JPS56114349A - Detecting method for displacement in testing stage of wafer - Google Patents

Detecting method for displacement in testing stage of wafer

Info

Publication number
JPS56114349A
JPS56114349A JP1766680A JP1766680A JPS56114349A JP S56114349 A JPS56114349 A JP S56114349A JP 1766680 A JP1766680 A JP 1766680A JP 1766680 A JP1766680 A JP 1766680A JP S56114349 A JPS56114349 A JP S56114349A
Authority
JP
Japan
Prior art keywords
probe
displacement
tip
contact
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1766680A
Other languages
Japanese (ja)
Inventor
Tetsuo Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP1766680A priority Critical patent/JPS56114349A/en
Publication of JPS56114349A publication Critical patent/JPS56114349A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To detect a position displacement accurately by a method wherein the contact of a probe for detection with displacement detecting pads is started when a contacting area between the pad and the probe becomes smaller than an area of a tip of a probe, and the existence of continuity with the probe keeping contact with a return pad during contact is utilized. CONSTITUTION:When a displacement occurs in indexing action and a contacting area between a probe 9 and a connecting pad of a semiconductor chip 2 reaches about half of an area of a tip section, the contact of a tip of a probe 10 for detection with either of pads 51-54 for detecting the displacement is started, and the tip of the probe 10 is conducted with a pad 6 for return through the corresponding electric circuits of electric circuits 71-74. Thus, the indexing direction in which the displacement is generated can easily by detected by means of a comparator circuit.
JP1766680A 1980-02-15 1980-02-15 Detecting method for displacement in testing stage of wafer Pending JPS56114349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1766680A JPS56114349A (en) 1980-02-15 1980-02-15 Detecting method for displacement in testing stage of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1766680A JPS56114349A (en) 1980-02-15 1980-02-15 Detecting method for displacement in testing stage of wafer

Publications (1)

Publication Number Publication Date
JPS56114349A true JPS56114349A (en) 1981-09-08

Family

ID=11950170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1766680A Pending JPS56114349A (en) 1980-02-15 1980-02-15 Detecting method for displacement in testing stage of wafer

Country Status (1)

Country Link
JP (1) JPS56114349A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59226167A (en) * 1983-06-04 1984-12-19 Dainippon Screen Mfg Co Ltd Surface treating device for circuit board
JPS6030147A (en) * 1983-07-28 1985-02-15 Nec Corp Semiconductor wafer
JPS60142526A (en) * 1983-12-29 1985-07-27 Toshiba Corp Measurement of electrical characteristics of semiconductor element
JPH02137350A (en) * 1988-11-18 1990-05-25 Nec Corp Semiconductor integrated circuit
JP2005333128A (en) * 2004-05-18 2005-12-02 Samsung Electronics Co Ltd Probe pad, substrate having semiconductor device, method of testing semiconductor device and tester for testing semiconductor device
JP2006147601A (en) * 2004-11-16 2006-06-08 Matsushita Electric Ind Co Ltd Semiconductor wafer and method of inspecting it
JP2007158346A (en) * 2005-12-02 2007-06-21 Samsung Electronics Co Ltd Probe sensing pad and method of detecting contact position of probe needle
JP2007335550A (en) * 2006-06-14 2007-12-27 Seiko Instruments Inc Semiconductor device
KR100897982B1 (en) 2007-09-27 2009-05-18 주식회사 동부하이텍 Miss align preventing pattern and method thereof between probe card niddle and pad

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318972A (en) * 1976-08-05 1978-02-21 Nec Corp Monitoring method of wafer positioning state by probes
JPS5688333A (en) * 1979-12-21 1981-07-17 Hitachi Ltd Detecting method of relative position between probe and contact

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318972A (en) * 1976-08-05 1978-02-21 Nec Corp Monitoring method of wafer positioning state by probes
JPS5688333A (en) * 1979-12-21 1981-07-17 Hitachi Ltd Detecting method of relative position between probe and contact

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59226167A (en) * 1983-06-04 1984-12-19 Dainippon Screen Mfg Co Ltd Surface treating device for circuit board
JPS6030147A (en) * 1983-07-28 1985-02-15 Nec Corp Semiconductor wafer
JPS60142526A (en) * 1983-12-29 1985-07-27 Toshiba Corp Measurement of electrical characteristics of semiconductor element
JPH02137350A (en) * 1988-11-18 1990-05-25 Nec Corp Semiconductor integrated circuit
JP2005333128A (en) * 2004-05-18 2005-12-02 Samsung Electronics Co Ltd Probe pad, substrate having semiconductor device, method of testing semiconductor device and tester for testing semiconductor device
JP2006147601A (en) * 2004-11-16 2006-06-08 Matsushita Electric Ind Co Ltd Semiconductor wafer and method of inspecting it
JP4570446B2 (en) * 2004-11-16 2010-10-27 パナソニック株式会社 Semiconductor wafer and inspection method thereof
US7612573B2 (en) 2005-05-17 2009-11-03 Samsung Electronics Co., Ltd. Probe sensing pads and methods of detecting positions of probe needles relative to probe sensing pads
JP2007158346A (en) * 2005-12-02 2007-06-21 Samsung Electronics Co Ltd Probe sensing pad and method of detecting contact position of probe needle
KR100739629B1 (en) 2005-12-02 2007-07-16 삼성전자주식회사 Pad for probe sensing and method for inspection contact site of probe needle using the same
JP2007335550A (en) * 2006-06-14 2007-12-27 Seiko Instruments Inc Semiconductor device
KR100897982B1 (en) 2007-09-27 2009-05-18 주식회사 동부하이텍 Miss align preventing pattern and method thereof between probe card niddle and pad

Similar Documents

Publication Publication Date Title
KR19980087379A (en) Method for detecting the contact position between the object to be measured and the measuring pin and semiconductor test system using the method
KR920004847A (en) Contact detecting device of electric circuit measuring probe and electric circuit measuring device using this contact detecting device
JPS56114349A (en) Detecting method for displacement in testing stage of wafer
JPS57106062A (en) Package for integrated circuit
KR890012370A (en) Semiconductor devices
JPS5688333A (en) Detecting method of relative position between probe and contact
KR200169688Y1 (en) Test device of semiconductor wafer
JPH0480529B2 (en)
JPS5776854A (en) Semiconductor device
JPS54148485A (en) Test method for semiconductor device
JPS5843535A (en) Semiconductor wafer
SU712981A1 (en) Contact device
JPS5688343A (en) Multichip type semiconductor package
JPS6425087A (en) Sensor
KR100231481B1 (en) Probe pad
JPS57114866A (en) Measuring device of semiconductor device
JPS5717873A (en) Inspection method of semiconductor element
JPS52128071A (en) Automatic test unit
SU538346A1 (en) Contact monitoring device
JPS6030147A (en) Semiconductor wafer
JPS55120147A (en) Semiconductor substrate detector
JPS5947737A (en) Measuring apparatus for semiconductor device
JPS6225433A (en) Semiconductor element characteristic measuring device
JPS56138934A (en) Testing device
JPS5574153A (en) Chip detection method at semiconductor device test