ATE414992T1 - Elektroosmotische pumpen und mikrokanäle - Google Patents

Elektroosmotische pumpen und mikrokanäle

Info

Publication number
ATE414992T1
ATE414992T1 AT03787126T AT03787126T ATE414992T1 AT E414992 T1 ATE414992 T1 AT E414992T1 AT 03787126 T AT03787126 T AT 03787126T AT 03787126 T AT03787126 T AT 03787126T AT E414992 T1 ATE414992 T1 AT E414992T1
Authority
AT
Austria
Prior art keywords
microchannels
electroosmotic pumps
pumps
micro
channels
Prior art date
Application number
AT03787126T
Other languages
English (en)
Inventor
Sarah Kim
R List
James Maveety
Alan Myers
Quat Vu
Ravi Prasher
Ravindranath Mahajan
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE414992T1 publication Critical patent/ATE414992T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
AT03787126T 2002-12-18 2003-11-24 Elektroosmotische pumpen und mikrokanäle ATE414992T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/323,084 US6981849B2 (en) 2002-12-18 2002-12-18 Electro-osmotic pumps and micro-channels

Publications (1)

Publication Number Publication Date
ATE414992T1 true ATE414992T1 (de) 2008-12-15

Family

ID=32593106

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03787126T ATE414992T1 (de) 2002-12-18 2003-11-24 Elektroosmotische pumpen und mikrokanäle

Country Status (9)

Country Link
US (1) US6981849B2 (de)
EP (1) EP1573807B1 (de)
KR (1) KR100807448B1 (de)
CN (1) CN101427368A (de)
AT (1) ATE414992T1 (de)
AU (1) AU2003295912A1 (de)
DE (1) DE60324836D1 (de)
TW (1) TWI242865B (de)
WO (1) WO2004061958A1 (de)

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US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6881039B2 (en) 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
US7086839B2 (en) 2002-09-23 2006-08-08 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US7108056B1 (en) * 2002-10-18 2006-09-19 Atec Advanced Thermal And Environmental Concepts Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7316543B2 (en) * 2003-05-30 2008-01-08 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic micropump with planar features
TW591984B (en) * 2003-07-04 2004-06-11 Sentelic Corp Micro-circulating flow channel system and its manufacturing method
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7723208B2 (en) * 2003-09-24 2010-05-25 Intel Corporation Integrated re-combiner for electroosmotic pumps using porous frits
US7084495B2 (en) * 2003-10-16 2006-08-01 Intel Corporation Electroosmotic pumps using porous frits for cooling integrated circuit stacks
US7115987B2 (en) * 2003-12-31 2006-10-03 Intel Corporation Integrated stacked microchannel heat exchanger and heat spreader
US7355277B2 (en) * 2003-12-31 2008-04-08 Intel Corporation Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
US20080102119A1 (en) * 2006-11-01 2008-05-01 Medtronic, Inc. Osmotic pump apparatus and associated methods
US7139172B2 (en) * 2004-07-01 2006-11-21 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
CN100561602C (zh) * 2004-07-16 2009-11-18 鸿富锦精密工业（深圳）有限公司 聚热元件
TWI278426B (en) * 2004-12-30 2007-04-11 Prec Instr Dev Ct Nat Composite plate device for thermal transpiration micropump
JP4218677B2 (ja) * 2005-03-08 2009-02-04 セイコーエプソン株式会社 マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
TWI299609B (en) * 2005-09-26 2008-08-01 Ind Tech Res Inst Electro-kinetic micro pumps by using the nano porous membrane
US8273075B2 (en) * 2005-12-13 2012-09-25 The Invention Science Fund I, Llc Osmotic pump with remotely controlled osmotic flow rate
US8083710B2 (en) * 2006-03-09 2011-12-27 The Invention Science Fund I, Llc Acoustically controlled substance delivery device
US20070106271A1 (en) * 2005-11-09 2007-05-10 Searete Llc, A Limited Liability Corporation Remote control of substance delivery system
US9067047B2 (en) 2005-11-09 2015-06-30 The Invention Science Fund I, Llc Injectable controlled release fluid delivery system
US8992511B2 (en) 2005-11-09 2015-03-31 The Invention Science Fund I, Llc Acoustically controlled substance delivery device
US20070106275A1 (en) 2005-11-09 2007-05-10 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Reaction device controlled by RF control signal
US20070106277A1 (en) * 2005-11-09 2007-05-10 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Remote controller for substance delivery system
US8936590B2 (en) * 2005-11-09 2015-01-20 The Invention Science Fund I, Llc Acoustically controlled reaction device
US8273071B2 (en) * 2006-01-18 2012-09-25 The Invention Science Fund I, Llc Remote controller for substance delivery system
US20080140057A1 (en) * 2006-03-09 2008-06-12 Searete Llc, A Limited Liability Corporation Of State Of The Delaware Injectable controlled release fluid delivery system
JP5034396B2 (ja) * 2006-09-14 2012-09-26 カシオ計算機株式会社 電気浸透材の支持構造、電気浸透流ポンプ、発電装置及び電子機器
US20100187682A1 (en) * 2006-09-21 2010-07-29 Damaruganath Pinjala Electronic package and method of assembling the same
JP4893195B2 (ja) 2006-09-27 2012-03-07 カシオ計算機株式会社 送液装置の接続構造体、燃料電池型発電装置及び電子機器
CN101374397B (zh) * 2007-08-24 2010-08-25 富准精密工业(深圳)有限公司 微型液体冷却装置及其所采用的微液滴产生器
US8173080B2 (en) 2008-02-14 2012-05-08 Illumina, Inc. Flow cells and manifolds having an electroosmotic pump
WO2010117874A2 (en) * 2009-04-05 2010-10-14 Microstaq, Inc. Method and structure for optimizing heat exchanger performance
US9052724B2 (en) * 2012-08-07 2015-06-09 International Business Machines Corporation Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof
US9038407B2 (en) 2012-10-03 2015-05-26 Hamilton Sundstrand Corporation Electro-hydrodynamic cooling with enhanced heat transfer surfaces
CN105189338B (zh) * 2013-01-15 2017-04-26 西江大学校产学协力团 使用可逆电极反应的电渗透泵以及使用它的流体泵送系统
WO2017059382A1 (en) 2015-09-30 2017-04-06 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US12255123B2 (en) 2015-09-30 2025-03-18 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
JP2020186658A (ja) * 2019-05-10 2020-11-19 株式会社村田製作所 冷却モジュール及び回路基板
CN110681419B (zh) 2019-09-11 2021-06-15 杭州未名信科科技有限公司 电渗微泵装置及电渗微泵装置组
US20210280497A1 (en) * 2020-03-05 2021-09-09 Intel Corporation Modular technique for die-level liquid cooling
CN114025468A (zh) * 2021-11-08 2022-02-08 京东方科技集团股份有限公司 集成有无源器件的基板和电子设备

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JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
JP2852152B2 (ja) * 1992-02-06 1999-01-27 甲府日本電気株式会社 電子装置の冷却装置
US5846396A (en) * 1994-11-10 1998-12-08 Sarnoff Corporation Liquid distribution system
US6052284A (en) * 1996-08-06 2000-04-18 Advantest Corporation Printed circuit board with electronic devices mounted thereon
US6533554B1 (en) * 1999-11-01 2003-03-18 University Of Southern California Thermal transpiration pump
US6301109B1 (en) * 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
AU2002211389A1 (en) * 2000-10-03 2002-04-15 California Institute Of Technology Microfluidic devices and methods of use
US6443704B1 (en) * 2001-03-02 2002-09-03 Jafar Darabi Electrohydrodynamicly enhanced micro cooling system for integrated circuits
US20020163781A1 (en) * 2001-05-01 2002-11-07 Ericsson Inc. Integrated cooling of a printed circuit board structure
US6711017B2 (en) * 2001-07-17 2004-03-23 Hitachi Kokusai Electric Inc. Cooling apparatus for electronic unit
US20030030981A1 (en) * 2001-08-09 2003-02-13 Jon Zuo Method and apparatus for pumped liquid cooling
US20040013536A1 (en) * 2001-08-31 2004-01-22 Hower Robert W Micro-fluidic pump
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system

Also Published As

Publication number Publication date
EP1573807B1 (de) 2008-11-19
CN101427368A (zh) 2009-05-06
KR100807448B1 (ko) 2008-02-25
TW200425441A (en) 2004-11-16
US6981849B2 (en) 2006-01-03
EP1573807A1 (de) 2005-09-14
US20040120827A1 (en) 2004-06-24
HK1076541A1 (en) 2006-01-20
KR20050089059A (ko) 2005-09-07
DE60324836D1 (de) 2009-01-02
AU2003295912A1 (en) 2004-07-29
TWI242865B (en) 2005-11-01
WO2004061958A1 (en) 2004-07-22

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