DE602004032315D1 - Industrielle ethernet-vermittlungsstelle - Google Patents

Industrielle ethernet-vermittlungsstelle

Info

Publication number
DE602004032315D1
DE602004032315D1 DE602004032315T DE602004032315T DE602004032315D1 DE 602004032315 D1 DE602004032315 D1 DE 602004032315D1 DE 602004032315 T DE602004032315 T DE 602004032315T DE 602004032315 T DE602004032315 T DE 602004032315T DE 602004032315 D1 DE602004032315 D1 DE 602004032315D1
Authority
DE
Germany
Prior art keywords
light
housing
heat sink
base
front side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004032315T
Other languages
English (en)
Inventor
Craig A Zimmerman
Earl W Boone
Matthew D Grimm
William C Johnson
Daniel Nix
Yen Teresa Nguyen
Manrique J Brenes
Rachel C Neal
James E Collinge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cisco Technology Inc
Original Assignee
Cisco Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/377,189 external-priority patent/US7277295B2/en
Priority claimed from US10/377,570 external-priority patent/US7268690B2/en
Priority claimed from US10/377,066 external-priority patent/US7447147B2/en
Application filed by Cisco Technology Inc filed Critical Cisco Technology Inc
Publication of DE602004032315D1 publication Critical patent/DE602004032315D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H05K7/1464—Functional units accommodated in the same PLC module housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Small-Scale Networks (AREA)
  • Glass Compositions (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
DE602004032315T 2003-02-28 2004-02-24 Industrielle ethernet-vermittlungsstelle Expired - Lifetime DE602004032315D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/377,189 US7277295B2 (en) 2003-02-28 2003-02-28 Industrial ethernet switch
US10/377,570 US7268690B2 (en) 2003-02-28 2003-02-28 Industrial ethernet switch
US10/377,066 US7447147B2 (en) 2003-02-28 2003-02-28 Ethernet switch with configurable alarms
PCT/US2004/005823 WO2004079974A2 (en) 2003-02-28 2004-02-24 Industrial ethernet switch

Publications (1)

Publication Number Publication Date
DE602004032315D1 true DE602004032315D1 (de) 2011-06-01

Family

ID=32966417

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004032315T Expired - Lifetime DE602004032315D1 (de) 2003-02-28 2004-02-24 Industrielle ethernet-vermittlungsstelle

Country Status (4)

Country Link
EP (1) EP1597950B1 (de)
AT (1) ATE506841T1 (de)
DE (1) DE602004032315D1 (de)
WO (1) WO2004079974A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007004865B4 (de) * 2007-01-31 2010-07-01 Tyco Electronics Amp Gmbh Schienenbasiertes, modulares Gerätesystem der industriellen Informationsnetzwerktechnik
CN105282054B (zh) * 2015-11-30 2019-02-19 湖北三江航天万峰科技发展有限公司 一种抗干扰加固型以太网交换机
EP3270668A1 (de) 2016-07-12 2018-01-17 Siemens Aktiengesellschaft Gehäuse für ein industrielles kommunikationsgerät und industrielles kommunikationsgerät
CN114143622B (zh) * 2021-11-08 2023-07-25 深圳市锦昊安科技有限公司 一种智能故障监测的交换机及交换机系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2310086A (en) * 1996-02-09 1997-08-13 3Com Limited Enclosure having a domed cover providing a vent
EP1314080A2 (de) * 2000-08-21 2003-05-28 Woodhead Industries, Inc. Industrieller schaltverteiler für ein ethernet-netzwerk
ES2273877T3 (es) * 2000-09-12 2007-05-16 Tyco Electronics Amp Gmbh Sistema de conexion modular para aplicaciones ethernet en el sector industrial.
KR100370368B1 (ko) * 2001-01-31 2003-02-05 삼성전자 주식회사 내부 온도가 기준 온도를 초과할 때 슬립 모드로 진입하는 에이씨피아이를 채용한 컴퓨터 시스템 및 그 방법
CA2366941C (en) * 2002-01-02 2010-06-29 Marzio Paride Pozzuoli Power supply circuit for an intelligent eclectronic device

Also Published As

Publication number Publication date
EP1597950B1 (de) 2011-04-20
WO2004079974A3 (en) 2005-02-03
WO2004079974A2 (en) 2004-09-16
ATE506841T1 (de) 2011-05-15
EP1597950A2 (de) 2005-11-23

Similar Documents

Publication Publication Date Title
ATE521083T1 (de) Anordnung zum thermomanagement
TW200517042A (en) Heat sink
DE60319523D1 (de) Vorrichtung zur Kühlung von Halbleiterbauteilen auf Leiterplatten
ATE343170T1 (de) MODULAR AUFGEBAUTES MIKROELEKTRONIK-SYSTEM ZUM GEBRAUCH IN ßWEARABLE ELECTRONICSß
ES2136170T3 (es) Conector electrico de diafonia reducida.
SE9402854L (sv) Anordning för att fästa ett kyldon till en elektronisk förpackning
DE60336868D1 (de) Zeicheneingabevorrichtung
ATE438132T1 (de) Termische lösung für elektronische geräte
TW547916U (en) Heat dissipating device for heat generating devices on a circuit board and notebook computer utilizing the heat dissipating device
TW200619774A (en) Light generating device and display device having the same
BRPI0412195B1 (pt) equipamento de solda por ultrassom
DE602004032315D1 (de) Industrielle ethernet-vermittlungsstelle
ES2063500T3 (es) Dispositivo de sujecion para tarjetas enchufables.
DE60126604D1 (de) Bildanzeigevorrichtung
ATE487361T1 (de) Elektronische vorrichtungen mit oberflächenmerkmalen
ATE543240T1 (de) Kühlelement
CA103238S (en) Inside-out heat sink
DE50307342D1 (de) Gehäuse zur aufnahme eines elektrischen gerätes
CA103239S (en) Inside-out heat sink
DE502005000968D1 (de) Aufputzmontagevorrichtung
CA103243S (en) Inside-out heat sink
ITMI20031960A1 (it) Dispositivo radiante
DE60303501D1 (de) Vorrichtung und system zum dämpfen von schwingungen, aufprall und stoss
ES2170033B1 (es) Encimera de coccion por induccion
ATE425444T1 (de) Mikrosystemtechnisches bauelement mit einer unter dem einfluss von temperaturänderungen verformbaren einrichtung