CA2557472C - Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair - Google Patents

Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair Download PDF

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Publication number
CA2557472C
CA2557472C CA2557472A CA2557472A CA2557472C CA 2557472 C CA2557472 C CA 2557472C CA 2557472 A CA2557472 A CA 2557472A CA 2557472 A CA2557472 A CA 2557472A CA 2557472 C CA2557472 C CA 2557472C
Authority
CA
Canada
Prior art keywords
cantilever
ink
substrate
cantilevers
microns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2557472A
Other languages
English (en)
French (fr)
Other versions
CA2557472A1 (en
Inventor
Nabil Amro
Linette Demers
Sandeep Disawal
Hua Zhang
Robert Elghanian
Sylvain Cruchon-Dupeyrat
John Bussan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NanoInk Inc
Original Assignee
NanoInk Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NanoInk Inc filed Critical NanoInk Inc
Publication of CA2557472A1 publication Critical patent/CA2557472A1/en
Application granted granted Critical
Publication of CA2557472C publication Critical patent/CA2557472C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CA2557472A 2004-02-25 2005-02-25 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair Expired - Fee Related CA2557472C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US54709104P 2004-02-25 2004-02-25
US60/547,091 2004-02-25
PCT/US2005/006009 WO2005084092A2 (en) 2004-02-25 2005-02-25 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair

Publications (2)

Publication Number Publication Date
CA2557472A1 CA2557472A1 (en) 2005-09-09
CA2557472C true CA2557472C (en) 2013-05-07

Family

ID=34910853

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2557472A Expired - Fee Related CA2557472C (en) 2004-02-25 2005-02-25 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair

Country Status (7)

Country Link
EP (1) EP1726193A2 (zh)
JP (1) JP2007528796A (zh)
KR (1) KR101165484B1 (zh)
CN (1) CN101002513A (zh)
CA (1) CA2557472C (zh)
TW (1) TW200604692A (zh)
WO (1) WO2005084092A2 (zh)

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JP2011502183A (ja) * 2007-10-15 2011-01-20 ナノインク インコーポレーティッド ナノ粒子ベースインクのリソグラフィ
US8048488B2 (en) * 2008-01-14 2011-11-01 Xerox Corporation Methods for removing a stabilizer from a metal nanoparticle using a destabilizer
US8256018B2 (en) * 2008-02-05 2012-08-28 Nanoink, Inc. Array and cantilever array leveling
CN101519184B (zh) * 2008-02-29 2012-05-23 财团法人工业技术研究院 利用光热效应制作应用基板的方法
JP5168100B2 (ja) * 2008-11-17 2013-03-21 大日本印刷株式会社 フォトマスク等の欠陥修正方法
JP2012521493A (ja) * 2009-03-24 2012-09-13 イッサム リサーチ ディべロップメント カンパニー オブ ザ ヘブライ ユニバーシティー オブ エルサレム，リミテッド 低温におけるナノ粒子の焼結プロセス
US20100288543A1 (en) * 2009-04-14 2010-11-18 Nanoink, Inc. Conducting lines, nanoparticles, inks, and patterning
JP2013524258A (ja) * 2010-04-14 2013-06-17 ナノインク インコーポレーティッド 付着用のカンチレバー
KR101345337B1 (ko) 2011-06-13 2013-12-30 한국생명공학연구원 원자간력 현미경（ａｆｍ）을 이용한 딥-펜 나노리소그래피에서의 단일 또는 다중팁을 이용한 나노포지셔닝 기판 제조장치 및 제조방법
US20140010952A1 (en) * 2012-01-02 2014-01-09 Noam ROSENSTEIN Pcb repair of defective interconnects by deposition of conductive ink
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
JP2014107484A (ja) * 2012-11-29 2014-06-09 Jsr Corp 接続方法および導電性インク
CN104812501B (zh) * 2012-12-06 2018-07-17 3M创新有限公司 粘性液体的精密涂层以及在形成层合物中的用途
US10020807B2 (en) * 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
CN104178721B (zh) * 2013-05-22 2016-08-10 中国科学院理化技术研究所 室温下直接制作导电薄膜的装置及方法
KR20160060135A (ko) * 2013-09-24 2016-05-27 헤레우스 도이칠란트 게엠베하 운트 코. 카게 저온에서 광택이 나는 적층 구조의 생산방법
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
WO2017081680A1 (en) * 2015-11-09 2017-05-18 Kornit Digital Ltd. Dye discharge reagent for inkjet compositions
CN107293591B (zh) * 2016-04-11 2020-03-31 华邦电子股份有限公司 印刷线路、薄膜晶体管及其制造方法
KR102256454B1 (ko) * 2016-07-22 2021-06-03 주식회사 엘지화학 고체 잉크 입자들로 인쇄된 바코드부를 포함하는 이차전지
US10345695B2 (en) * 2016-11-30 2019-07-09 Taiwan Semiconductor Manufacturing Co., Ltd. Extreme ultraviolet alignment marks
CN111448075B (zh) * 2017-12-11 2021-09-03 惠普发展公司，有限责任合伙企业 流体贮存器
CN108469707A (zh) * 2018-02-27 2018-08-31 昆山国显光电有限公司 一种显示面板的修复系统及修复方法
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Also Published As

Publication number Publication date
WO2005084092A2 (en) 2005-09-09
KR101165484B1 (ko) 2012-07-13
CN101002513A (zh) 2007-07-18
EP1726193A2 (en) 2006-11-29
CA2557472A1 (en) 2005-09-09
WO2005084092A3 (en) 2005-11-24
KR20070029151A (ko) 2007-03-13
JP2007528796A (ja) 2007-10-18
TW200604692A (en) 2006-02-01

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Effective date: 20150225