BR112012032351A2 - aparelho para uso poço abaixo incluindo dispositivos tendo canais portadores - Google Patents

aparelho para uso poço abaixo incluindo dispositivos tendo canais portadores

Info

Publication number
BR112012032351A2
BR112012032351A2 BR112012032351A BR112012032351A BR112012032351A2 BR 112012032351 A2 BR112012032351 A2 BR 112012032351A2 BR 112012032351 A BR112012032351 A BR 112012032351A BR 112012032351 A BR112012032351 A BR 112012032351A BR 112012032351 A2 BR112012032351 A2 BR 112012032351A2
Authority
BR
Brazil
Prior art keywords
substrate
well below
including devices
use well
carrier channels
Prior art date
Application number
BR112012032351A
Other languages
English (en)
Inventor
Lehr Joerg
Overmeyer Ludger
Schwarze Sascha
Jung Sebastian
Kruhn Tobias
Original Assignee
Baker Hughes Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker Hughes Inc filed Critical Baker Hughes Inc
Publication of BR112012032351A2 publication Critical patent/BR112012032351A2/pt

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B36/00—Heating, cooling or insulating arrangements for boreholes or wells, e.g. for use in permafrost zones
    • E21B36/001—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)

Abstract

aparelho para uso poço abaixo incluindo dispositivos tendo canais portadores. a presente invenção refere-se a um método e um aparelho para a regulagem de uma temperatura de um dispositivo em uma ferramenta usada em um furo de poço que são expostos. o dispositivo geralmente inclui um substrato e uma fonte de calor associada ao subsrato que induz calor no substrato. o substrato inclui um canal de fluido ali. um sistema de fluido provê o fluido para o canal de fluido para controle da temperatura do componente.
BR112012032351A 2010-06-18 2011-06-17 aparelho para uso poço abaixo incluindo dispositivos tendo canais portadores BR112012032351A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35643410P 2010-06-18 2010-06-18
PCT/US2011/040924 WO2011160046A2 (en) 2010-06-18 2011-06-17 Apparatus for use downhole including devices having heat carrier channels

Publications (1)

Publication Number Publication Date
BR112012032351A2 true BR112012032351A2 (pt) 2019-09-24

Family

ID=45327650

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012032351A BR112012032351A2 (pt) 2010-06-18 2011-06-17 aparelho para uso poço abaixo incluindo dispositivos tendo canais portadores

Country Status (6)

Country Link
US (1) US20110308791A1 (pt)
AU (1) AU2011268130B2 (pt)
BR (1) BR112012032351A2 (pt)
GB (1) GB2494094A (pt)
NO (1) NO20130005A1 (pt)
WO (1) WO2011160046A2 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9125305B2 (en) * 2010-03-17 2015-09-01 Delta Design, Inc. Devices with pneumatic, hydraulic and electrical components
DE102012106244B4 (de) * 2012-07-11 2020-02-20 Rogers Germany Gmbh Metall-Keramik-Substrat
US9353618B2 (en) * 2012-10-31 2016-05-31 Baker Hughes Incorporated Apparatus and methods for cooling downhole devices
US9611723B2 (en) * 2014-12-17 2017-04-04 Schlumberger Technology Corporation Heat transferring electronics chassis
AT518472B1 (de) * 2016-04-13 2018-04-15 Zkw Group Gmbh Bauteilkühlvorrichtung sowie Kraftfahrzeugscheinwerfer mit Bauteilkühlvorrichtung
US11396794B2 (en) * 2018-05-29 2022-07-26 Baker Hughes, A Ge Company, Llc Device temperature gradient control
US11640929B2 (en) * 2018-12-20 2023-05-02 Intel Corporation Thermal management solutions for cored substrates

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5730217A (en) * 1994-09-12 1998-03-24 Pes, Inc. Vacuum insulated converter for extending the life span of electronic components
US5931000A (en) * 1998-04-23 1999-08-03 Turner; William Evans Cooled electrical system for use downhole
JP3961843B2 (ja) * 2002-02-08 2007-08-22 株式会社日立製作所 液体冷却システムを有する小型電子計算機
US6665185B1 (en) * 2002-10-09 2003-12-16 Ltx Corporation Apparatus and method for embedded fluid cooling in printed circuit boards
US7017622B2 (en) * 2002-12-03 2006-03-28 Forhealth Technologies, Inc. Automated means for removing, parking and replacing a syringe tip cap from a syringe
US6769487B2 (en) * 2002-12-11 2004-08-03 Schlumberger Technology Corporation Apparatus and method for actively cooling instrumentation in a high temperature environment
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7215547B2 (en) * 2004-08-16 2007-05-08 Delphi Technologies, Inc. Integrated cooling system for electronic devices
US7308795B2 (en) * 2004-12-08 2007-12-18 Hall David R Method and system for cooling electrical components downhole
US20060144619A1 (en) * 2005-01-06 2006-07-06 Halliburton Energy Services, Inc. Thermal management apparatus, systems, and methods
EP1761114A3 (en) * 2005-08-31 2009-09-16 Kabushiki Kaisha Toyota Jidoshokki Circuit board
TW200735308A (en) * 2005-12-23 2007-09-16 Koninkl Philips Electronics Nv On-chip interconnect-stack cooling using sacrificial interconnect segments
US7298623B1 (en) * 2006-06-29 2007-11-20 International Business Machines Corporation Organic substrate with integral thermal dissipation channels, and method for producing same
US7806173B2 (en) * 2007-06-21 2010-10-05 Schlumberger Technology Corporation Apparatus and methods to dissipate heat in a downhole tool
JP5032269B2 (ja) * 2007-11-02 2012-09-26 東京エレクトロン株式会社 被処理基板の温度調節装置及び温度調節方法、並びにこれを備えたプラズマ処理装置
US8820397B2 (en) * 2009-04-27 2014-09-02 Halliburton Energy Services, Inc. Thermal component temperature management system and method
US8567500B2 (en) * 2009-10-06 2013-10-29 Schlumberger Technology Corporation Cooling apparatus and methods for use with downhole tools

Also Published As

Publication number Publication date
AU2011268130B2 (en) 2017-02-02
WO2011160046A3 (en) 2012-02-16
AU2011268130A1 (en) 2013-01-17
NO20130005A1 (no) 2013-01-14
WO2011160046A2 (en) 2011-12-22
US20110308791A1 (en) 2011-12-22
GB201223430D0 (en) 2013-02-06
GB2494094A (en) 2013-02-27

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.