JP5425479B2 - 不安定化剤を用いて金属ナノ粒子から安定剤を除去する方法 - Google Patents
不安定化剤を用いて金属ナノ粒子から安定剤を除去する方法 Download PDFInfo
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- JP5425479B2 JP5425479B2 JP2009002201A JP2009002201A JP5425479B2 JP 5425479 B2 JP5425479 B2 JP 5425479B2 JP 2009002201 A JP2009002201 A JP 2009002201A JP 2009002201 A JP2009002201 A JP 2009002201A JP 5425479 B2 JP5425479 B2 JP 5425479B2
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1292—Multistep manufacturing methods using liquid deposition, e.g. printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
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- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Composite Materials (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
(a)誘電体層、
(b)ゲート電極、
(c)半導体層、
(d)ソース電極、
(e)ドレイン電極、および
(f)基板
を含む薄膜トランジスタであって、その誘電体層、ゲート電極、半導体層、ソース電極、ドレイン電極、および基板が、ゲート電極および半導体層が両方とも絶縁誘導体層と接触しており、ソース電極およびドレイン電極が両方とも半導体層と接触している限りは任意の順序であり、該半導体層が有機、無機、または有機/無機ハイブリッド半導体化合物を含んで成るものが提供される。
Claims (2)
- 導電性特徴部を基板上に形成する方法であって、
金属ナノ粒子溶液が安定剤と共に金属ナノ粒子を含み、不安定化剤溶液が前記安定剤を不安定化する不安定化剤を含む2つ以上の溶液を準備するステップと、
前記金属ナノ粒子溶液を前記基板上に液相堆積させるステップと、
前記金属ナノ粒子溶液の前記基板上への堆積中または堆積後に安定剤を含む前記金属ナノ粒子と前記不安定化剤とを互いに混合することにより、前記不安定化剤により前記金属ナノ粒子の表面からの前記安定剤を不安定化させるステップと、
前記安定剤および不安定化剤を前記基板から前記基板を180℃より低い温度に加熱することによるかまたは溶媒で洗浄することによって除去するステップと
を含み、
前記不安定化剤が1−ブタンチオールであることを特徴とする方法。 - 基板、ゲート電極、ゲート誘電層、ソース電極およびドレイン電極、ならびに該ソース/ドレイン電極および該ゲート誘電層と接触している半導体層を含む薄膜トランジスタを製造する方法であって、
ゲート電極およびゲート誘電層を備えているか備えていない基板を準備するステップと、
金属ナノ粒子溶液が安定剤と共に金属ナノ粒子を含み、不安定化剤溶液が前記安定剤を不安定化する不安定化剤を含む2つ以上の溶液を準備するステップと、
前記金属ナノ粒子溶液を前記基板またはゲート誘電層上に液相堆積させて、ゲート電極、ソース電極および/またはドレイン電極を形成するステップと、
前記金属ナノ粒子溶液の前記基板またはゲート誘電層上への堆積中または堆積後に前記金属ナノ粒子と前記不安定化剤とを互いに混合することにより、前記不安定化剤により前記金属ナノ粒子の表面からの前記安定剤を不安定化させるステップと、
前記安定剤、不安定化剤、および反応副生成物を、前記基板を180℃より低い温度に加熱することによるかまたは溶媒で洗浄することによって前記基板から除去するステップと、
前記基板上に、前記ゲート電極、ソース電極、および/またはドレイン電極としての導電性特徴部を形成するステップと
を含み、
前記不安定化剤が1−ブタンチオールであることを特徴とする方法。
Applications Claiming Priority (2)
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US12/013,643 | 2008-01-14 | ||
US12/013,643 US8048488B2 (en) | 2008-01-14 | 2008-01-14 | Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
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JP5425479B2 true JP5425479B2 (ja) | 2014-02-26 |
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EP (1) | EP2080818A3 (ja) |
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US9137902B2 (en) | 2009-08-14 | 2015-09-15 | Xerox Corporation | Process to form highly conductive feature from silver nanoparticles with reduced processing temperature |
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US20120070570A1 (en) * | 2010-09-16 | 2012-03-22 | Xerox Corporation | Conductive thick metal electrode forming method |
DE102011079660B4 (de) * | 2011-07-22 | 2023-06-07 | Robert Bosch Gmbh | Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente, eine Schaltungsanordnung diesen Schichtverbund enthaltend und Verfahren zu dessen Ausbildung |
JP5734435B2 (ja) * | 2011-08-10 | 2015-06-17 | 三菱電機株式会社 | 半導体装置の製造方法 |
US8916457B2 (en) * | 2012-05-22 | 2014-12-23 | King Abdullah University Of Science And Technology | In situ synthesis of nanoparticles on substrates by inkjet printing |
EP3017664A1 (en) * | 2013-07-04 | 2016-05-11 | Agfa-Gevaert | A method of preparing a conductive metallic layer or pattern |
US20150240101A1 (en) * | 2014-02-24 | 2015-08-27 | Xerox Corporation | High silver content nanosilver ink for gravure and flexographic printing applications |
US9855737B2 (en) | 2014-09-08 | 2018-01-02 | Vadient Optics, Llc | Nanocomposite-ink factory |
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US9841327B2 (en) * | 2014-08-14 | 2017-12-12 | Purdue Research Foundation | Method of producing conductive patterns of nanoparticles and devices made thereof |
CN104934330A (zh) * | 2015-05-08 | 2015-09-23 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制备方法、阵列基板和显示面板 |
DE102017101262A1 (de) | 2017-01-24 | 2018-07-26 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Ultradünne Folienthermistoren |
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JP2009170907A (ja) | 2009-07-30 |
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