with structure and materials for high heat dissipation |
TW094137990A TWI277227B (en) | 2004-10-29 | 2005-10-28 | High power LED package with universal bonding pads and interconnect arrangement |
TW094137991A TWI270993B (en) | 2004-10-29 | 2005-10-28 | Method of manufacturing ceramic LED packages |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094134804A TWI298208B (en) | 2004-10-29 | 2005-10-05 | Light emitting device with a thermal insulating and refractive index matching material |
TW094137992A TWI373855B (en) | 2004-10-29 | 2005-10-28 | Led package with structure and materials for high heat dissipation |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094137991A TWI270993B (en) | 2004-10-29 | 2005-10-28 | Method of manufacturing ceramic LED packages |
Country Status (3)
Country | Link |
---|---|
US (1) | US8134292B2 (zh) |
JP (1) | JP2006128700A (zh) |
TW (4) | TWI298208B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI402460B (zh) * | 2010-04-09 | 2013-07-21 | Biao Qin | LED wick and LED chip and manufacturing method |
US8637890B2 (en) | 2009-12-22 | 2014-01-28 | Kabushiki Kaisha Toshiba | Light emitting device |
Families Citing this family (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
KR101256919B1 (ko) * | 2004-05-05 | 2013-04-25 | 렌슬러 폴리테크닉 인스티튜트 | 고체-상태 에미터 및 하향-변환 재료를 이용한 고효율 광소스 |
US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
US8816369B2 (en) | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
US9929326B2 (en) | 2004-10-29 | 2018-03-27 | Ledengin, Inc. | LED package having mushroom-shaped lens with volume diffuser |
JP4634810B2 (ja) * | 2005-01-20 | 2011-02-16 | 信越化学工業株式会社 | シリコーン封止型led |
CN101138104B (zh) * | 2005-06-23 | 2011-08-24 | 伦斯勒工业学院 | 利用短波长led和下变频材料产生白光的封装设计 |
DE102005034793B3 (de) * | 2005-07-21 | 2007-04-19 | G.L.I. Global Light Industries Gmbh | Lichtemittierende Halbleiterdiode hoher Lichtleistung |
DE102005044347A1 (de) * | 2005-09-16 | 2007-03-22 | BSH Bosch und Siemens Hausgeräte GmbH | Beleuchtungsvorrichtung für Backöfen und Backofen |
KR20070033801A (ko) * | 2005-09-22 | 2007-03-27 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
JP2007194525A (ja) * | 2006-01-23 | 2007-08-02 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
JP4952884B2 (ja) * | 2006-01-24 | 2012-06-13 | ソニー株式会社 | 半導体発光装置および半導体発光装置組立体 |
US8969908B2 (en) | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
US20070241661A1 (en) * | 2006-04-12 | 2007-10-18 | Yin Chua B | High light output lamps having a phosphor embedded glass/ceramic layer |
JP2008028100A (ja) * | 2006-07-20 | 2008-02-07 | Lumi Tech:Kk | 発光装置 |
US7943952B2 (en) | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US7703942B2 (en) * | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
TW200816859A (en) | 2006-09-20 | 2008-04-01 | Nikon Corp | Methods of manufacturing optical device and resin-sealed light-emitting device, optical device, resin-sealed light-emitting device and flat lighting device |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
WO2008073400A1 (en) | 2006-12-11 | 2008-06-19 | The Regents Of The University Of California | Transparent light emitting diodes |
US8410500B2 (en) * | 2006-12-21 | 2013-04-02 | Koninklijke Philips Electronics N.V. | Light-emitting apparatus with shaped wavelength converter |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US8232564B2 (en) | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
WO2008105527A1 (ja) * | 2007-03-01 | 2008-09-04 | Nec Lighting, Ltd. | Led装置及び照明装置 |
TW200837982A (en) * | 2007-03-07 | 2008-09-16 | Everlight Electronics Co Ltd | Semiconductor light emitting apparatus and the manufacturing method thereof |
KR100883074B1 (ko) * | 2007-03-21 | 2009-02-10 | 엘지전자 주식회사 | 전계발광소자 |
KR101396585B1 (ko) * | 2007-06-11 | 2014-05-20 | 서울반도체 주식회사 | 탄소나노소재를 함유하는 복합재료층을 갖는 발광 다이오드패키지 |
US10505083B2 (en) | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
WO2009066209A1 (en) * | 2007-11-20 | 2009-05-28 | Koninklijke Philips Electronics N.V. | Collimating light emitting apparatus and method |
TW200924232A (en) * | 2007-11-26 | 2009-06-01 | Lin Pin Ya | Light emitting diode capable of radiating light and dissipating heat in dual directions |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US8167674B2 (en) | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
US8637883B2 (en) | 2008-03-19 | 2014-01-28 | Cree, Inc. | Low index spacer layer in LED devices |
DE102009018087A1 (de) | 2008-04-30 | 2009-12-17 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Diode mit erhöhter Farbstabilität |
US8075165B2 (en) | 2008-10-14 | 2011-12-13 | Ledengin, Inc. | Total internal reflection lens and mechanical retention and locating device |
JP5440064B2 (ja) * | 2008-10-21 | 2014-03-12 | 東芝ライテック株式会社 | 照明装置 |
JP5784308B2 (ja) * | 2008-10-31 | 2015-09-24 | 合同会社ジャパン・メディカル・クリエーティブ | 手術用照明システム |
US20100117106A1 (en) * | 2008-11-07 | 2010-05-13 | Ledengin, Inc. | Led with light-conversion layer |
KR20100087851A (ko) * | 2009-01-29 | 2010-08-06 | 삼성전자주식회사 | 발광 유닛, 이의 제조 방법 및 발광 유닛을 포함하는 광원 장치 |
CN102227827A (zh) * | 2008-11-28 | 2011-10-26 | 株式会社小糸制作所 | 发光模块、发光模块的制造方法以及灯具单元 |
US8507300B2 (en) * | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
TWI573299B (zh) * | 2008-12-31 | 2017-03-01 | 榮創能源科技股份有限公司 | 化合物半導體元件之封裝模組結構及其製造方法 |
US8598793B2 (en) | 2011-05-12 | 2013-12-03 | Ledengin, Inc. | Tuning of emitter with multiple LEDs to a single color bin |
US8384097B2 (en) | 2009-04-08 | 2013-02-26 | Ledengin, Inc. | Package for multiple light emitting diodes |
US7985000B2 (en) * | 2009-04-08 | 2011-07-26 | Ledengin, Inc. | Lighting apparatus having multiple light-emitting diodes with individual light-conversion layers |
JPWO2010123059A1 (ja) * | 2009-04-22 | 2012-10-25 | シーシーエス株式会社 | Led発光デバイスの製造方法 |
DE102009053064A1 (de) * | 2009-11-13 | 2011-05-19 | Osram Opto Semiconductors Gmbh | Dünnfilm-Halbleiterbauelement mit Schutzdiodenstruktur und Verfahren zur Herstellung eines Dünnfilm-Halbleiterbauelements |
TWI381563B (zh) * | 2009-11-20 | 2013-01-01 | Everlight Electronics Co Ltd | 發光二極體封裝及其製作方法 |
TWI398215B (zh) * | 2009-12-14 | 2013-06-01 | Pegatron Corp | 機殼及其製作方法 |
US8303141B2 (en) * | 2009-12-17 | 2012-11-06 | Ledengin, Inc. | Total internal reflection lens with integrated lamp cover |
US8384105B2 (en) | 2010-03-19 | 2013-02-26 | Micron Technology, Inc. | Light emitting diodes with enhanced thermal sinking and associated methods of operation |
US8598612B2 (en) | 2010-03-30 | 2013-12-03 | Micron Technology, Inc. | Light emitting diode thermally enhanced cavity package and method of manufacture |
US8858022B2 (en) | 2011-05-05 | 2014-10-14 | Ledengin, Inc. | Spot TIR lens system for small high-power emitter |
US9345095B2 (en) | 2010-04-08 | 2016-05-17 | Ledengin, Inc. | Tunable multi-LED emitter module |
DE102010021791A1 (de) | 2010-05-27 | 2011-12-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements und eines Verbunds |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
DE102010042217A1 (de) * | 2010-10-08 | 2012-04-12 | Osram Ag | Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
TWI473305B (zh) * | 2011-03-10 | 2015-02-11 | Formosa Epitaxy Inc | Light emitting diode structure |
US20120250320A1 (en) * | 2011-03-31 | 2012-10-04 | Xicato, Inc. | Color conversion cavities for led-based illumination modules |
DE102011016567B4 (de) * | 2011-04-08 | 2023-05-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes Bauelement |
US8513900B2 (en) | 2011-05-12 | 2013-08-20 | Ledengin, Inc. | Apparatus for tuning of emitter with multiple LEDs to a single color bin |
DE102011105010A1 (de) | 2011-06-20 | 2012-12-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
KR20140038553A (ko) | 2011-07-21 | 2014-03-28 | 크리,인코포레이티드 | 향상된 화학적 내성을 위한 발광 장치 패키지들, 부품들 및 방법들 그리고 관련된 방법들 |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
CN102956761B (zh) * | 2011-08-25 | 2015-03-11 | 展晶科技(深圳)有限公司 | 发光二极管的封装方法 |
CN104247060A (zh) * | 2011-12-01 | 2014-12-24 | 克利公司 | 发光器件、具有改进的化学耐性的部件以及相关方法 |
US11032884B2 (en) | 2012-03-02 | 2021-06-08 | Ledengin, Inc. | Method for making tunable multi-led emitter module |
US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
CN102916116B (zh) * | 2012-08-14 | 2015-11-25 | 纳晶科技股份有限公司 | Led光学配件、led灯及led光学配件制备方法 |
US9557215B2 (en) * | 2012-08-17 | 2017-01-31 | Massachusetts Institute Of Technology | Phonon-recyling light-emitting diodes |
TWI502733B (zh) * | 2012-11-02 | 2015-10-01 | 環旭電子股份有限公司 | 電子封裝模組及其製造方法 |
KR102006390B1 (ko) * | 2013-03-11 | 2019-08-01 | 삼성전자주식회사 | 발광 다이오드 패키지의 제조 방법 |
US9234801B2 (en) | 2013-03-15 | 2016-01-12 | Ledengin, Inc. | Manufacturing method for LED emitter with high color consistency |
US20140367816A1 (en) * | 2013-06-12 | 2014-12-18 | Avago Technologies General Ip (Singapore) Pte.Ltd. | Photodetector device having light-collecting optical microstructure |
US9722144B2 (en) | 2013-08-16 | 2017-08-01 | Massachusetts Institute Of Technology | Phonon-recycling light-emitting diodes |
KR101538224B1 (ko) * | 2013-10-11 | 2015-07-22 | 이주혁 | 단열부가 삽입된 엘이디조명 |
US9406654B2 (en) | 2014-01-27 | 2016-08-02 | Ledengin, Inc. | Package for high-power LED devices |
JP6252302B2 (ja) * | 2014-03-28 | 2017-12-27 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP5750538B1 (ja) * | 2014-09-03 | 2015-07-22 | 四国計測工業株式会社 | Led発光装置 |
DE102014112883A1 (de) * | 2014-09-08 | 2016-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
WO2016086180A1 (en) | 2014-11-26 | 2016-06-02 | Ledengin, Inc. | Compact emitter for warm dimming and color tunable lamp |
KR102252994B1 (ko) * | 2014-12-18 | 2021-05-20 | 삼성전자주식회사 | 발광소자 패키지 및 발광소자 패키지용 파장 변환 필름 |
US9530943B2 (en) | 2015-02-27 | 2016-12-27 | Ledengin, Inc. | LED emitter packages with high CRI |
CN105226186B (zh) * | 2015-10-10 | 2018-06-01 | 深圳市华星光电技术有限公司 | 柔性显示装置的制作方法及制得的柔性显示装置 |
CN106848031A (zh) | 2015-12-04 | 2017-06-13 | 财团法人工业技术研究院 | 紫外光发光二极管的封装结构 |
DE102016203162A1 (de) * | 2016-02-29 | 2017-08-31 | Tridonic Jennersdorf Gmbh | CSP LED Modul mit verbesserter Lichtemission |
WO2017151730A1 (en) * | 2016-03-01 | 2017-09-08 | Exergy Dynamics, Inc. | Light emitting diode assemblies utilizing heat sharing from light-conditioning structures for enhanced energy efficiency |
TWI837362B (zh) * | 2016-03-15 | 2024-04-01 | 晶元光電股份有限公司 | 發光模組 |
TWI696300B (zh) | 2016-03-15 | 2020-06-11 | 晶元光電股份有限公司 | 半導體裝置及其製造方法 |
DE102016106833A1 (de) * | 2016-04-13 | 2017-10-19 | Osram Opto Semiconductors Gmbh | Bauelement mit Reflektor und Verfahren zur Herstellung von Bauelementen |
WO2017221777A1 (ja) * | 2016-06-21 | 2017-12-28 | 東レ株式会社 | 発光体、ならびにそれを用いた光源ユニット、ディスプレイおよび照明装置 |
US10219345B2 (en) | 2016-11-10 | 2019-02-26 | Ledengin, Inc. | Tunable LED emitter with continuous spectrum |
CN207969020U (zh) * | 2018-02-06 | 2018-10-12 | 广东欧曼科技股份有限公司 | 低压灯带 |
US10575374B2 (en) | 2018-03-09 | 2020-02-25 | Ledengin, Inc. | Package for flip-chip LEDs with close spacing of LED chips |
CN109301056B (zh) * | 2018-09-30 | 2020-05-19 | 京东方科技集团股份有限公司 | 一种led光源及其制备方法、背光源、显示装置 |
Family Cites Families (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5742120A (en) * | 1996-05-10 | 1998-04-21 | Rebif Corporation | Light-emmiting diode lamp with directional coverage for the emmitted light |
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US6608332B2 (en) * | 1996-07-29 | 2003-08-19 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device and display |
DE19748240C2 (de) * | 1997-10-31 | 2001-05-23 | Fraunhofer Ges Forschung | Verfahren zur korrosionsfesten Beschichtung von Metallsubstraten mittels Plasmapolymerisation und dessen Anwendung |
DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
TW542932B (en) * | 1998-02-09 | 2003-07-21 | Seiko Epson Corp | Liquid crystal panel and electronic appliances |
US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6335548B1 (en) * | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
US6307160B1 (en) * | 1998-10-29 | 2001-10-23 | Agilent Technologies, Inc. | High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method |
US6351069B1 (en) * | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
JP3337000B2 (ja) | 1999-06-07 | 2002-10-21 | サンケン電気株式会社 | 半導体発光装置 |
JP3412152B2 (ja) | 1999-06-08 | 2003-06-03 | サンケン電気株式会社 | 半導体発光装置 |
JP2001057445A (ja) | 1999-08-19 | 2001-02-27 | Rohm Co Ltd | 発光ダイオ−ド |
US6737801B2 (en) * | 2000-06-28 | 2004-05-18 | The Fox Group, Inc. | Integrated color LED chip |
JP3614776B2 (ja) * | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
US6949771B2 (en) * | 2001-04-25 | 2005-09-27 | Agilent Technologies, Inc. | Light source |
US6642652B2 (en) * | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
JP4114331B2 (ja) * | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | 発光装置 |
US20030016899A1 (en) * | 2001-06-18 | 2003-01-23 | Xiantao Yan | Optical components with controlled temperature sensitivity |
US20020191885A1 (en) * | 2001-06-18 | 2002-12-19 | Chi Wu | Optical component having improved warping symmetry |
DE10131698A1 (de) * | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
US6680128B2 (en) * | 2001-09-27 | 2004-01-20 | Agilent Technologies, Inc. | Method of making lead-free solder and solder paste with improved wetting and shelf life |
US20030086674A1 (en) * | 2001-11-05 | 2003-05-08 | Xiantao Yan | Optical components with reduced temperature sensitivity |
US6948840B2 (en) * | 2001-11-16 | 2005-09-27 | Everbrite, Llc | Light emitting diode light bar |
KR100439402B1 (ko) * | 2001-12-24 | 2004-07-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
EP2105977B1 (en) * | 2002-01-28 | 2014-06-25 | Nichia Corporation | Nitride semiconductor element with supporting substrate and method for producing nitride semiconductor element |
US6791116B2 (en) * | 2002-04-30 | 2004-09-14 | Toyoda Gosei Co., Ltd. | Light emitting diode |
US6870311B2 (en) * | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
US20030230977A1 (en) * | 2002-06-12 | 2003-12-18 | Epstein Howard C. | Semiconductor light emitting device with fluoropolymer lens |
JP3761501B2 (ja) * | 2002-07-31 | 2006-03-29 | 本多通信工業株式会社 | 同軸コネクタ及びそれが実装されるグランドパッド |
US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
JP2004153241A (ja) * | 2002-10-11 | 2004-05-27 | Sharp Corp | 半導体発光素子及びその製造方法 |
JP2004140185A (ja) * | 2002-10-17 | 2004-05-13 | Matsushita Electric Ind Co Ltd | 発光装置 |
US7168608B2 (en) * | 2002-12-24 | 2007-01-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | System and method for hermetic seal formation |
JP2004253404A (ja) | 2002-12-24 | 2004-09-09 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP4136693B2 (ja) | 2003-02-07 | 2008-08-20 | 信越化学工業株式会社 | 発光装置及びその製造方法 |
US7199446B1 (en) * | 2003-02-18 | 2007-04-03 | K2 Optronics, Inc. | Stacked electrical resistor pad for optical fiber attachment |
US6835960B2 (en) * | 2003-03-03 | 2004-12-28 | Opto Tech Corporation | Light emitting diode package structure |
JP2004273798A (ja) * | 2003-03-10 | 2004-09-30 | Toyoda Gosei Co Ltd | 発光デバイス |
KR101142725B1 (ko) * | 2003-03-13 | 2012-05-04 | 니치아 카가쿠 고교 가부시키가이샤 | 발광막, 발광장치, 발광막의 제조방법 및 발광장치의제조방법 |
US6903380B2 (en) * | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
US7157745B2 (en) * | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
WO2004114001A1 (en) * | 2003-06-20 | 2004-12-29 | Casio Computer Co., Ltd. | Display device and manufacturing method of the same |
US7391153B2 (en) * | 2003-07-17 | 2008-06-24 | Toyoda Gosei Co., Ltd. | Light emitting device provided with a submount assembly for improved thermal dissipation |
US7157744B2 (en) * | 2003-10-29 | 2007-01-02 | M/A-Com, Inc. | Surface mount package for a high power light emitting diode |
JP4792726B2 (ja) * | 2003-10-30 | 2011-10-12 | 日亜化学工業株式会社 | 半導体素子用支持体の製造方法 |
JP4557542B2 (ja) * | 2003-12-24 | 2010-10-06 | ▲さん▼圓光電股▲ふん▼有限公司 | 窒化物発光装置及び高発光効率窒化物発光装置 |
US7675231B2 (en) * | 2004-02-13 | 2010-03-09 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting diode display device comprising a high temperature resistant overlay |
TWI240423B (en) * | 2004-03-12 | 2005-09-21 | Opto Tech Corp | Light emitting device with high heat dissipation efficiency |
US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
US7868343B2 (en) * | 2004-04-06 | 2011-01-11 | Cree, Inc. | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
US7012328B2 (en) * | 2004-05-14 | 2006-03-14 | Intevac, Inc. | Semiconductor die attachment for high vacuum tubes |
US7064353B2 (en) * | 2004-05-26 | 2006-06-20 | Philips Lumileds Lighting Company, Llc | LED chip with integrated fast switching diode for ESD protection |
US7280288B2 (en) * | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
US7167309B2 (en) * | 2004-06-25 | 2007-01-23 | Northrop Grumman Corporation | Optical compensation of cover glass-air gap-display stack for high ambient lighting |
KR100674827B1 (ko) * | 2004-07-28 | 2007-01-25 | 삼성전기주식회사 | 백라이트 유니트용 led 패키지 |
US7405093B2 (en) * | 2004-08-18 | 2008-07-29 | Cree, Inc. | Methods of assembly for a semiconductor light emitting device package |
US7679672B2 (en) * | 2004-10-14 | 2010-03-16 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Electronic flash, imaging device and method for producing a flash of light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material |
US20060082296A1 (en) * | 2004-10-14 | 2006-04-20 | Chua Janet Bee Y | Mixture of alkaline earth metal thiogallate green phosphor and sulfide red phosphor for phosphor-converted LED |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
US7452737B2 (en) * | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
US7352011B2 (en) * | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
KR20060132298A (ko) * | 2005-06-17 | 2006-12-21 | 삼성전기주식회사 | 발광소자 패키지 |
WO2007002342A2 (en) * | 2005-06-22 | 2007-01-04 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures |
US7646035B2 (en) * | 2006-05-31 | 2010-01-12 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices |
US7479660B2 (en) * | 2005-10-21 | 2009-01-20 | Perkinelmer Elcos Gmbh | Multichip on-board LED illumination device |
KR100665375B1 (ko) * | 2006-02-22 | 2007-01-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
TWI358575B (en) * | 2006-03-17 | 2012-02-21 | Light diffusion reflection sheet with buffering ef | |
JP2007273562A (ja) * | 2006-03-30 | 2007-10-18 | Toshiba Corp | 半導体発光装置 |
US8044418B2 (en) * | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
US7999283B2 (en) * | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
-
2005
- 2005-01-13 US US11/036,559 patent/US8134292B2/en active Active
- 2005-10-05 TW TW094134804A patent/TWI298208B/zh active
- 2005-10-28 TW TW094137992A patent/TWI373855B/zh active
- 2005-10-28 TW TW094137990A patent/TWI277227B/zh active
- 2005-10-28 TW TW094137991A patent/TWI270993B/zh active
- 2005-10-28 JP JP2005315149A patent/JP2006128700A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8637890B2 (en) | 2009-12-22 | 2014-01-28 | Kabushiki Kaisha Toshiba | Light emitting device |
TWI450423B (zh) * | 2009-12-22 | 2014-08-21 | Toshiba Kk | 發光裝置 |
TWI402460B (zh) * | 2010-04-09 | 2013-07-21 | Biao Qin | LED wick and LED chip and manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
TWI277227B (en) | 2007-03-21 |
TWI373855B (en) | 2012-10-01 |
US8134292B2 (en) | 2012-03-13 |
US20060091788A1 (en) | 2006-05-04 |
TW200620717A (en) | 2006-06-16 |
TWI270993B (en) | 2007-01-11 |
TW200633261A (en) | 2006-09-16 |
TWI298208B (en) | 2008-06-21 |
JP2006128700A (ja) | 2006-05-18 |
TW200629600A (en) | 2006-08-16 |
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