TW200604692A - Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair - Google Patents

Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair

Info

Publication number
TW200604692A
TW200604692A TW094105870A TW94105870A TW200604692A TW 200604692 A TW200604692 A TW 200604692A TW 094105870 A TW094105870 A TW 094105870A TW 94105870 A TW94105870 A TW 94105870A TW 200604692 A TW200604692 A TW 200604692A
Authority
TW
Taiwan
Prior art keywords
traces
micron
nanoparticles
low
features
Prior art date
Application number
TW094105870A
Other languages
English (en)
Inventor
Nabil Amro
Linette Demers
Sandeep Disawal
Hua Zhang
Robert Elghanian
Sylvain Cruchon-Dupeyrat
John Bussan
Original Assignee
Nanoink Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanoink Inc filed Critical Nanoink Inc
Publication of TW200604692A publication Critical patent/TW200604692A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Liquid Crystal (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Micromachines (AREA)
TW094105870A 2004-02-25 2005-02-25 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair TW200604692A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54709104P 2004-02-25 2004-02-25

Publications (1)

Publication Number Publication Date
TW200604692A true TW200604692A (en) 2006-02-01

Family

ID=34910853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105870A TW200604692A (en) 2004-02-25 2005-02-25 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair

Country Status (7)

Country Link
EP (1) EP1726193A2 (zh)
JP (1) JP2007528796A (zh)
KR (1) KR101165484B1 (zh)
CN (1) CN101002513A (zh)
CA (1) CA2557472C (zh)
TW (1) TW200604692A (zh)
WO (1) WO2005084092A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641429B (zh) * 2012-12-06 2018-11-21 ３Ｍ新設資產公司 黏性液體之精密塗佈及形成層壓物之使用

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2170501A2 (en) * 2007-06-20 2010-04-07 Northwestern University Universal matrix
JP2011502183A (ja) * 2007-10-15 2011-01-20 ナノインク インコーポレーティッド ナノ粒子ベースインクのリソグラフィ
US8048488B2 (en) * 2008-01-14 2011-11-01 Xerox Corporation Methods for removing a stabilizer from a metal nanoparticle using a destabilizer
US8256018B2 (en) * 2008-02-05 2012-08-28 Nanoink, Inc. Array and cantilever array leveling
CN101519184B (zh) * 2008-02-29 2012-05-23 财团法人工业技术研究院 利用光热效应制作应用基板的方法
JP5168100B2 (ja) * 2008-11-17 2013-03-21 大日本印刷株式会社 フォトマスク等の欠陥修正方法
KR20130010101A (ko) * 2009-03-24 2013-01-25 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. 저온에서 나노 입자를 소결하는 방법
CA2754701A1 (en) * 2009-04-14 2010-10-21 Nanoink, Inc. Conducting lines, nanoparticles, inks, and patterning
TW201200363A (en) * 2010-04-14 2012-01-01 Nanoink Inc Improved cantilevers for deposition
KR101345337B1 (ko) 2011-06-13 2013-12-30 한국생명공학연구원 원자간력 현미경（ａｆｍ）을 이용한 딥-펜 나노리소그래피에서의 단일 또는 다중팁을 이용한 나노포지셔닝 기판 제조장치 및 제조방법
US20140010952A1 (en) * 2012-01-02 2014-01-09 Noam ROSENSTEIN Pcb repair of defective interconnects by deposition of conductive ink
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
JP2014107484A (ja) * 2012-11-29 2014-06-09 Jsr Corp 接続方法および導電性インク
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
CN104178721B (zh) * 2013-05-22 2016-08-10 中国科学院理化技术研究所 室温下直接制作导电薄膜的装置及方法
CN105764635B (zh) * 2013-09-24 2019-11-12 贺利氏德国有限两合公司 在低温下制造光泽层压结构的方法
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
CN108474162A (zh) * 2015-11-09 2018-08-31 扣尼数字有限公司 用于喷墨组合物的拔染试剂
CN107293591B (zh) * 2016-04-11 2020-03-31 华邦电子股份有限公司 印刷线路、薄膜晶体管及其制造方法
KR102256454B1 (ko) * 2016-07-22 2021-06-03 주식회사 엘지화학 고체 잉크 입자들로 인쇄된 바코드부를 포함하는 이차전지
US10345695B2 (en) * 2016-11-30 2019-07-09 Taiwan Semiconductor Manufacturing Co., Ltd. Extreme ultraviolet alignment marks
DE112017008264T5 (de) * 2017-12-11 2020-08-20 Hewlett-Packard Development Company, L.P. Flüssigkeitsbehälter
CN108469707A (zh) * 2018-02-27 2018-08-31 昆山国显光电有限公司 一种显示面板的修复系统及修复方法
US11492547B2 (en) 2020-06-04 2022-11-08 UbiQD, Inc. Low-PH nanoparticles and ligands
CN113555161A (zh) * 2021-07-06 2021-10-26 中南大学 一种纳米线电极的图形化方法
CN114350184B (zh) * 2021-12-03 2022-07-29 南京大学 一种修复型光敏纳米涂料及其制备方法和应用
CN116283255B (zh) * 2022-11-01 2024-02-23 福建星海通信科技有限公司 一种用于低固相含量陶瓷浆料的直写3d打印方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB189724146A (en) * 1897-10-19 1898-08-13 Herbert Hippisley Stephens An Improved Fountain Pen.
JPH0911694A (ja) * 1995-06-30 1997-01-14 Graphtec Corp 回路基板欠陥補修装置
US6035526A (en) * 1997-11-18 2000-03-14 Ntn Corporation Method of repairing defect and apparatus for repairing defect
US6573369B2 (en) * 1999-05-21 2003-06-03 Bioforce Nanosciences, Inc. Method and apparatus for solid state molecular analysis
JP2003128974A (ja) * 2001-10-29 2003-05-08 Pilot Ink Co Ltd 筆記用消しゴム消去性水性インキ組成物及びそれを内蔵した筆記具
JP2003288812A (ja) * 2001-12-29 2003-10-10 Samsung Electronics Co Ltd 金属ナノ粒子クラスターインクおよびこれを用いた金属パターン形成方法
US7241420B2 (en) * 2002-08-05 2007-07-10 Palo Alto Research Center Incorporated Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641429B (zh) * 2012-12-06 2018-11-21 ３Ｍ新設資產公司 黏性液體之精密塗佈及形成層壓物之使用

Also Published As

Publication number Publication date
KR20070029151A (ko) 2007-03-13
EP1726193A2 (en) 2006-11-29
CA2557472C (en) 2013-05-07
WO2005084092A3 (en) 2005-11-24
CA2557472A1 (en) 2005-09-09
CN101002513A (zh) 2007-07-18
KR101165484B1 (ko) 2012-07-13
JP2007528796A (ja) 2007-10-18
WO2005084092A2 (en) 2005-09-09

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