DE60138594D1 - Gewölbter Matrixkühlkörper zum Kühlen von elektronischen Bauteilen - Google Patents

Gewölbter Matrixkühlkörper zum Kühlen von elektronischen Bauteilen

Info

Publication number
DE60138594D1
DE60138594D1 DE60138594T DE60138594T DE60138594D1 DE 60138594 D1 DE60138594 D1 DE 60138594D1 DE 60138594 T DE60138594 T DE 60138594T DE 60138594 T DE60138594 T DE 60138594T DE 60138594 D1 DE60138594 D1 DE 60138594D1
Authority
DE
Germany
Prior art keywords
arched
heat sink
electronic components
cooling electronic
matrix heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60138594T
Other languages
English (en)
Inventor
David W Fast
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermal Form & Function Inc
Original Assignee
Thermal Form & Function Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermal Form & Function Inc filed Critical Thermal Form & Function Inc
Application granted granted Critical
Publication of DE60138594D1 publication Critical patent/DE60138594D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE60138594T 2000-07-10 2001-07-09 Gewölbter Matrixkühlkörper zum Kühlen von elektronischen Bauteilen Expired - Fee Related DE60138594D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21708800P 2000-07-10 2000-07-10

Publications (1)

Publication Number Publication Date
DE60138594D1 true DE60138594D1 (de) 2009-06-18

Family

ID=22809623

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60138594T Expired - Fee Related DE60138594D1 (de) 2000-07-10 2001-07-09 Gewölbter Matrixkühlkörper zum Kühlen von elektronischen Bauteilen

Country Status (4)

Country Link
US (1) US6615909B2 (de)
EP (1) EP1172852B1 (de)
CA (1) CA2352722A1 (de)
DE (1) DE60138594D1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20021027A0 (fi) * 2002-05-31 2002-05-31 Outokumpu Oy Jäähdytinelementti elektroniikkalaitteeseen
US20040008496A1 (en) * 2002-07-10 2004-01-15 Larson Thane Michael Portable thermal barrier for an electronic system
US6885553B2 (en) * 2002-09-27 2005-04-26 Rockwell Automation Technologies, Inc. Bus bar assembly for use with a compact power conversion assembly
US7068507B2 (en) 2002-09-27 2006-06-27 Rockwell Automation Technologies, Inc. Compact liquid converter assembly
US6721181B1 (en) 2002-09-27 2004-04-13 Rockwell Automation Technologies, Inc. Elongated heat sink for use in converter assemblies
US6822850B2 (en) * 2002-09-27 2004-11-23 Rockwell Automation Technologies, Inc. Laminated bus bar for use with a power conversion configuration
US6956742B2 (en) * 2002-09-27 2005-10-18 Rockwell Automation Technologies, Inc. Compact liquid converter assembly
FR2845153B1 (fr) * 2002-10-01 2005-11-18 Nordon Cryogenie Snc Ailette pour echangeur de chaleur a plaques, procedes de fabrication d'une telle ailette, et echangeur de chaleur comportant une telle ailette
US20050139995A1 (en) * 2003-06-10 2005-06-30 David Sarraf CTE-matched heat pipe
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber
US20050254208A1 (en) * 2004-05-17 2005-11-17 Belady Christian L Air flow direction neutral heat transfer device
US20050259400A1 (en) * 2004-05-24 2005-11-24 Formosa Microsemi Co., Ltd. Heat sinking structure of power semiconductor
GB0416485D0 (en) * 2004-07-23 2004-08-25 Oxycell Holding Bv Folded heat exchanger
JP4581964B2 (ja) * 2005-02-14 2010-11-17 セイコーエプソン株式会社 マイクロチャンネル構造体の製造方法
WO2007043598A1 (ja) * 2005-10-13 2007-04-19 Sony Computer Entertainment Inc. 電子装置及びヒートシンク
US20070133177A1 (en) * 2005-12-14 2007-06-14 International Business Machines Corporation Flexing chip heatsink
US20070215323A1 (en) * 2006-03-17 2007-09-20 Inventec Corporation Heat-dissipating structure
US7709730B2 (en) * 2007-09-05 2010-05-04 Skyline Solar, Inc. Dual trough concentrating solar photovoltaic module
US20090145587A1 (en) * 2007-12-06 2009-06-11 Calsonickansei North America, Inc. Fin pack, heat exchanger, and method of producing same
US8297341B2 (en) * 2008-09-08 2012-10-30 Getac Technology Corp. Heat dissipating structure and method of forming the same
CN101762200B (zh) * 2008-12-23 2013-03-06 富瑞精密组件（昆山）有限公司 电子装置及其散热装置与散热片
US20100163014A1 (en) * 2008-12-29 2010-07-01 Skyline Solar, Inc. High ground cover ratio solar collection system
US8049150B2 (en) * 2009-01-12 2011-11-01 Skyline Solar, Inc. Solar collector with end modifications
US20100186933A1 (en) * 2009-01-28 2010-07-29 Kun-Jung Chang Heat dispersing module
CN101839654B (zh) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 散热器
EP2412215A1 (de) * 2009-03-25 2012-02-01 Hewlett-Packard Development Company, L.P. Gitterkühlkörper
US7968791B2 (en) * 2009-07-30 2011-06-28 Skyline Solar, Inc. Solar energy collection system
US20110132457A1 (en) * 2009-12-04 2011-06-09 Skyline Solar, Inc. Concentrating solar collector with shielding mirrors
CN102692979A (zh) * 2011-03-21 2012-09-26 鸿富锦精密工业（深圳）有限公司 散热装置
US11604035B2 (en) * 2013-09-29 2023-03-14 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus
EP2876400B1 (de) * 2013-11-20 2016-10-05 ABB Technology Oy Kühlelement
CN104602490B (zh) * 2015-01-15 2017-09-22 华为技术有限公司 散热装置
FR3087618B1 (fr) * 2018-10-23 2020-10-02 Valeo Systemes Thermiques Dispositif de dissipation thermique, notamment pour dispositif de generation d’un flux d’air
CN110729546A (zh) * 2019-10-18 2020-01-24 大连大学 一种5g天线散热器
CN113137398B (zh) * 2021-04-23 2022-04-08 昆山品岱电子有限公司 电子产品用散热风扇

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3552488A (en) * 1968-12-27 1971-01-05 Pall Corp Plate-fin heat exchanger
US4365665A (en) * 1978-11-17 1982-12-28 Sumitomo Precision Products Company, Ltd. Heat sink
JPS6138237Y2 (de) * 1978-11-17 1986-11-05
US4535841A (en) * 1983-10-24 1985-08-20 International Business Machines Corporation High power chip cooling device and method of manufacturing same
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
JPH03129299A (ja) * 1989-10-13 1991-06-03 Asahi Chem Ind Co Ltd ピンフィン部材
JPH0750494A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 冷却装置
JP2981586B2 (ja) * 1993-10-15 1999-11-22 ダイヤモンド電機株式会社 ヒートシンク
US5937517A (en) * 1997-11-12 1999-08-17 Eastman Kodak Company Method of manufacturing bonded dual extruded, high fin density heat sinks
TW556074B (en) * 1998-12-15 2003-10-01 Foxconn Prec Components Co Ltd Heat sink and the manufacturing method thereof

Also Published As

Publication number Publication date
EP1172852A3 (de) 2004-10-06
US20020029876A1 (en) 2002-03-14
CA2352722A1 (en) 2002-01-10
US6615909B2 (en) 2003-09-09
EP1172852B1 (de) 2009-05-06
EP1172852A2 (de) 2002-01-16

Similar Documents

Publication Publication Date Title
DE60138594D1 (de) Gewölbter Matrixkühlkörper zum Kühlen von elektronischen Bauteilen
IT1292590B1 (it) Dissipatore di calore, in particolare per componenti elettronici.
DE60319986D1 (de) Plattenwärmetauscher
DE60329693D1 (de) Wärmetauscher
TW584260U (en) Heat sink device
DE03726970T1 (de) Wärmetauscher
DE50310964D1 (de) Wärmeübertrager
TW565106U (en) Clip for heat sink
DE10328846A8 (de) Wärmetauscher
FI20021424A0 (fi) Jäähdytyselementti
DE60306291D1 (de) Wärmetauscher
DE60208076D1 (de) Wärmetauschvorrichtung
DE60232621D1 (de) Absorptionsgerät zum Heizen oder Kühlen von Wasser
DE60030963D1 (de) Elektronischer Halbleiterbaustein mit Wärmeverteiler
DE60205657D1 (de) Wärmetauschvorrichtung
TW556882U (en) Clip for heat sink
DE10228697C5 (de) Wärmeübertrager
FI990576A (fi) Lämmönvaihtimen jäähdytyselementti
DE10394133D2 (de) Heiz- oder Kühlvorrichtung
TW573753U (en) Heat sink disassembling device
FI20031115A (fi) Levylämmönvaihdin
NO20021945D0 (no) Kjöleanordning
ATE280933T1 (de) Heiz-(kühl-)körper
ITBO20020699A0 (it) Dissipatore di calore per componenti elettronici
ITBO20010257A0 (it) Dissipatore di calore per componenti elettronici

Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee