FI20021027A7 - Jäähdytinelementti elektroniikkalaitteeseen - Google Patents

Jäähdytinelementti elektroniikkalaitteeseen Download PDF

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Publication number
FI20021027A7
FI20021027A7 FI20021027A FI20021027A FI20021027A7 FI 20021027 A7 FI20021027 A7 FI 20021027A7 FI 20021027 A FI20021027 A FI 20021027A FI 20021027 A FI20021027 A FI 20021027A FI 20021027 A7 FI20021027 A7 FI 20021027A7
Authority
FI
Finland
Prior art keywords
electronic device
cooling element
members
distribution members
heat
Prior art date
Application number
FI20021027A
Other languages
English (en)
Swedish (sv)
Other versions
FI20021027A0 (fi
Inventor
Per Sandberg
Tommy Larsson
Liangyou Tang
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Priority to FI20021027A priority Critical patent/FI20021027A7/fi
Publication of FI20021027A0 publication Critical patent/FI20021027A0/fi
Priority to TW092114150A priority patent/TW200401601A/zh
Priority to CN03812536.6A priority patent/CN1284434C/zh
Priority to JP2004510301A priority patent/JP4170982B2/ja
Priority to EP03732600A priority patent/EP1510113A1/en
Priority to AU2003238531A priority patent/AU2003238531A1/en
Priority to US10/514,368 priority patent/US20050217824A1/en
Priority to PCT/FI2003/000415 priority patent/WO2003103360A1/en
Publication of FI20021027A7 publication Critical patent/FI20021027A7/fi

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Keksintö kohdistuu jäähdytyselementtiin, jota käytetään heatsinkkinä elektroniikkalaitteessa, kuten mikroprosessoriin ja joka käsittää alustaelimen (2,12,22,32), joka on kiinnitetty elektroniikkalaitteeseen (1,11,21,31) ja joka on varustettu toiselta puoleltaan lämmön jakoelimillä (3,17,23) ja puhaltimen tukielimillä (6,15,25,35), jotka on asennettu jakoelimien (3,17,23,33) keskelle muodostettuun aukkoon, ja elimillä synnyttämään ilmavirtaus lämmönsiirtoa varten. Keksinnön mukaisesti ainakin yksi uloke-elin (4,18,28,38) on asennettu kahden vierekkäisen jakoelimen (3,17,23,33) väliseen tilaan.
FI20021027A 2002-05-31 2002-05-31 Jäähdytinelementti elektroniikkalaitteeseen FI20021027A7 (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20021027A FI20021027A7 (fi) 2002-05-31 2002-05-31 Jäähdytinelementti elektroniikkalaitteeseen
TW092114150A TW200401601A (en) 2002-05-31 2003-05-26 Cooling element for an electronic device
CN03812536.6A CN1284434C (zh) 2002-05-31 2003-05-28 用于电子器件的冷却元件
JP2004510301A JP4170982B2 (ja) 2002-05-31 2003-05-28 電子装置用冷却エレメント
EP03732600A EP1510113A1 (en) 2002-05-31 2003-05-28 Cooling element for an electronic device
AU2003238531A AU2003238531A1 (en) 2002-05-31 2003-05-28 Cooling element for an electronic device
US10/514,368 US20050217824A1 (en) 2002-05-31 2003-05-28 Cooling element for an electronic device
PCT/FI2003/000415 WO2003103360A1 (en) 2002-05-31 2003-05-28 Cooling element for an electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20021027A FI20021027A7 (fi) 2002-05-31 2002-05-31 Jäähdytinelementti elektroniikkalaitteeseen

Publications (2)

Publication Number Publication Date
FI20021027A0 FI20021027A0 (fi) 2002-05-31
FI20021027A7 true FI20021027A7 (fi) 2004-01-27

Family

ID=8564042

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20021027A FI20021027A7 (fi) 2002-05-31 2002-05-31 Jäähdytinelementti elektroniikkalaitteeseen

Country Status (8)

Country Link
US (1) US20050217824A1 (fi)
EP (1) EP1510113A1 (fi)
JP (1) JP4170982B2 (fi)
CN (1) CN1284434C (fi)
AU (1) AU2003238531A1 (fi)
FI (1) FI20021027A7 (fi)
TW (1) TW200401601A (fi)
WO (1) WO2003103360A1 (fi)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005004777A1 (de) * 2005-02-01 2006-08-10 Behr Industry Gmbh & Co. Kg Kühler
US20080144344A1 (en) * 2006-10-16 2008-06-19 Kelly Spencer Static Inverter With Hardened Environmental Housing
TWM355000U (en) * 2008-08-06 2009-04-11 Kwo Ger Metal Technology Inc Bottom board of heat sink module
CN101839654B (zh) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 散热器
TW201120320A (en) * 2009-12-07 2011-06-16 Hon Hai Prec Ind Co Ltd Fan module and heat disspation device incorporating the same
JP4951094B2 (ja) * 2010-02-16 2012-06-13 株式会社東芝 電子機器の冷却構造
DE112011101959B4 (de) * 2010-06-07 2016-11-24 Mitsubishi Electric Corporation Wärmesenke und Verfahren zu deren Herstellung
DE202010012328U1 (de) * 2010-09-08 2011-12-13 Heinz Georg Symann Plattenwärmetauscher mit Gebläse
KR101156903B1 (ko) * 2010-10-28 2012-06-21 삼성전기주식회사 전력변환모듈의 방열장치
US9326424B2 (en) * 2014-09-10 2016-04-26 Opentv, Inc. Heat sink assembly and method of utilizing a heat sink assembly
CN104602490B (zh) * 2015-01-15 2017-09-22 华为技术有限公司 散热装置
US11410905B2 (en) * 2019-03-18 2022-08-09 International Business Machines Corporation Optimized weight heat spreader for an electronic package

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138237Y2 (fi) * 1978-11-17 1986-11-05
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
US5526875A (en) * 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU
JPH08250878A (ja) * 1995-03-07 1996-09-27 Showa Aircraft Ind Co Ltd ヒートシンク
GB2312986A (en) * 1996-05-08 1997-11-12 Ming Der Chiou Heat sink mounting device adapted for securing a heat sink to a CPU holder
JPH10303348A (ja) * 1997-01-31 1998-11-13 Thermalloy Inc 熱伝導体及び熱エネルギー放散アセンブリ
JP2000353889A (ja) * 1999-06-09 2000-12-19 Nec Ibaraki Ltd 冷却装置
JP2002016385A (ja) * 2000-06-26 2002-01-18 Nippon Yusoki Co Ltd 発熱部品の放熱装置
DE60138594D1 (de) * 2000-07-10 2009-06-18 Thermal Form & Function Inc Gewölbter Matrixkühlkörper zum Kühlen von elektronischen Bauteilen
US20020109970A1 (en) * 2000-12-18 2002-08-15 Samsung Electro-Mechanics Co., Ltd. Heat sink for cooling electronic chip
US6826050B2 (en) * 2000-12-27 2004-11-30 Fujitsu Limited Heat sink and electronic device with heat sink
US6668910B2 (en) * 2002-04-09 2003-12-30 Delphi Technologies, Inc. Heat sink with multiple surface enhancements

Also Published As

Publication number Publication date
FI20021027A0 (fi) 2002-05-31
AU2003238531A1 (en) 2003-12-19
CN1284434C (zh) 2006-11-08
EP1510113A1 (en) 2005-03-02
TW200401601A (en) 2004-01-16
JP2005528805A (ja) 2005-09-22
US20050217824A1 (en) 2005-10-06
JP4170982B2 (ja) 2008-10-22
WO2003103360A1 (en) 2003-12-11
CN1656864A (zh) 2005-08-17

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