US20060067056A1 - Heat dissipating module - Google Patents

Heat dissipating module Download PDF

Info

Publication number
US20060067056A1
US20060067056A1 US11/213,822 US21382205A US2006067056A1 US 20060067056 A1 US20060067056 A1 US 20060067056A1 US 21382205 A US21382205 A US 21382205A US 2006067056 A1 US2006067056 A1 US 2006067056A1
Authority
US
United States
Prior art keywords
heat dissipating
dissipating module
holding element
fixing
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/213,822
Other languages
English (en)
Inventor
Chung-An Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Technologies Inc
Original Assignee
Via Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Technologies Inc filed Critical Via Technologies Inc
Assigned to VIA TECHNOLOGIES, INC. reassignment VIA TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, CHUNG-AN
Publication of US20060067056A1 publication Critical patent/US20060067056A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Definitions

  • the present invention relates to a heat dissipating module, and in particular, to a heat dissipating module with a plurality of holding elements to fix a fan onto a heat sink rapidly and stably.
  • the heat dissipating module is generally sequentially disposed a heat sink on the chip and a fan on the heat sink to dissipate the heat through the forced air convection.
  • a conventional heat dissipating module 9 includes a heat sink 92 and a fan 94 .
  • the heat sink 92 has a plurality of screw holes 920 disposed at the bottom portion.
  • the fan 94 is fixed on the heat sink 92 by a plurality of long screws 96 threading through the fan 94 and the fin 922 in order to respectively screw the screws 96 to the screw holes 920 .
  • lots of extra work to the heat sink including the process of forming the screw holes and the process of removing the fins on the screw holes are needed to perform. The higher the fin is, the longer the screw is needed. Thus, that leads a complicated fabrication and affects the support.
  • the fan is screwed onto the fixing plate, then the periphery of the fixing plate is correspondingly screwed onto the peripheral fins of the heat sink.
  • the construction needs thicker peripheral fins, and the fixing plate may affect air convection and may be loosed by the screw stripping.
  • the present invention is to provide a heat dissipating module with a plurality of holding elements and fixing elements to rapidly and stably fix a fan onto a heat sink for simplifying the assembly and saving manual cost.
  • a heat dissipating module includes a heat sink, a fan, a plurality of holding elements and a plurality of fixing elements.
  • the heat sink has a plurality parallel of fins extended outwards.
  • the fan is disposed on the fins and has a plurality of fixing holes.
  • the holding elements are respectively disposed on the two adjacent fins.
  • the holding element includes a top portion and two side portions respectively extended toward to the heat sink from two corresponding sides of the top portion, and the top portion has at least one through hole.
  • the fixing elements respectively thread through the fixing hole and the through hole and the side portions of the holding element.
  • the fixing element and the respective holding element clamp the two adjacent fins, wherein the side portion of the holding element has a plurality of interference parts in at least one internal side.
  • a heat dissipating module simplifies the assembly and saving manual cost.
  • FIG. 1 is a lateral composed view showing a conventional heat dissipating module
  • FIG. 2 is a three-dimensional decomposed view showing a heat dissipating module according to the present invention
  • FIG. 3 is a lateral composed view showing a heat dissipating module according to the present invention.
  • FIG. 3A is a partial lateral composed view showing another heat dissipating module according to the present invention.
  • FIG. 4 is a three-dimensional decomposed view showing the other heat dissipating module according to the present invention.
  • a heat dissipating module 1 includes a heat sink 10 , a plurality of holding elements 20 , a fan 30 and a plurality of fixing elements 40 .
  • the heat sink 10 has a plurality parallel of fins 12 extended outward. More particularly, the heat sink 10 has a bottom portion and a plurality of fins extended against the bottom portion. In this embodiment, the heat sink 10 is formed by extrusion molding with a distance 14 between two adjacent fins 12 .
  • the holding elements 20 are respectively disposed on the two adjacent fins 12 .
  • the holding element 20 includes a top portion 22 and two side portions 24 respectively extended from two corresponding sides of the top portion 22 , and the top portion 22 has at least one through hole 220 .
  • the diameter of the through hole 220 of the holding element 20 is slightly greater than the distance 14 between the two adjacent fins 12 .
  • the length of the side portion 24 of the holding element 20 is slightly equal to that of the fin 12 .
  • the top portion 22 of the holding element 20 has a rectangular opening 26 at the inner zone for passing the rising air flow.
  • Two through holes 220 are respectively disposed aside the opening 26 for reducing the amount of the holding element 20 within the heat dissipating module 1 .
  • the holding element 20 is formed by stamping metal sheet and is in a U shape after stamping. Fabrication by stamping is easy and cost effective.
  • the thickness of the side portion 24 of the holding element 20 should be less than or equal to the distance 14 between the two adjacent fins 12 .
  • the interval between the side portions 24 of the holding element 20 is equal to the width of the two adjacent fins 12 plus the distance 14 between the two adjacent fins 12 .
  • the fan 30 is disposed on the fins 12 and has a plurality of fixing holes 32 .
  • the fan 30 has four fixing holes 32 .
  • the fixing elements 40 respectively sequentially thread through the fixing hole 32 and the through hole 220 for fixing the fan 30 onto the heat sink 10 .
  • the amount of the fixing elements 40 is disposed corresponding to that of the fixing hole 32 .
  • the side portions 24 of the holding element 20 hold the fixing element 40 between the two adjacent fins 12 to avoid the fixing element 40 separating from the heat sink 10 .
  • the fixing element 40 is a screw.
  • the screw portion of the screw is slightly greater than the distance 14 between the two adjacent fins 12 .
  • the side portion 24 of the holding element 20 is interfered with the two adjacent fins 12 by the screw portion.
  • One of the side portion 24 of the holding element 20 and the screw portion of the screws clamp a fin 12 .
  • the fixing element 40 may not be an ordinary screw.
  • the fixing element 40 is higher than the fan 30 .
  • the height of the holding element 20 is at least equal to the protruding length of the fixing element 40 against the fan 30 .
  • the internal side of the side portion 24 of another holding element 20 a has a plurality of interference parts 242 .
  • the interference parts 242 can enhance the fixing between the holding element 20 a and the heat sink 10 .
  • Another fixing element 40 a of the heat dissipating module 1 is a plug, like a screw bolt with no screw portion.
  • the fixing element 40 a has a plurality of barbs 42 lodged between the fins 12 . Therefore, the fixing element 40 a is directly pushed into the two adjacent fins 12 rather than screwing, then the fixing element 40 a according to the present invention can simplify and speedup the assembly.
  • the holding element 20 of the heat dissipating module 1 according to the present invention can reduce the fabricating processes of the heat sink 10 and tight the fixing element 40 between the two adjacent fins 12 by interference for fixing the fan 30 onto the heat sink 10 .
  • the holding element according to the present invention is not limitative to the embodiment disclosed herein above.
  • the other heat dissipating module according to the present invention provides a simplified holding element 20 b .
  • the holding element 20 b includes a shorter top portion 22 and two side portions 24 respectively extended from two corresponding sides of the top portion 22 , and the top portion 22 has only one through hole 220 .
  • the present invention achieves excellent functions and results as follows:
  • a heat dissipating module By disposing a plurality of holding elements and fixing elements to rapidly and stably fix a fan onto a heat sink, a heat dissipating module according to the present invention avoids screw from sliding and loosing;
  • the holding element according to the present invention is easy to make and simplifies the assembly, reduce the fabricating processes of the heat sink, and saving fabricating time and cost.

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
US11/213,822 2004-09-24 2005-08-30 Heat dissipating module Abandoned US20060067056A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW093129135A TW200611107A (en) 2004-09-24 2004-09-24 Heat dissipation module
TW093129135 2004-09-24

Publications (1)

Publication Number Publication Date
US20060067056A1 true US20060067056A1 (en) 2006-03-30

Family

ID=36098814

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/213,822 Abandoned US20060067056A1 (en) 2004-09-24 2005-08-30 Heat dissipating module

Country Status (2)

Country Link
US (1) US20060067056A1 (enExample)
TW (1) TW200611107A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070103872A1 (en) * 2005-11-10 2007-05-10 Cui-Jun Lu Heat sink assembly having a fan mounting device
US20080128110A1 (en) * 2006-11-30 2008-06-05 Foxconn Technology Co., Ltd. Heat sink assembly having a fan mounting device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020018336A1 (en) * 2000-08-08 2002-02-14 Liang C. Y. Heat sink apparatus
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
US6459584B1 (en) * 2001-12-13 2002-10-01 Kuo Yung-Pin Fixing frame for positioning heat dispensing device of computers
US20030184971A1 (en) * 2002-03-29 2003-10-02 Wow Wu Heat sink assembly with fixing members
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US6785137B2 (en) * 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device
US20050195573A1 (en) * 2004-03-04 2005-09-08 Huang Ming T. Heat dissipation module for a CPU
US6950306B2 (en) * 2002-05-10 2005-09-27 Delta Electronics, Inc. Connection frame for fan

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020018336A1 (en) * 2000-08-08 2002-02-14 Liang C. Y. Heat sink apparatus
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
US6459584B1 (en) * 2001-12-13 2002-10-01 Kuo Yung-Pin Fixing frame for positioning heat dispensing device of computers
US20030184971A1 (en) * 2002-03-29 2003-10-02 Wow Wu Heat sink assembly with fixing members
US6950306B2 (en) * 2002-05-10 2005-09-27 Delta Electronics, Inc. Connection frame for fan
US6785137B2 (en) * 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US20050195573A1 (en) * 2004-03-04 2005-09-08 Huang Ming T. Heat dissipation module for a CPU

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070103872A1 (en) * 2005-11-10 2007-05-10 Cui-Jun Lu Heat sink assembly having a fan mounting device
US7289330B2 (en) * 2005-11-10 2007-10-30 Fu Shun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fan mounting device
US20080128110A1 (en) * 2006-11-30 2008-06-05 Foxconn Technology Co., Ltd. Heat sink assembly having a fan mounting device

Also Published As

Publication number Publication date
TWI315462B (enExample) 2009-10-01
TW200611107A (en) 2006-04-01

Similar Documents

Publication Publication Date Title
US7443679B2 (en) Heat dissipating device having a fin also functioning as a fan holder
US7163050B2 (en) Heat dissipating device
US7489513B2 (en) Heat dissipation device
US6199625B1 (en) Stackable heat sink for electronic components
US7385813B2 (en) Assembly structure for securing heat-dissipating fan
US7764503B2 (en) Heat dissipation device
US6722418B2 (en) Heat sink assembly with guiding vanes
US20090059525A1 (en) Heat dissipation device for computer add-on cards
CN101583257B (zh) 固定装置组合
US20080068805A1 (en) Heat sink assembly for multiple electronic components
US6542369B1 (en) Fixing frame for CPU cooling devices
CN101594765A (zh) 散热装置及其固定结构
US20110114295A1 (en) Heat dissipation module
US20070103872A1 (en) Heat sink assembly having a fan mounting device
US7342791B2 (en) Locking device for heat sink
US20040194927A1 (en) Fan holder
US8120920B2 (en) Computer system with heat sink
US7589967B2 (en) Heat dissipation device
US6515860B1 (en) CPU heat sink fastener
US8622119B2 (en) Fixing frame and heat dissipation device using the same
US20040109301A1 (en) Cooling device for an integrated circuit
US6678158B2 (en) Heat sink assembly with fixing device
US20080128110A1 (en) Heat sink assembly having a fan mounting device
US7423873B2 (en) Heat dissipation device having fan holder for attachment of a fan
US20080223567A1 (en) Heat Dissipating Device

Legal Events

Date Code Title Description
AS Assignment

Owner name: VIA TECHNOLOGIES, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, CHUNG-AN;REEL/FRAME:016921/0157

Effective date: 20050720

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION