TW200613908A - Photosensitive resin composition and lcd using the same - Google Patents

Photosensitive resin composition and lcd using the same

Info

Publication number
TW200613908A
TW200613908A TW094117621A TW94117621A TW200613908A TW 200613908 A TW200613908 A TW 200613908A TW 094117621 A TW094117621 A TW 094117621A TW 94117621 A TW94117621 A TW 94117621A TW 200613908 A TW200613908 A TW 200613908A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
lcd
same
compound
Prior art date
Application number
TW094117621A
Other languages
English (en)
Other versions
TWI307450B (en
Inventor
Dong-Seok Kim
Yong-Sik Ahn
Kyung-Jun Kim
Seung-Hee Lee
Il-Eok Kwon
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW200613908A publication Critical patent/TW200613908A/zh
Application granted granted Critical
Publication of TWI307450B publication Critical patent/TWI307450B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
TW094117621A 2004-05-31 2005-05-30 Photosensitive resin composition and lcd using the same TWI307450B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040039211A KR100596364B1 (ko) 2004-05-31 2004-05-31 감광성 수지 조성물 및 이를 이용하여 제조된 액정표시소자

Publications (2)

Publication Number Publication Date
TW200613908A true TW200613908A (en) 2006-05-01
TWI307450B TWI307450B (en) 2009-03-11

Family

ID=35425728

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117621A TWI307450B (en) 2004-05-31 2005-05-30 Photosensitive resin composition and lcd using the same

Country Status (7)

Country Link
US (1) US20050266341A1 (zh)
EP (1) EP1751620A4 (zh)
JP (1) JP4354995B2 (zh)
KR (1) KR100596364B1 (zh)
CN (1) CN1842743A (zh)
TW (1) TWI307450B (zh)
WO (1) WO2005116765A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5224030B2 (ja) * 2007-03-22 2013-07-03 Ｊｓｒ株式会社 熱硬化性樹脂組成物、保護膜および保護膜の形成方法
CN101762980B (zh) * 2008-12-24 2013-10-09 株式会社Lg化学 用于同时形成两种独立的柱状间隔物图案的组合物
CN102372826A (zh) * 2010-08-12 2012-03-14 株式会社Lg化学 用于保护膜的热固化树脂组合物
JP6098113B2 (ja) * 2011-11-09 2017-03-22 住友化学株式会社 着色感光性樹脂組成物
KR101630487B1 (ko) 2012-10-10 2016-06-14 주식회사 엘지화학 열경화성 조성물 및 이를 이용한 박막
US11054743B2 (en) * 2015-12-15 2021-07-06 Changzhou Tronly Advanced Electronic Materials Co., Ltd. Fluorene polyfunctional photoinitiator and preparation and use thereof, and photosensitive resin composition containing fluorene photoinitiator and use thereof
EP3514135B1 (en) 2016-09-13 2021-04-21 Changzhou Tronly Advanced Electronic Materials Co., Ltd. Fluorene photoinitiator, preparation method therefor, photocurable composition having same, and use of same in photocuring field
JP7032416B2 (ja) 2017-02-17 2022-03-08 常州強力先端電子材料有限公司 フルオレニルアミノケトン類光開始剤、その調製方法及びフルオレニルアミノケトン類光開始剤を含有するｕｖ光硬化性組成物
JP6689434B1 (ja) * 2019-02-06 2020-04-28 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944615B2 (ja) * 1976-02-16 1984-10-31 富士写真フイルム株式会社 感光性樹脂組成物及びそれを用いた金属画像形成材料
JPS6398651A (ja) * 1986-10-15 1988-04-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性積層体
JPS63147159A (ja) * 1986-12-11 1988-06-20 Fuji Photo Film Co Ltd 光重合性組成物
EP0613165B1 (en) * 1993-02-24 1997-05-14 Sony Corporation Method of manufacturing a discharge chamber
KR100334484B1 (ko) * 1994-12-28 2002-12-06 제온 코포레이션 포지티브형레지스트조성물
JPH0996906A (ja) * 1995-10-02 1997-04-08 Konica Corp 感光性組成物並びに感光性平版印刷版及びその現像方法
JP3613491B2 (ja) * 1996-06-04 2005-01-26 富士写真フイルム株式会社 感光性組成物
JP3695024B2 (ja) * 1996-11-14 2005-09-14 Ｊｓｒ株式会社 半導体デバイス製造用感放射線性樹脂組成物
JP3993691B2 (ja) * 1997-09-24 2007-10-17 関西ペイント株式会社 レジストパターン形成方法
US6756165B2 (en) * 2000-04-25 2004-06-29 Jsr Corporation Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element
JP4029556B2 (ja) * 2000-11-01 2008-01-09 Ｊｓｒ株式会社 感光性絶縁樹脂組成物およびその硬化物
JP4262917B2 (ja) * 2001-06-13 2009-05-13 旭化成エレクトロニクス株式会社 感光性樹脂層への露光方法
US6743563B2 (en) * 2001-08-15 2004-06-01 Shipley Company, L.L.C. Photoresist compositions
JP3967947B2 (ja) * 2002-03-29 2007-08-29 富士フイルム株式会社 染料含有ネガ型硬化性組成物、カラーフィルタ及びその製造方法
JP4232410B2 (ja) * 2002-08-19 2009-03-04 チッソ株式会社 光硬化性樹脂組成物およびそれを用いた表示素子

Also Published As

Publication number Publication date
EP1751620A4 (en) 2012-01-11
JP2007507743A (ja) 2007-03-29
TWI307450B (en) 2009-03-11
CN1842743A (zh) 2006-10-04
EP1751620A1 (en) 2007-02-14
KR20050114019A (ko) 2005-12-05
KR100596364B1 (ko) 2006-07-03
JP4354995B2 (ja) 2009-10-28
US20050266341A1 (en) 2005-12-01
WO2005116765A1 (en) 2005-12-08

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