ATE414992T1 - Elektroosmotische pumpen und mikrokanäle - Google Patents
Elektroosmotische pumpen und mikrokanäleInfo
- Publication number
- ATE414992T1 ATE414992T1 AT03787126T AT03787126T ATE414992T1 AT E414992 T1 ATE414992 T1 AT E414992T1 AT 03787126 T AT03787126 T AT 03787126T AT 03787126 T AT03787126 T AT 03787126T AT E414992 T1 ATE414992 T1 AT E414992T1
- Authority
- AT
- Austria
- Prior art keywords
- microchannels
- electroosmotic pumps
- pumps
- micro
- channels
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
- F04B19/006—Micropumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/323,084 US6981849B2 (en) | 2002-12-18 | 2002-12-18 | Electro-osmotic pumps and micro-channels |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE414992T1 true ATE414992T1 (de) | 2008-12-15 |
Family
ID=32593106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03787126T ATE414992T1 (de) | 2002-12-18 | 2003-11-24 | Elektroosmotische pumpen und mikrokanäle |
Country Status (10)
Country | Link |
---|---|
US (1) | US6981849B2 (de) |
EP (1) | EP1573807B1 (de) |
KR (1) | KR100807448B1 (de) |
CN (1) | CN101427368A (de) |
AT (1) | ATE414992T1 (de) |
AU (1) | AU2003295912A1 (de) |
DE (1) | DE60324836D1 (de) |
HK (1) | HK1076541A1 (de) |
TW (1) | TWI242865B (de) |
WO (1) | WO2004061958A1 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US6606251B1 (en) * | 2002-02-07 | 2003-08-12 | Cooligy Inc. | Power conditioning module |
US7108056B1 (en) * | 2002-10-18 | 2006-09-19 | Atec Advanced Thermal And Environmental Concepts | Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator |
US7201012B2 (en) * | 2003-01-31 | 2007-04-10 | Cooligy, Inc. | Remedies to prevent cracking in a liquid system |
US7044196B2 (en) * | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US7316543B2 (en) * | 2003-05-30 | 2008-01-08 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic micropump with planar features |
TW591984B (en) * | 2003-07-04 | 2004-06-11 | Sentelic Corp | Micro-circulating flow channel system and its manufacturing method |
US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US7723208B2 (en) * | 2003-09-24 | 2010-05-25 | Intel Corporation | Integrated re-combiner for electroosmotic pumps using porous frits |
US7084495B2 (en) * | 2003-10-16 | 2006-08-01 | Intel Corporation | Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
US7355277B2 (en) * | 2003-12-31 | 2008-04-08 | Intel Corporation | Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
US7115987B2 (en) * | 2003-12-31 | 2006-10-03 | Intel Corporation | Integrated stacked microchannel heat exchanger and heat spreader |
US20080102119A1 (en) * | 2006-11-01 | 2008-05-01 | Medtronic, Inc. | Osmotic pump apparatus and associated methods |
US7139172B2 (en) * | 2004-07-01 | 2006-11-21 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
CN100561602C (zh) * | 2004-07-16 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 聚热元件 |
TWI278426B (en) * | 2004-12-30 | 2007-04-11 | Prec Instr Dev Ct Nat | Composite plate device for thermal transpiration micropump |
JP4218677B2 (ja) * | 2005-03-08 | 2009-02-04 | セイコーエプソン株式会社 | マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ |
TWI299609B (en) * | 2005-09-26 | 2008-08-01 | Ind Tech Res Inst | Electro-kinetic micro pumps by using the nano porous membrane |
US9067047B2 (en) | 2005-11-09 | 2015-06-30 | The Invention Science Fund I, Llc | Injectable controlled release fluid delivery system |
US20070106277A1 (en) * | 2005-11-09 | 2007-05-10 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Remote controller for substance delivery system |
US8936590B2 (en) * | 2005-11-09 | 2015-01-20 | The Invention Science Fund I, Llc | Acoustically controlled reaction device |
US8992511B2 (en) * | 2005-11-09 | 2015-03-31 | The Invention Science Fund I, Llc | Acoustically controlled substance delivery device |
US8083710B2 (en) * | 2006-03-09 | 2011-12-27 | The Invention Science Fund I, Llc | Acoustically controlled substance delivery device |
US8617141B2 (en) * | 2005-11-09 | 2013-12-31 | The Invention Science Fund I, Llc | Remote controlled in situ reaction device |
US8273071B2 (en) * | 2006-01-18 | 2012-09-25 | The Invention Science Fund I, Llc | Remote controller for substance delivery system |
US8998886B2 (en) * | 2005-12-13 | 2015-04-07 | The Invention Science Fund I, Llc | Remote control of osmotic pump device |
US8882747B2 (en) * | 2005-11-09 | 2014-11-11 | The Invention Science Fund I, Llc | Substance delivery system |
US20080140057A1 (en) * | 2006-03-09 | 2008-06-12 | Searete Llc, A Limited Liability Corporation Of State Of The Delaware | Injectable controlled release fluid delivery system |
JP5034396B2 (ja) * | 2006-09-14 | 2012-09-26 | カシオ計算機株式会社 | 電気浸透材の支持構造、電気浸透流ポンプ、発電装置及び電子機器 |
WO2008036052A1 (en) * | 2006-09-21 | 2008-03-27 | Agency For Science, Technology And Research | Electronic package and method of assembling the same |
JP4893195B2 (ja) | 2006-09-27 | 2012-03-07 | カシオ計算機株式会社 | 送液装置の接続構造体、燃料電池型発電装置及び電子機器 |
CN101374397B (zh) * | 2007-08-24 | 2010-08-25 | 富准精密工业(深圳)有限公司 | 微型液体冷却装置及其所采用的微液滴产生器 |
US8173080B2 (en) | 2008-02-14 | 2012-05-08 | Illumina, Inc. | Flow cells and manifolds having an electroosmotic pump |
WO2010117874A2 (en) * | 2009-04-05 | 2010-10-14 | Microstaq, Inc. | Method and structure for optimizing heat exchanger performance |
US9052724B2 (en) * | 2012-08-07 | 2015-06-09 | International Business Machines Corporation | Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof |
US9038407B2 (en) | 2012-10-03 | 2015-05-26 | Hamilton Sundstrand Corporation | Electro-hydrodynamic cooling with enhanced heat transfer surfaces |
CN105189338B (zh) * | 2013-01-15 | 2017-04-26 | 西江大学校产学协力团 | 使用可逆电极反应的电渗透泵以及使用它的流体泵送系统 |
WO2017059382A1 (en) | 2015-09-30 | 2017-04-06 | Microfabrica Inc. | Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems |
JP2020186658A (ja) * | 2019-05-10 | 2020-11-19 | 株式会社村田製作所 | 冷却モジュール及び回路基板 |
CN110681419B (zh) * | 2019-09-11 | 2021-06-15 | 杭州未名信科科技有限公司 | 电渗微泵装置及电渗微泵装置组 |
US20210280497A1 (en) * | 2020-03-05 | 2021-09-09 | Intel Corporation | Modular technique for die-level liquid cooling |
CN114025468A (zh) * | 2021-11-08 | 2022-02-08 | 京东方科技集团股份有限公司 | 集成有无源器件的基板和电子设备 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2708495B2 (ja) * | 1988-09-19 | 1998-02-04 | 株式会社日立製作所 | 半導体冷却装置 |
CA2053055C (en) * | 1990-10-11 | 1997-02-25 | Tsukasa Mizuno | Liquid cooling system for lsi packages |
JP2852152B2 (ja) * | 1992-02-06 | 1999-01-27 | 甲府日本電気株式会社 | 電子装置の冷却装置 |
AU705351B2 (en) | 1994-11-10 | 1999-05-20 | Orchid Biosciences, Inc. | Liquid distribution system |
MY115676A (en) | 1996-08-06 | 2003-08-30 | Advantest Corp | Printed circuit board with electronic devices mounted thereon |
US6533554B1 (en) * | 1999-11-01 | 2003-03-18 | University Of Southern California | Thermal transpiration pump |
US6301109B1 (en) * | 2000-02-11 | 2001-10-09 | International Business Machines Corporation | Isothermal heat sink with cross-flow openings between channels |
EP1322936A2 (de) | 2000-10-03 | 2003-07-02 | California Institute Of Technology | Mikrofluidvorrichtungen und verwendungsverfahren |
US6443704B1 (en) * | 2001-03-02 | 2002-09-03 | Jafar Darabi | Electrohydrodynamicly enhanced micro cooling system for integrated circuits |
US20020163781A1 (en) * | 2001-05-01 | 2002-11-07 | Ericsson Inc. | Integrated cooling of a printed circuit board structure |
US6711017B2 (en) * | 2001-07-17 | 2004-03-23 | Hitachi Kokusai Electric Inc. | Cooling apparatus for electronic unit |
US20030030981A1 (en) * | 2001-08-09 | 2003-02-13 | Jon Zuo | Method and apparatus for pumped liquid cooling |
US20040013536A1 (en) * | 2001-08-31 | 2004-01-22 | Hower Robert W | Micro-fluidic pump |
US6942018B2 (en) | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
-
2002
- 2002-12-18 US US10/323,084 patent/US6981849B2/en not_active Expired - Fee Related
-
2003
- 2003-11-24 CN CNA2003801061591A patent/CN101427368A/zh active Pending
- 2003-11-24 KR KR1020057011449A patent/KR100807448B1/ko not_active IP Right Cessation
- 2003-11-24 WO PCT/US2003/037628 patent/WO2004061958A1/en not_active Application Discontinuation
- 2003-11-24 AU AU2003295912A patent/AU2003295912A1/en not_active Abandoned
- 2003-11-24 EP EP03787126A patent/EP1573807B1/de not_active Expired - Lifetime
- 2003-11-24 AT AT03787126T patent/ATE414992T1/de not_active IP Right Cessation
- 2003-11-24 DE DE60324836T patent/DE60324836D1/de not_active Expired - Lifetime
- 2003-11-27 TW TW092133423A patent/TWI242865B/zh not_active IP Right Cessation
-
2005
- 2005-09-22 HK HK05108353.9A patent/HK1076541A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20040120827A1 (en) | 2004-06-24 |
TWI242865B (en) | 2005-11-01 |
KR100807448B1 (ko) | 2008-02-25 |
WO2004061958A1 (en) | 2004-07-22 |
CN101427368A (zh) | 2009-05-06 |
US6981849B2 (en) | 2006-01-03 |
AU2003295912A1 (en) | 2004-07-29 |
TW200425441A (en) | 2004-11-16 |
HK1076541A1 (en) | 2006-01-20 |
EP1573807A1 (de) | 2005-09-14 |
DE60324836D1 (de) | 2009-01-02 |
EP1573807B1 (de) | 2008-11-19 |
KR20050089059A (ko) | 2005-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |