JP2007528796A - 導体をパターン付けするためのマイクロメートル直接書き込み法およびフラットパネルディスプレー修復への利用 - Google Patents

導体をパターン付けするためのマイクロメートル直接書き込み法およびフラットパネルディスプレー修復への利用 Download PDF

Info

Publication number
JP2007528796A
JP2007528796A JP2007500990A JP2007500990A JP2007528796A JP 2007528796 A JP2007528796 A JP 2007528796A JP 2007500990 A JP2007500990 A JP 2007500990A JP 2007500990 A JP2007500990 A JP 2007500990A JP 2007528796 A JP2007528796 A JP 2007528796A
Authority
JP
Japan
Prior art keywords
ink
cantilever
substrate surface
substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007500990A
Other languages
English (en)
Japanese (ja)
Inventor
ネイビル アムロ
リネット デメルス
サンディープ ディサワル
ファ チャン
ロバート エルハニアン
シルヴェイン クリュション−デュペイラ
ジョン ブッサン
Original Assignee
ナノインク インコーポレーティッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナノインク インコーポレーティッド filed Critical ナノインク インコーポレーティッド
Publication of JP2007528796A publication Critical patent/JP2007528796A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2007500990A 2004-02-25 2005-02-25 導体をパターン付けするためのマイクロメートル直接書き込み法およびフラットパネルディスプレー修復への利用 Pending JP2007528796A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54709104P 2004-02-25 2004-02-25
PCT/US2005/006009 WO2005084092A2 (en) 2004-02-25 2005-02-25 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair

Publications (1)

Publication Number Publication Date
JP2007528796A true JP2007528796A (ja) 2007-10-18

Family

ID=34910853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007500990A Pending JP2007528796A (ja) 2004-02-25 2005-02-25 導体をパターン付けするためのマイクロメートル直接書き込み法およびフラットパネルディスプレー修復への利用

Country Status (7)

Country Link
EP (1) EP1726193A2 (zh)
JP (1) JP2007528796A (zh)
KR (1) KR101165484B1 (zh)
CN (1) CN101002513A (zh)
CA (1) CA2557472C (zh)
TW (1) TW200604692A (zh)
WO (1) WO2005084092A2 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010122302A (ja) * 2008-11-17 2010-06-03 Dainippon Printing Co Ltd フォトマスク等の欠陥修正方法
JP2010531977A (ja) * 2007-06-20 2010-09-30 ノースウエスタン ユニバーシティ 脂質を含む組成物を用いたパターニング
JP2014107484A (ja) * 2012-11-29 2014-06-09 Jsr Corp 接続方法および導電性インク
JP2017501015A (ja) * 2013-09-24 2017-01-12 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー 低温にて光沢のある積層構造を生成するためのプロセス

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011502183A (ja) * 2007-10-15 2011-01-20 ナノインク インコーポレーティッド ナノ粒子ベースインクのリソグラフィ
US8048488B2 (en) * 2008-01-14 2011-11-01 Xerox Corporation Methods for removing a stabilizer from a metal nanoparticle using a destabilizer
US8256018B2 (en) * 2008-02-05 2012-08-28 Nanoink, Inc. Array and cantilever array leveling
CN101519184B (zh) * 2008-02-29 2012-05-23 财团法人工业技术研究院 利用光热效应制作应用基板的方法
JP2012521493A (ja) * 2009-03-24 2012-09-13 イッサム リサーチ ディべロップメント カンパニー オブ ザ ヘブライ ユニバーシティー オブ エルサレム，リミテッド 低温におけるナノ粒子の焼結プロセス
US20100288543A1 (en) * 2009-04-14 2010-11-18 Nanoink, Inc. Conducting lines, nanoparticles, inks, and patterning
JP2013524258A (ja) * 2010-04-14 2013-06-17 ナノインク インコーポレーティッド 付着用のカンチレバー
KR101345337B1 (ko) 2011-06-13 2013-12-30 한국생명공학연구원 원자간력 현미경（ａｆｍ）을 이용한 딥-펜 나노리소그래피에서의 단일 또는 다중팁을 이용한 나노포지셔닝 기판 제조장치 및 제조방법
US20140010952A1 (en) * 2012-01-02 2014-01-09 Noam ROSENSTEIN Pcb repair of defective interconnects by deposition of conductive ink
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
CN104812501B (zh) * 2012-12-06 2018-07-17 3M创新有限公司 粘性液体的精密涂层以及在形成层合物中的用途
US10020807B2 (en) * 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
CN104178721B (zh) * 2013-05-22 2016-08-10 中国科学院理化技术研究所 室温下直接制作导电薄膜的装置及方法
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
WO2017081680A1 (en) * 2015-11-09 2017-05-18 Kornit Digital Ltd. Dye discharge reagent for inkjet compositions
CN107293591B (zh) * 2016-04-11 2020-03-31 华邦电子股份有限公司 印刷线路、薄膜晶体管及其制造方法
KR102256454B1 (ko) * 2016-07-22 2021-06-03 주식회사 엘지화학 고체 잉크 입자들로 인쇄된 바코드부를 포함하는 이차전지
US10345695B2 (en) * 2016-11-30 2019-07-09 Taiwan Semiconductor Manufacturing Co., Ltd. Extreme ultraviolet alignment marks
CN111448075B (zh) * 2017-12-11 2021-09-03 惠普发展公司，有限责任合伙企业 流体贮存器
CN108469707A (zh) * 2018-02-27 2018-08-31 昆山国显光电有限公司 一种显示面板的修复系统及修复方法
US11492547B2 (en) 2020-06-04 2022-11-08 UbiQD, Inc. Low-PH nanoparticles and ligands
CN113555161A (zh) * 2021-07-06 2021-10-26 中南大学 一种纳米线电极的图形化方法
CN114350184B (zh) * 2021-12-03 2022-07-29 南京大学 一种修复型光敏纳米涂料及其制备方法和应用
CN116396066B (zh) * 2022-11-01 2024-04-05 福建星海通信科技有限公司 一种稳定性好的精密直写3d打印方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030013111A1 (en) * 1999-05-21 2003-01-16 Eric Henderson Method and apparatus for solid state molecular analysis
EP1388369A2 (en) * 2002-08-05 2004-02-11 Xerox Corporation Capillary-channel probes for liquid pickup, transportation and dispense using spring beams

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB189724146A (en) * 1897-10-19 1898-08-13 Herbert Hippisley Stephens An Improved Fountain Pen.
JPH0911694A (ja) * 1995-06-30 1997-01-14 Graphtec Corp 回路基板欠陥補修装置
US6035526A (en) * 1997-11-18 2000-03-14 Ntn Corporation Method of repairing defect and apparatus for repairing defect
JP2003128974A (ja) * 2001-10-29 2003-05-08 Pilot Ink Co Ltd 筆記用消しゴム消去性水性インキ組成物及びそれを内蔵した筆記具
US6923923B2 (en) * 2001-12-29 2005-08-02 Samsung Electronics Co., Ltd. Metallic nanoparticle cluster ink and method for forming metal pattern using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030013111A1 (en) * 1999-05-21 2003-01-16 Eric Henderson Method and apparatus for solid state molecular analysis
EP1388369A2 (en) * 2002-08-05 2004-02-11 Xerox Corporation Capillary-channel probes for liquid pickup, transportation and dispense using spring beams

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPN6011008510; Ａ．Ｍｅｉｓｔｅｒ，　ｅｔ．ａｌ．: 'Ｎａｎｏｓｃａｌｅ　ｄｉｓｐｅｎｓｉｎｇ　ｏｆ　ｌｉｑｕｉｄｓ　ｔｈｒｏｕｇｈ　ｃａｎｔｉｌｅｖｅｒｅｄ　ｐｒｏｂｅｓ' Ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ　Ｅｎｇｉｎｅｅｒｉｎｇ Ｖｏｌ．６７-６８, 2003, ｐｐ．６４４-６５０ *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010531977A (ja) * 2007-06-20 2010-09-30 ノースウエスタン ユニバーシティ 脂質を含む組成物を用いたパターニング
JP2010122302A (ja) * 2008-11-17 2010-06-03 Dainippon Printing Co Ltd フォトマスク等の欠陥修正方法
JP2014107484A (ja) * 2012-11-29 2014-06-09 Jsr Corp 接続方法および導電性インク
JP2017501015A (ja) * 2013-09-24 2017-01-12 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー 低温にて光沢のある積層構造を生成するためのプロセス

Also Published As

Publication number Publication date
WO2005084092A2 (en) 2005-09-09
KR101165484B1 (ko) 2012-07-13
CN101002513A (zh) 2007-07-18
CA2557472C (en) 2013-05-07
EP1726193A2 (en) 2006-11-29
CA2557472A1 (en) 2005-09-09
WO2005084092A3 (en) 2005-11-24
KR20070029151A (ko) 2007-03-13
TW200604692A (en) 2006-02-01

Similar Documents

Publication Publication Date Title
US8071168B2 (en) Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
CA2557472C (en) Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US7005378B2 (en) Processes for fabricating conductive patterns using nanolithography as a patterning tool
EP1556737B1 (en) Methods for fabrication of nanometer-scale engineered structures for mask repair application
US7491422B2 (en) Direct-write nanolithography method of transporting ink with an elastomeric polymer coated nanoscopic tip to form a structure having internal hollows on a substrate
US20100288543A1 (en) Conducting lines, nanoparticles, inks, and patterning
Xing et al. High-resolution combinatorial patterning of functional nanoparticles
Pique et al. Digital microfabrication by laser decal transfer
US20090181172A1 (en) Lithography of nanoparticle based inks
Ko Low temperature thermal engineering of nanoparticle ink for flexible electronics applications
WO2007008507A2 (en) Phase separation in patterned structures
Edwards et al. Fabrication and growth control of metal nanostructures through exploration of atomic force microscopy-based patterning and electroless deposition conditions
Chen et al. Nanowires of 3-D cross-linked gold nanoparticle assemblies behave as thermosensors on silicon substrates
Maynor Rational fabrication of nanostructures on surfaces using Dip-Pen nanolithography
Berson Connecting the Nanoscale to the Macroworld: Toward Electric Circuits by Self-Assembly, Constructive Nanolithography and Nanoionics

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110216

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110512

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110519

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110613

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110620

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110713

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110721

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110812

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120718

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20121016

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20121023

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130117

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130306