TW200617410A - Semiconductor wafer and inspection method thereof - Google Patents

Semiconductor wafer and inspection method thereof

Info

Publication number
TW200617410A
TW200617410A TW094139264A TW94139264A TW200617410A TW 200617410 A TW200617410 A TW 200617410A TW 094139264 A TW094139264 A TW 094139264A TW 94139264 A TW94139264 A TW 94139264A TW 200617410 A TW200617410 A TW 200617410A
Authority
TW
Taiwan
Prior art keywords
electrode terminal
semiconductor wafer
inspection method
damage
portion electrode
Prior art date
Application number
TW094139264A
Other languages
English (en)
Inventor
Masao Takahashi
Yoshirou Nakata
Tadaaki Mimura
Toshihiko Sakashita
Toshiyuki Fukuda
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200617410A publication Critical patent/TW200617410A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW094139264A 2004-11-16 2005-11-09 Semiconductor wafer and inspection method thereof TW200617410A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004331293A JP4570446B2 (ja) 2004-11-16 2004-11-16 半導体ウェハーおよびその検査方法

Publications (1)

Publication Number Publication Date
TW200617410A true TW200617410A (en) 2006-06-01

Family

ID=36385617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139264A TW200617410A (en) 2004-11-16 2005-11-09 Semiconductor wafer and inspection method thereof

Country Status (4)

Country Link
US (1) US7170189B2 (zh)
JP (1) JP4570446B2 (zh)
CN (1) CN100461381C (zh)
TW (1) TW200617410A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400606B (zh) * 2007-06-27 2013-07-01 Semes Co Ltd 用於探針檢測器操作比率之計算系統及其計算方法

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KR100593647B1 (ko) * 2004-05-18 2006-06-28 삼성전자주식회사 프로브 센싱용 패드, 반도체 소자가 탑재된 기판 및 반도체 소자 검사 방법
KR100739629B1 (ko) * 2005-12-02 2007-07-16 삼성전자주식회사 프로브 센싱용 패드 및 이를 이용한 프로브 니들 접촉 위치검사 방법.
JP2007335550A (ja) * 2006-06-14 2007-12-27 Seiko Instruments Inc 半導体装置
JP4995495B2 (ja) * 2006-06-16 2012-08-08 セイコーインスツル株式会社 半導体装置
TWI307406B (en) * 2006-07-06 2009-03-11 Au Optronics Corp Misalignment detection devices
JP4712641B2 (ja) * 2006-08-09 2011-06-29 富士通セミコンダクター株式会社 半導体ウエハとその試験方法
EP2246708A1 (de) * 2009-04-30 2010-11-03 Micronas GmbH Verfahren zur Erstellung einer Defektkarte von auf einem Träger, insbesondere einem Halbleiter-Wafer, befindliche Einzelkomponenten, insbesondere Halbleiter-Bauelementen
IT1397222B1 (it) * 2009-12-30 2013-01-04 St Microelectronics Srl Metodo per controllare il corretto posizionamento di sonde di test su terminazioni di dispositivi elettronici integrati su semiconduttore e relativo dispositivo elettronico.
US8838408B2 (en) 2010-11-11 2014-09-16 Optimal Plus Ltd Misalignment indication decision system and method
CN104181448A (zh) * 2014-08-13 2014-12-03 华进半导体封装先导技术研发中心有限公司 一种硅通孔转接板晶圆测试系统和硅通孔转接板晶圆测试方法
JP7101577B2 (ja) * 2018-09-21 2022-07-15 株式会社日本マイクロニクス 検査方法及び検査システム

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JPS56114349A (en) * 1980-02-15 1981-09-08 Chiyou Lsi Gijutsu Kenkyu Kumiai Detecting method for displacement in testing stage of wafer
JPS63128636A (ja) * 1986-11-18 1988-06-01 Nec Corp 半導体集積回路装置
CA2034702A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Method for packaging semiconductor device
US5321277A (en) * 1990-12-31 1994-06-14 Texas Instruments Incorporated Multi-chip module testing
JPH05343487A (ja) 1992-06-04 1993-12-24 Nec Corp 半導体集積回路装置
JPH0645419A (ja) * 1992-07-21 1994-02-18 Hitachi Ltd 半導体装置
JPH09213759A (ja) * 1996-01-30 1997-08-15 Sony Corp 半導体装置
JP3920399B2 (ja) * 1997-04-25 2007-05-30 株式会社東芝 マルチチップ半導体装置用チップの位置合わせ方法、およびマルチチップ半導体装置の製造方法・製造装置
US6133582A (en) * 1998-05-14 2000-10-17 Lightspeed Semiconductor Corporation Methods and apparatuses for binning partially completed integrated circuits based upon test results
US6329670B1 (en) * 1999-04-06 2001-12-11 Micron Technology, Inc. Conductive material for integrated circuit fabrication
US6133054A (en) * 1999-08-02 2000-10-17 Motorola, Inc. Method and apparatus for testing an integrated circuit
US6380555B1 (en) * 1999-12-24 2002-04-30 Micron Technology, Inc. Bumped semiconductor component having test pads, and method and system for testing bumped semiconductor components
JP2002217258A (ja) * 2001-01-22 2002-08-02 Hitachi Ltd 半導体装置およびその測定方法、ならびに半導体装置の製造方法
US6605525B2 (en) * 2001-05-01 2003-08-12 Industrial Technologies Research Institute Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and package formed
TW503496B (en) * 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
US6781150B2 (en) * 2002-08-28 2004-08-24 Lsi Logic Corporation Test structure for detecting bonding-induced cracks

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400606B (zh) * 2007-06-27 2013-07-01 Semes Co Ltd 用於探針檢測器操作比率之計算系統及其計算方法

Also Published As

Publication number Publication date
JP4570446B2 (ja) 2010-10-27
US20060103408A1 (en) 2006-05-18
JP2006147601A (ja) 2006-06-08
CN1776898A (zh) 2006-05-24
US7170189B2 (en) 2007-01-30
CN100461381C (zh) 2009-02-11

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