ATE373946T1 - Integriertes kühlsystem für elektronische geräte - Google Patents

Integriertes kühlsystem für elektronische geräte

Info

Publication number
ATE373946T1
ATE373946T1 AT05076577T AT05076577T ATE373946T1 AT E373946 T1 ATE373946 T1 AT E373946T1 AT 05076577 T AT05076577 T AT 05076577T AT 05076577 T AT05076577 T AT 05076577T AT E373946 T1 ATE373946 T1 AT E373946T1
Authority
AT
Austria
Prior art keywords
cooling system
base
integrated cooling
fluid
fluid channel
Prior art date
Application number
AT05076577T
Other languages
English (en)
Inventor
Shih-Chia Chang
Carl W Berlin
Bruce A Myers
Ray M Fairchild
Darrel E Peugh
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE373946T1 publication Critical patent/ATE373946T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT05076577T 2004-08-16 2005-07-11 Integriertes kühlsystem für elektronische geräte ATE373946T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/919,168 US7215547B2 (en) 2004-08-16 2004-08-16 Integrated cooling system for electronic devices

Publications (1)

Publication Number Publication Date
ATE373946T1 true ATE373946T1 (de) 2007-10-15

Family

ID=35344670

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05076577T ATE373946T1 (de) 2004-08-16 2005-07-11 Integriertes kühlsystem für elektronische geräte

Country Status (4)

Country Link
US (1) US7215547B2 (de)
EP (1) EP1628515B1 (de)
AT (1) ATE373946T1 (de)
DE (1) DE602005002507T2 (de)

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US7795726B2 (en) * 2007-05-03 2010-09-14 Delphi Technologies, Inc. Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
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US7782616B1 (en) 2009-04-23 2010-08-24 Delphi Technologies, Inc. Heat-dissipating component having stair-stepped coolant channels
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JPWO2011004556A1 (ja) * 2009-07-06 2012-12-13 株式会社フジクラ 貫通配線基板及びその製造方法
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US8837159B1 (en) * 2009-10-28 2014-09-16 Amazon Technologies, Inc. Low-profile circuit board assembly
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US20130186109A1 (en) * 2010-07-27 2013-07-25 Indian Institute Of Technology Bombay Counter flow heat exchanger for a miniature joule-thomson cryocooler
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DE102010056010B4 (de) 2010-12-23 2019-08-01 Volkswagen Ag Gehäuse, Doppelgehäuse und Anordnung zur Aufnahme von elektrischen oder elektronischen Bauteilen und Verfahren zur Kühlung
US8730673B2 (en) * 2011-05-27 2014-05-20 Lockheed Martin Corporation Fluid-cooled module for integrated circuit devices
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US10502991B2 (en) 2015-02-05 2019-12-10 The Arizona Board Of Regents On Behalf Of Arizona State University Origami displays and methods for their manufacture
DE112016001221T5 (de) 2015-03-16 2017-12-21 Dana Canada Corporation Wärmetauscher mit Oberflächenmuster aufweisenden Platten zur Verbesserung der Ebenheit und Verfahren zum Herstellen derselben
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US11282767B2 (en) * 2019-02-15 2022-03-22 Advanced Semicondutor Engineering, Inc. Semiconductor package structure and electronic device
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CN111867281B (zh) * 2020-08-31 2021-11-05 生益电子股份有限公司 一种高效散热的pcb的制作方法
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Also Published As

Publication number Publication date
DE602005002507D1 (de) 2007-10-31
DE602005002507T2 (de) 2008-06-12
US20060034052A1 (en) 2006-02-16
EP1628515B1 (de) 2007-09-19
EP1628515A1 (de) 2006-02-22
US7215547B2 (en) 2007-05-08

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Legal Events

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