TW200616182A - A cooling system for electronic substrates - Google Patents
A cooling system for electronic substratesInfo
- Publication number
- TW200616182A TW200616182A TW094126271A TW94126271A TW200616182A TW 200616182 A TW200616182 A TW 200616182A TW 094126271 A TW094126271 A TW 094126271A TW 94126271 A TW94126271 A TW 94126271A TW 200616182 A TW200616182 A TW 200616182A
- Authority
- TW
- Taiwan
- Prior art keywords
- cooling system
- electronic substrates
- heat transfer
- transfer fluid
- electronic
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Measuring And Other Instruments (AREA)
Abstract
The present invention relates to a cooling system for an electronic substrate comprising a heat transfer fluid (4, 10). The heat transfer fluid (4, 10) is arranged to flow along a path (5, 11, 12) by capillary force.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04103775 | 2004-08-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200616182A true TW200616182A (en) | 2006-05-16 |
Family
ID=35457651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094126271A TW200616182A (en) | 2004-08-05 | 2005-08-02 | A cooling system for electronic substrates |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090008064A1 (en) |
EP (1) | EP1797388A1 (en) |
JP (1) | JP2008509550A (en) |
KR (1) | KR20070040835A (en) |
CN (1) | CN1993596B (en) |
TW (1) | TW200616182A (en) |
WO (1) | WO2006016293A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8232637B2 (en) * | 2009-04-30 | 2012-07-31 | General Electric Company | Insulated metal substrates incorporating advanced cooling |
FR2950134B1 (en) * | 2009-09-14 | 2011-12-09 | Commissariat Energie Atomique | THERMAL EXCHANGE DEVICE WITH ENHANCED CONVECTIVE BOILING AND IMPROVED EFFICIENCY |
FR2950133B1 (en) * | 2009-09-14 | 2011-12-09 | Commissariat Energie Atomique | THERMAL EXCHANGE DEVICE WITH IMPROVED EFFICIENCY |
US8290147B2 (en) * | 2009-10-30 | 2012-10-16 | General Dynamics C4 Systems, Inc. | Systems and methods for efficiently creating digests of digital data |
TWI506238B (en) * | 2009-12-29 | 2015-11-01 | Foxconn Tech Co Ltd | Micro liquid cooling device |
EP2395549B1 (en) * | 2010-06-10 | 2014-06-25 | Imec | Device for cooling integrated circuits |
US9146596B2 (en) | 2012-04-10 | 2015-09-29 | Google Inc. | Apparatus and methods for thermal management of a computing device |
US8848371B2 (en) * | 2012-10-01 | 2014-09-30 | Hamilton Sundstrand Corporation | Dielectrophoretic restriction to prevent vapor backflow |
EP2713393B1 (en) * | 2012-10-01 | 2018-01-31 | Hamilton Sundstrand Corporation | Dielectrophoretic cooling solution for electronics |
US9030824B2 (en) | 2012-10-02 | 2015-05-12 | Hamilton Sundstrand Corporation | Dielectrophoretic cooling solution for electronics |
US9038407B2 (en) * | 2012-10-03 | 2015-05-26 | Hamilton Sundstrand Corporation | Electro-hydrodynamic cooling with enhanced heat transfer surfaces |
WO2015142607A1 (en) * | 2014-03-21 | 2015-09-24 | Board Of Regents, The University Of Texas System | Heat pipes with electrical pumping of condensate |
WO2018161462A1 (en) * | 2017-03-08 | 2018-09-13 | 华为技术有限公司 | Flat plate heat pipe, micro-channel heat dissipation system and terminal |
US10375855B2 (en) * | 2017-11-08 | 2019-08-06 | Honeywell International Inc. | Systems and methods for zero power automatic thermal regulation |
CN112944952A (en) * | 2021-01-28 | 2021-06-11 | 中山大学 | Sweating cooling system aiming at high-temperature surface thermal protection and thermal control |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3682239A (en) * | 1971-02-25 | 1972-08-08 | Momtaz M Abu Romia | Electrokinetic heat pipe |
US4396055A (en) * | 1981-01-19 | 1983-08-02 | The United States Of America As Represented By The Secretary Of The Navy | Electrohydrodynamic inductively pumped heat pipe |
JPH02136698A (en) * | 1988-11-18 | 1990-05-25 | Agency Of Ind Science & Technol | Heat transfer promoting device in convection heat transfer surface |
US5769155A (en) * | 1996-06-28 | 1998-06-23 | University Of Maryland | Electrohydrodynamic enhancement of heat transfer |
KR100294317B1 (en) * | 1999-06-04 | 2001-06-15 | 이정현 | Micro-cooling system |
KR100338810B1 (en) * | 1999-11-08 | 2002-05-31 | 윤종용 | cooling device |
WO2002028160A2 (en) * | 2000-09-29 | 2002-04-04 | Nanostream, Inc. | Microfluidic devices for heat transfer |
KR100398309B1 (en) * | 2001-02-20 | 2003-09-19 | 한국과학기술원 | Micropump actuated by the movement of liquid drop induced by continuous electrowetting |
US6443704B1 (en) * | 2001-03-02 | 2002-09-03 | Jafar Darabi | Electrohydrodynamicly enhanced micro cooling system for integrated circuits |
US6672373B2 (en) * | 2001-08-27 | 2004-01-06 | Idalex Technologies, Inc. | Method of action of the pulsating heat pipe, its construction and the devices on its base |
TW200306402A (en) * | 2001-12-21 | 2003-11-16 | Tth Res Inc | Loop heat pipe method and apparatus |
US6888721B1 (en) * | 2002-10-18 | 2005-05-03 | Atec Corporation | Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes |
WO2004042307A2 (en) * | 2002-11-05 | 2004-05-21 | Thar Technologies, Inc | Methods and apparatuses for electronics cooling |
CN2591775Y (en) * | 2002-12-06 | 2003-12-10 | 威盛电子股份有限公司 | Thin flat heat pipe radiator |
JP2004190978A (en) * | 2002-12-12 | 2004-07-08 | Sony Corp | Heat transport device and electronic device |
TW559460U (en) * | 2002-12-12 | 2003-10-21 | Ind Tech Res Inst | Enhanced heat conductance structure configured with electrodes |
US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
US6863118B1 (en) * | 2004-02-12 | 2005-03-08 | Hon Hai Precision Ind. Co., Ltd. | Micro grooved heat pipe |
-
2005
- 2005-07-21 WO PCT/IB2005/052461 patent/WO2006016293A1/en active Application Filing
- 2005-07-21 EP EP05784825A patent/EP1797388A1/en not_active Withdrawn
- 2005-07-21 JP JP2007524439A patent/JP2008509550A/en active Pending
- 2005-07-21 US US11/573,002 patent/US20090008064A1/en not_active Abandoned
- 2005-07-21 CN CN2005800262361A patent/CN1993596B/en not_active Expired - Fee Related
- 2005-07-21 KR KR1020077005230A patent/KR20070040835A/en not_active Application Discontinuation
- 2005-08-02 TW TW094126271A patent/TW200616182A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1993596A (en) | 2007-07-04 |
KR20070040835A (en) | 2007-04-17 |
EP1797388A1 (en) | 2007-06-20 |
JP2008509550A (en) | 2008-03-27 |
CN1993596B (en) | 2011-04-20 |
WO2006016293A1 (en) | 2006-02-16 |
US20090008064A1 (en) | 2009-01-08 |
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