TW200606015A - Adhesive film and production method therefor and flexible metal-clad laminate and production method therefor - Google Patents

Adhesive film and production method therefor and flexible metal-clad laminate and production method therefor

Info

Publication number
TW200606015A
TW200606015A TW094115675A TW94115675A TW200606015A TW 200606015 A TW200606015 A TW 200606015A TW 094115675 A TW094115675 A TW 094115675A TW 94115675 A TW94115675 A TW 94115675A TW 200606015 A TW200606015 A TW 200606015A
Authority
TW
Taiwan
Prior art keywords
production method
method therefor
adhesive film
clad laminate
flexible metal
Prior art date
Application number
TW094115675A
Other languages
English (en)
Other versions
TWI383889B (zh
Inventor
Kazuhiro Ono
Kan Fujihara
Takaaki Matsuwaki
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004209113A external-priority patent/JP2006027067A/ja
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200606015A publication Critical patent/TW200606015A/zh
Application granted granted Critical
Publication of TWI383889B publication Critical patent/TWI383889B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
TW94115675A 2004-05-13 2005-05-13 接著膜、撓性金屬接合積層板及彼等之製造方法 TWI383889B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004144107 2004-05-13
JP2004209104 2004-07-15
JP2004209113A JP2006027067A (ja) 2004-07-15 2004-07-15 接着フィルムおよびフレキシブル金属張積層板並びにそれらの製造方法

Publications (2)

Publication Number Publication Date
TW200606015A true TW200606015A (en) 2006-02-16
TWI383889B TWI383889B (zh) 2013-02-01

Family

ID=35394146

Family Applications (3)

Application Number Title Priority Date Filing Date
TW101118240A TWI494407B (zh) 2004-05-13 2005-05-13 接著膜、撓性金屬接合積層板及彼等之製造方法
TW94115675A TWI383889B (zh) 2004-05-13 2005-05-13 接著膜、撓性金屬接合積層板及彼等之製造方法
TW101118234A TWI494406B (zh) 2004-05-13 2005-05-13 接著膜、撓性金屬接合積層板及彼等之製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW101118240A TWI494407B (zh) 2004-05-13 2005-05-13 接著膜、撓性金屬接合積層板及彼等之製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101118234A TWI494406B (zh) 2004-05-13 2005-05-13 接著膜、撓性金屬接合積層板及彼等之製造方法

Country Status (5)

Country Link
US (1) US7871698B2 (zh)
KR (1) KR101183320B1 (zh)
CN (2) CN101979451B (zh)
TW (3) TWI494407B (zh)
WO (1) WO2005111164A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070058812A (ko) * 2005-12-05 2007-06-11 주식회사 코오롱 폴리이미드 필름
KR20090080978A (ko) * 2006-11-29 2009-07-27 닛코 킨조쿠 가부시키가이샤 2 층 구리 피복 적층판
KR20100048474A (ko) * 2008-10-31 2010-05-11 에스케이에너지 주식회사 연성금속박적층체 및 이의 제조방법
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
CN106113803A (zh) * 2016-06-16 2016-11-16 常州市超顺电子技术有限公司 一种铝基覆铜板及其用途和制备方法
EP4317273A3 (en) * 2017-12-04 2024-05-08 Kolon Industries, Inc. Method for manufacturing polyimide-based film
KR102347588B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 고내열 저유전 폴리이미드 필름 및 이의 제조방법
KR102345722B1 (ko) * 2019-11-07 2022-01-03 피아이첨단소재 주식회사 고내열 저유전 폴리이미드 필름 및 이의 제조방법
KR102347633B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 유전특성이 개선된 폴리이미드 필름 및 그 제조방법
KR102347632B1 (ko) * 2019-11-13 2022-01-10 피아이첨단소재 주식회사 저유전 폴리이미드 필름 및 이의 제조방법
KR102347634B1 (ko) * 2019-11-13 2022-01-10 피아이첨단소재 주식회사 고접착 저유전 폴리이미드 필름 및 이의 제조방법

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JP2927531B2 (ja) * 1990-10-24 1999-07-28 鐘淵化学工業株式会社 フレキシブルプリント基板及びその製造方法
JPH09199830A (ja) * 1996-01-17 1997-07-31 Hosiden Corp フレキシブル配線基板の製造方法
JPH115954A (ja) * 1997-06-17 1999-01-12 Ube Ind Ltd 接着剤付きテ−プ、金属張積層板および回路板
US6350844B1 (en) * 1998-11-05 2002-02-26 Kaneka Corporation Polyimide film and electric/electronic equipment bases with the use thereof
DE19941897B4 (de) * 1999-09-02 2006-06-14 GSF - Forschungszentrum für Umwelt und Gesundheit GmbH IL-6 Rezeptor-Protein, Beta-Kette (gp130) des IL-6 Rezeptor-Proteins, für diese Proteine kodierende DNA, davon abgeleitete RNA, Peptid mit den Aminosäuren 771-811 dieser Beta-Kette oder Teilen davon und deren Verwendungen
JP2001139807A (ja) * 1999-11-12 2001-05-22 Kanegafuchi Chem Ind Co Ltd 耐熱性ボンディングシートの製造方法
JP2002154168A (ja) * 2000-11-17 2002-05-28 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムとその製造方法および等方性調整方法
JP2002210903A (ja) * 2001-01-19 2002-07-31 Kanegafuchi Chem Ind Co Ltd ボンディングシート
JP2002317159A (ja) * 2001-04-20 2002-10-31 Kanegafuchi Chem Ind Co Ltd 接着フィルム、その製造方法および該接着フィルムを備えた金属箔積層体
JP2002316386A (ja) 2001-04-20 2002-10-29 Kanegafuchi Chem Ind Co Ltd 銅張積層体およびその製造方法
JP2002321300A (ja) * 2001-04-23 2002-11-05 Kanegafuchi Chem Ind Co Ltd 接着フィルム及びその製造方法
JP2004338160A (ja) * 2003-05-14 2004-12-02 Kanegafuchi Chem Ind Co Ltd 寸法安定性を向上させた接着フィルム及びそれから得られるフレキシブル金属張積層板、並びにその製造方法
JP2005178242A (ja) * 2003-12-22 2005-07-07 Kaneka Corp 寸法安定性を向上させたフレキシブル金属張積層板の製造方法
JP2005186574A (ja) * 2003-12-26 2005-07-14 Kaneka Corp 接着性シートの製造方法および接着性シート、これを用いたフレキシブル金属張積層板
JP2005193542A (ja) * 2004-01-07 2005-07-21 Kaneka Corp 寸法安定性を向上させたフレキシブル金属張積層板の製造方法ならびにそれにより得られるフレキシブル金属張積層板

Also Published As

Publication number Publication date
KR101183320B1 (ko) 2012-09-14
WO2005111164A1 (ja) 2005-11-24
CN101942280A (zh) 2011-01-12
TWI383889B (zh) 2013-02-01
CN101979451B (zh) 2012-12-05
TWI494407B (zh) 2015-08-01
US7871698B2 (en) 2011-01-18
US20070218277A1 (en) 2007-09-20
TWI494406B (zh) 2015-08-01
TW201235438A (en) 2012-09-01
CN101979451A (zh) 2011-02-23
KR20070012446A (ko) 2007-01-25
TW201235437A (en) 2012-09-01

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