TW200611107A - Heat dissipation module - Google Patents

Heat dissipation module

Info

Publication number
TW200611107A
TW200611107A TW093129135A TW93129135A TW200611107A TW 200611107 A TW200611107 A TW 200611107A TW 093129135 A TW093129135 A TW 093129135A TW 93129135 A TW93129135 A TW 93129135A TW 200611107 A TW200611107 A TW 200611107A
Authority
TW
Taiwan
Prior art keywords
pair
heat dissipation
top board
dissipation module
hole
Prior art date
Application number
TW093129135A
Other languages
English (en)
Chinese (zh)
Other versions
TWI315462B (enExample
Inventor
Jung-An Lin
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW093129135A priority Critical patent/TW200611107A/zh
Priority to US11/213,822 priority patent/US20060067056A1/en
Publication of TW200611107A publication Critical patent/TW200611107A/zh
Application granted granted Critical
Publication of TWI315462B publication Critical patent/TWI315462B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW093129135A 2004-09-24 2004-09-24 Heat dissipation module TW200611107A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093129135A TW200611107A (en) 2004-09-24 2004-09-24 Heat dissipation module
US11/213,822 US20060067056A1 (en) 2004-09-24 2005-08-30 Heat dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093129135A TW200611107A (en) 2004-09-24 2004-09-24 Heat dissipation module

Publications (2)

Publication Number Publication Date
TW200611107A true TW200611107A (en) 2006-04-01
TWI315462B TWI315462B (enExample) 2009-10-01

Family

ID=36098814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129135A TW200611107A (en) 2004-09-24 2004-09-24 Heat dissipation module

Country Status (2)

Country Link
US (1) US20060067056A1 (enExample)
TW (1) TW200611107A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7289330B2 (en) * 2005-11-10 2007-10-30 Fu Shun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fan mounting device
US20080128110A1 (en) * 2006-11-30 2008-06-05 Foxconn Technology Co., Ltd. Heat sink assembly having a fan mounting device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW590268U (en) * 2000-08-08 2004-06-01 Wistron Corp Heat dissipating device
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
US6459584B1 (en) * 2001-12-13 2002-10-01 Kuo Yung-Pin Fixing frame for positioning heat dispensing device of computers
TW586741U (en) * 2002-03-29 2004-05-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
US6950306B2 (en) * 2002-05-10 2005-09-27 Delta Electronics, Inc. Connection frame for fan
US6785137B2 (en) * 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US20050195573A1 (en) * 2004-03-04 2005-09-08 Huang Ming T. Heat dissipation module for a CPU

Also Published As

Publication number Publication date
TWI315462B (enExample) 2009-10-01
US20060067056A1 (en) 2006-03-30

Similar Documents

Publication Publication Date Title
ATE388487T1 (de) Vorrichtung zur kühlung von halbleiterbauteilen auf leiterplatten
WO2003090278A3 (en) Dual-sided heat removal system
ATE407546T1 (de) Wärmeabfuhrsystem für tragbare elektronische vorrichtungen
ATE373946T1 (de) Integriertes kühlsystem für elektronische geräte
TWI265775B (en) Portable electronic device and heat dissipation method and cradle thereof
NO20084351L (no) Baererlegeme for komponenter og kretser
TW200622567A (en) Fluid cooled integrated circuit module
TW200701871A (en) Heat dissipation device
TW200721950A (en) Heat dissipation device
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
RU2007143050A (ru) Модульное электронное устройство для работы в суровых условиях
JP2006164274A (ja) 携帯型コンピュータ電源システム
EP1637974A3 (en) Heatsink
WO2006121478A3 (en) System component interposer
WO2006071500A3 (en) Heat sink and component support assembly
WO2008142758A1 (ja) 電力用半導体モジュール
SE0203370D0 (sv) Anordning
ITTO20020416A0 (it) Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.
FI20021027A7 (fi) Jäähdytinelementti elektroniikkalaitteeseen
GB201208816D0 (en) Printed circuit board heatsink mounting
SE0502703L (sv) Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare
GB2392010B (en) Cooling device for semiconductor modules
TW200706098A (en) An electronic device with sliding type heatsink
TW200640349A (en) Electronic device
WO2005117107A3 (de) Leistungshalbleitermodul und verfahren zum kühlen eines leistungshalbleitermoduls

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent