TW200604578A - Formation of projections and spacers and radiation sensitive resin composition for the same - Google Patents

Formation of projections and spacers and radiation sensitive resin composition for the same

Info

Publication number
TW200604578A
TW200604578A TW094104095A TW94104095A TW200604578A TW 200604578 A TW200604578 A TW 200604578A TW 094104095 A TW094104095 A TW 094104095A TW 94104095 A TW94104095 A TW 94104095A TW 200604578 A TW200604578 A TW 200604578A
Authority
TW
Taiwan
Prior art keywords
spacers
radiation sensitive
resin composition
sensitive resin
projections
Prior art date
Application number
TW094104095A
Other languages
English (en)
Chinese (zh)
Inventor
Misato Hanamura
Shigeru Abe
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200604578A publication Critical patent/TW200604578A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C18/00—Disintegrating by knives or other cutting or tearing members which chop material into fragments
    • B02C18/06—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
    • B02C18/16—Details
    • B02C18/18—Knives; Mountings thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C18/00—Disintegrating by knives or other cutting or tearing members which chop material into fragments
    • B02C18/06—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
    • B02C18/16—Details
    • B02C18/24—Drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27L—REMOVING BARK OR VESTIGES OF BRANCHES; SPLITTING WOOD; MANUFACTURE OF VENEER, WOODEN STICKS, WOOD SHAVINGS, WOOD FIBRES OR WOOD POWDER
    • B27L11/00—Manufacture of wood shavings, chips, powder, or the like; Tools therefor
    • B27L11/06—Manufacture of wood shavings, chips, powder, or the like; Tools therefor of wood powder or sawdust
TW094104095A 2004-02-09 2005-02-05 Formation of projections and spacers and radiation sensitive resin composition for the same TW200604578A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004031996A JP4569119B2 (ja) 2004-02-09 2004-02-09 突起および／またはスペーサー形成用の感放射線性樹脂組成物並びに突起および／またはスペーサーの形成方法

Publications (1)

Publication Number Publication Date
TW200604578A true TW200604578A (en) 2006-02-01

Family

ID=34997604

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094104095A TW200604578A (en) 2004-02-09 2005-02-05 Formation of projections and spacers and radiation sensitive resin composition for the same

Country Status (5)

Country Link
JP (1) JP4569119B2 (ja)
KR (1) KR20060041813A (ja)
CN (1) CN1670625A (ja)
SG (1) SG114706A1 (ja)
TW (1) TW200604578A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4513447B2 (ja) * 2004-07-23 2010-07-28 凸版印刷株式会社 配向制御用突起を有する基板及びそれを用いた液晶表示装置
JP2007156139A (ja) * 2005-12-06 2007-06-21 Toppan Printing Co Ltd 感光性樹脂組成物、フォトスペーサ付き基板の製造方法、フォトスペーサ付き基板及び液晶表示装置
US7601482B2 (en) * 2006-03-28 2009-10-13 Az Electronic Materials Usa Corp. Negative photoresist compositions
CN101178541B (zh) * 2006-10-31 2012-04-25 三洋化成工业株式会社 感光性树脂组合物
JP5076511B2 (ja) * 2007-01-17 2012-11-21 大日本印刷株式会社 液晶配向制御用突起形成用組成物
KR101392291B1 (ko) * 2007-04-13 2014-05-07 주식회사 동진쎄미켐 포토레지스트 조성물 및 이를 이용한 박막트랜지스터기판의 제조방법
JP4952918B2 (ja) * 2007-05-23 2012-06-13 Ｊｓｒ株式会社 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびにそれらの形成方法
TWI467271B (zh) * 2012-04-23 2015-01-01 Au Optronics Corp 液晶面板
CN114937441B (zh) * 2022-05-16 2023-07-25 Tcl华星光电技术有限公司 驱动电路及其控制方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000338662A (ja) * 1999-05-31 2000-12-08 Jsr Corp 感放射線性樹脂組成物、そのスペーサーへの使用、およびスペーサー
JP4208418B2 (ja) * 2000-01-13 2009-01-14 富士フイルム株式会社 電子線又はｘ線用ネガ型レジスト組成物
JP2002031708A (ja) * 2000-07-14 2002-01-31 Dainippon Printing Co Ltd カラーフィルタおよびその製造方法
JP2002049150A (ja) * 2000-08-03 2002-02-15 Fuji Photo Film Co Ltd 電子線又はｘ線用ネガ型レジスト組成物
JP4401033B2 (ja) * 2001-03-19 2010-01-20 Ａｚエレクトロニックマテリアルズ株式会社 ネガ型感光性樹脂組成物及びこれを用いた表示デバイス
JP2003186023A (ja) * 2001-12-19 2003-07-03 Hitachi Ltd 液晶表示装置
JP2003207893A (ja) * 2002-01-16 2003-07-25 Hitachi Ltd 感光性樹脂組成物及びそれを用いたパターン形成方法

Also Published As

Publication number Publication date
JP4569119B2 (ja) 2010-10-27
SG114706A1 (en) 2005-09-28
KR20060041813A (ko) 2006-05-12
CN1670625A (zh) 2005-09-21
JP2005221947A (ja) 2005-08-18

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