CN102692979A - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN102692979A
CN102692979A CN2011100672170A CN201110067217A CN102692979A CN 102692979 A CN102692979 A CN 102692979A CN 2011100672170 A CN2011100672170 A CN 2011100672170A CN 201110067217 A CN201110067217 A CN 201110067217A CN 102692979 A CN102692979 A CN 102692979A
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Prior art keywords
heat
radiator
radiating fin
heat radiator
heat abstractor
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CN2011100672170A
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English (en)
Inventor
曾祥鲲
姚志江
徐礼福
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2011100672170A priority Critical patent/CN102692979A/zh
Priority to TW100109797A priority patent/TW201239594A/zh
Priority to US13/301,862 priority patent/US20120241136A1/en
Publication of CN102692979A publication Critical patent/CN102692979A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置,包括一散热器,所述散热器包括若干第一散热鳍片,所述散热装置还包括若干第二散热鳍片,每一第二散热鳍片装设在每两相邻的第一散热鳍片之间,且包括若干第一散热片及连接两相邻第一散热片的第二散热片。

Description

散热装置
技术领域
本发明涉及一种散热装置,尤指一种散热效率较高的散热装置。
背景技术
现在计算机的运行速度越来越快,由于计算机的运行速度主要取决于中央处理器,因此中央处理器的运行速度也越来越快,但是对于中央处理器这一类的集成电路电子组件来说,运行速度越快,其单位时间产生的热量就越多,若不及时排出,就会引起其温度升高,导致其运行不稳定。业界均在中央处理器表面安装一散热装置辅助其散热,随着新的处理器不断推出,其所配用的散热装置也在不断改良。
请参阅图1,其为一种常用的散热装置包括一散热器80和一风扇90,所述散热器80包括一底座81和若干平行设置在底座81上部的散热鳍片83,这些散热鳍片83均为竖直的板体,两两相邻的散热鳍片83之间形成一风道85,散热器80的底座81可与一电路板70的一发热元件71接触而将发热元件产生的热量传导到散热鳍片83上,风扇90可安装在散热鳍片83一侧而驱动冷空气流过散热器80的风道85,从而带走散热鳍片83上的热量,但是上述散热装置的散热效率较低。
发明内容
鉴于以上内容,有必要提供一种用以提高散热效率的散热装置。
一种散热装置,包括一散热器,所述散热器包括若干第一散热鳍片,所述散热装置还包括若干第二散热鳍片,每一第二散热鳍片装设在每两相邻的第一散热鳍片之间,且包括若干第一散热片及连接两相邻第一散热片的第二散热片。
优选地,所述第一散热片相互平行。
优选地,所述第二散热片相互平行。
优选地,所述第一散热片大致垂直所述第一散热鳍片。
优选地,所述第二散热片大致平行所述第一散热鳍片。
优选地,所述第一散热鳍片与所述第二散热片相接触。
优选地,所述第二散热鳍片由连接在一起的第一散热片及第二散热片形成片状弯折结构。
优选地,所述第一散热片及第二散热片之间形成用以让空气流过的风道。
优选地所述散热器还包括与一发热元件相接触的底座,所述第一散热鳍片自所述底座上延伸出来。
优选地,所述第一散热鳍片与所述第二散热片相接触。
相较于现有技术,在上述散热装置中,所述第一散热片及第二散热片增加了所述散热器的散热面积,从而提高了所述散热装置的散热效率。
附图说明
图1是现有的散热装置的立体分解图。
图2是本发明电子装置的一较佳实施方式中的一立体分解图。
图3是图2的局部放大图。
图4是图2的一立体组装图。
主要元件符号说明
散热器 10、80
底座 11、81
第一散热鳍片 13
第二散热鳍片 15
第一散热片 150
第二散热片 151
风道 156、85
风扇 30、90
电路板 50、70
发热元件 60、71
散热鳍片 83
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请一并参阅图2至图4,在本发明的一较佳实施方式中,一散热装置包括一散热器10和一可安装在所述散热器10一侧的风扇30。
所述散热器10包括一底座11,所述底座11上设有若干第一散热鳍片13,所述底座11的下表面可与一电路板50上的发热元件60(如中央处理器)相接触。所述第一散热鳍片13相互平行,且大致垂直所述底座11。每两相邻的第一散热鳍片13之间装设一第二散热鳍片15。每一第二散热鳍片15包括若干第一散热片150及第二散热片151。一所述第一散热片150与所述底座11相接触。在一实施方式中,所述第二散热片151与所述第一散热鳍片13相接触。所述第一散热片150相互平行,且大致垂直所述第一散热鳍片13。所述第二散热片151相互平行,且大致垂直所述第一散热片150。所述第二散热片151间隔连接两相邻第一散热片150的两端。每两相邻的第一散热片150与连接所述第一散热片150一端的第二散热片151之间形成一风道156,所述风道156的延伸方向大致平行所述第一散热鳍片13。所述风道156与所述第一散热鳍片13相接触。
所述风扇30安装在所述散热器10上并与位于所述风道156的一侧,所述散热装置安装到所述发热元件60上,所述底座11的下表面与所述发热元件60相接触。所述发热元件60产生的热量经由底座11传送到第一散热鳍片13及第二散热鳍片15上。所述风扇30驱动冷空气流过所述第二散热鳍片15之间的风道156,由于所述风道156均匀排列,所述冷空气均匀地流过所述风道156,从而带走所述第一散热鳍片13及第二散热鳍片15上的热量。所述第一散热片150及第二散热片151增大了所述散热器10的散热面积,大大提高了所述发热元件60的散热效率。

Claims (10)

1.一种散热装置,包括一散热器,所述散热器包括若干第一散热鳍片,其特征在于:所述散热装置还包括若干第二散热鳍片,每一第二散热鳍片装设在每两相邻的第一散热鳍片之间,且包括若干第一散热片及连接两相邻第一散热片的第二散热片。
2.如权利要求1所述的散热装置,其特征在于:所述第一散热片相互平行。
3.如权利要求1所述的散热装置,其特征在于:所述第二散热片相互平行。
4.如权利要求1所述的散热装置,其特征在于:所述第一散热片大致垂直所述第一散热鳍片。
5.如权利要求1所述的散热装置,其特征在于:所述第二散热片大致平行所述第一散热鳍片。
6.如权利要求1所述的散热装置,其特征在于:所述第一散热鳍片与所述第二散热片相接触。
7.如权利要求1所述的散热装置,其特征在于:所述第二散热鳍片由连接在一起的第一散热片及第二散热片形成片状弯折结构。
8.如权利要求1所述的散热装置,其特征在于:所述第一散热片及第二散热片之间形成用以让空气流过的风道。
9.如权利要求1所述的散热装置,其特征在于:所述散热器还包括与一发热元件相接触的底座,所述第一散热鳍片自所述底座上延伸出来。
10.如权利要求9所述的散热装置,其特征在于:所述底座与一所述第一散热片相接触。
CN2011100672170A 2011-03-21 2011-03-21 散热装置 Pending CN102692979A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011100672170A CN102692979A (zh) 2011-03-21 2011-03-21 散热装置
TW100109797A TW201239594A (en) 2011-03-21 2011-03-23 Cooling device
US13/301,862 US20120241136A1 (en) 2011-03-21 2011-11-22 Cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011100672170A CN102692979A (zh) 2011-03-21 2011-03-21 散热装置

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CN102692979A true CN102692979A (zh) 2012-09-26

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CN (1) CN102692979A (zh)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103476229A (zh) * 2013-09-16 2013-12-25 南京九致信息科技有限公司 一种散热装置
WO2020006871A1 (zh) * 2018-07-02 2020-01-09 深圳市大疆创新科技有限公司 散热组件及遥控器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9532485B2 (en) * 2014-02-21 2016-12-27 Lenovo (Beijing) Co., Ltd. Heat dissipating device and electronic apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138237Y2 (zh) * 1978-11-17 1986-11-05
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5706169A (en) * 1996-05-15 1998-01-06 Yeh; Robin Cooling apparatus for a computer central processing unit
DE60138594D1 (de) * 2000-07-10 2009-06-18 Thermal Form & Function Inc Gewölbter Matrixkühlkörper zum Kühlen von elektronischen Bauteilen
US6834713B2 (en) * 2002-07-18 2004-12-28 Delphi Technologies, Inc. Thermosiphon for electronics cooling with nonuniform airflow
US6575229B1 (en) * 2002-08-28 2003-06-10 Tandis, Inc. Heat sink having folded fin heat exchanger core
TWI325046B (en) * 2006-12-01 2010-05-21 Delta Electronics Inc Heat dissipation module and flat heat column and heat dissipation apparatus thereof
US7548428B2 (en) * 2007-07-27 2009-06-16 Hewlett-Packard Development Company, L.P. Computer device heat dissipation system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103476229A (zh) * 2013-09-16 2013-12-25 南京九致信息科技有限公司 一种散热装置
WO2020006871A1 (zh) * 2018-07-02 2020-01-09 深圳市大疆创新科技有限公司 散热组件及遥控器
CN110896688A (zh) * 2018-07-02 2020-03-20 深圳市大疆创新科技有限公司 散热组件及遥控器
CN110896688B (zh) * 2018-07-02 2021-06-25 深圳市大疆创新科技有限公司 散热组件及遥控器

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US20120241136A1 (en) 2012-09-27

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Application publication date: 20120926