TWI315462B - - Google Patents

Info

Publication number
TWI315462B
TWI315462B TW093129135A TW93129135A TWI315462B TW I315462 B TWI315462 B TW I315462B TW 093129135 A TW093129135 A TW 093129135A TW 93129135 A TW93129135 A TW 93129135A TW I315462 B TWI315462 B TW I315462B
Authority
TW
Taiwan
Application number
TW093129135A
Other languages
Chinese (zh)
Other versions
TW200611107A (en
Inventor
Jung An Lin
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW093129135A priority Critical patent/TW200611107A/zh
Priority to US11/213,822 priority patent/US20060067056A1/en
Publication of TW200611107A publication Critical patent/TW200611107A/zh
Application granted granted Critical
Publication of TWI315462B publication Critical patent/TWI315462B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
TW093129135A 2004-09-24 2004-09-24 Heat dissipation module TW200611107A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093129135A TW200611107A (en) 2004-09-24 2004-09-24 Heat dissipation module
US11/213,822 US20060067056A1 (en) 2004-09-24 2005-08-30 Heat dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093129135A TW200611107A (en) 2004-09-24 2004-09-24 Heat dissipation module

Publications (2)

Publication Number Publication Date
TW200611107A TW200611107A (en) 2006-04-01
TWI315462B true TWI315462B (enExample) 2009-10-01

Family

ID=36098814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129135A TW200611107A (en) 2004-09-24 2004-09-24 Heat dissipation module

Country Status (2)

Country Link
US (1) US20060067056A1 (enExample)
TW (1) TW200611107A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7289330B2 (en) * 2005-11-10 2007-10-30 Fu Shun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fan mounting device
US20080128110A1 (en) * 2006-11-30 2008-06-05 Foxconn Technology Co., Ltd. Heat sink assembly having a fan mounting device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW590268U (en) * 2000-08-08 2004-06-01 Wistron Corp Heat dissipating device
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
US6459584B1 (en) * 2001-12-13 2002-10-01 Kuo Yung-Pin Fixing frame for positioning heat dispensing device of computers
TW586741U (en) * 2002-03-29 2004-05-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
US6950306B2 (en) * 2002-05-10 2005-09-27 Delta Electronics, Inc. Connection frame for fan
US6785137B2 (en) * 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US20050195573A1 (en) * 2004-03-04 2005-09-08 Huang Ming T. Heat dissipation module for a CPU

Also Published As

Publication number Publication date
US20060067056A1 (en) 2006-03-30
TW200611107A (en) 2006-04-01

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent