TW200604377A - Conductive microparticle, process for producing the same and anisotropic conductive material - Google Patents
Conductive microparticle, process for producing the same and anisotropic conductive materialInfo
- Publication number
- TW200604377A TW200604377A TW094123991A TW94123991A TW200604377A TW 200604377 A TW200604377 A TW 200604377A TW 094123991 A TW094123991 A TW 094123991A TW 94123991 A TW94123991 A TW 94123991A TW 200604377 A TW200604377 A TW 200604377A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive microparticles
- gold
- conductive
- producing
- coating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemically Coating (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004208914 | 2004-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200604377A true TW200604377A (en) | 2006-02-01 |
TWI377269B TWI377269B (zh) | 2012-11-21 |
Family
ID=35784023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094123991A TW200604377A (en) | 2004-07-15 | 2005-07-15 | Conductive microparticle, process for producing the same and anisotropic conductive material |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070056403A1 (zh) |
EP (1) | EP1768132A1 (zh) |
JP (1) | JP4740137B2 (zh) |
KR (1) | KR101194201B1 (zh) |
CN (1) | CN1981347A (zh) |
TW (1) | TW200604377A (zh) |
WO (1) | WO2006006687A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008218714A (ja) * | 2007-03-05 | 2008-09-18 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子及びその製造方法 |
KR100892301B1 (ko) * | 2007-04-23 | 2009-04-08 | 한화석유화학 주식회사 | 환원 및 치환금도금 방법을 이용한 도전볼 제조 |
JP5940760B2 (ja) * | 2010-05-19 | 2016-06-29 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び接続構造体 |
JP5476210B2 (ja) * | 2010-05-19 | 2014-04-23 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び接続構造体 |
EP2947663A4 (en) * | 2013-01-21 | 2016-09-07 | Toray Industries | CONDUCTIVE MICROPARTICLES |
TW201511296A (zh) * | 2013-06-20 | 2015-03-16 | Plant PV | 用於矽太陽能電池之核-殼型鎳粒子金屬化層 |
JP6777380B2 (ja) * | 2014-05-27 | 2020-10-28 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
WO2017035103A1 (en) | 2015-08-25 | 2017-03-02 | Plant Pv, Inc | Core-shell, oxidation-resistant particles for low temperature conductive applications |
WO2017035102A1 (en) | 2015-08-26 | 2017-03-02 | Plant Pv, Inc | Silver-bismuth non-contact metallization pastes for silicon solar cells |
US10000645B2 (en) | 2015-11-24 | 2018-06-19 | PLANT PV, Inc. | Methods of forming solar cells with fired multilayer film stacks |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2976181A (en) * | 1957-12-17 | 1961-03-21 | Hughes Aircraft Co | Method of gold plating by chemical reduction |
US3300328A (en) * | 1963-11-12 | 1967-01-24 | Clevite Corp | Electroless plating of gold |
US3635824A (en) * | 1969-07-03 | 1972-01-18 | Bell Telephone Labor Inc | Resistance heater and method for preparation thereof |
US4167240A (en) * | 1977-06-27 | 1979-09-11 | Western Electric Company, Inc. | Method of treating an electroplating solution comprising ions of gold and cyanide prior to electroplating and thermocompression bonding |
JPS5554561A (en) * | 1978-10-18 | 1980-04-21 | Nippon Mining Co Ltd | Metal plating method for powdered body by substitution method |
US4450188A (en) * | 1980-04-18 | 1984-05-22 | Shinroku Kawasumi | Process for the preparation of precious metal-coated particles |
US4711814A (en) * | 1986-06-19 | 1987-12-08 | Teichmann Robert J | Nickel particle plating system |
US5882802A (en) * | 1988-08-29 | 1999-03-16 | Ostolski; Marian J. | Noble metal coated, seeded bimetallic non-noble metal powders |
DE4020795C1 (zh) * | 1990-06-28 | 1991-10-17 | Schering Ag Berlin-Bergkamen, 1000 Berlin, De | |
US5232492A (en) * | 1992-01-23 | 1993-08-03 | Applied Electroless Concepts Inc. | Electroless gold plating composition |
WO1994012686A1 (en) * | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating bath |
DE69406701T2 (de) * | 1993-03-26 | 1998-04-02 | Uyemura & Co C | Chemisches Vergoldungsbad |
US5803957A (en) * | 1993-03-26 | 1998-09-08 | C. Uyemura & Co.,Ltd. | Electroless gold plating bath |
US5318621A (en) * | 1993-08-11 | 1994-06-07 | Applied Electroless Concepts, Inc. | Plating rate improvement for electroless silver and gold plating |
JP3436327B2 (ja) * | 1995-05-16 | 2003-08-11 | 日本化学工業株式会社 | 導電性無電解めっき粉体 |
DE19745602C1 (de) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Verfahren und Lösung zur Herstellung von Goldschichten |
JP4116718B2 (ja) * | 1998-11-05 | 2008-07-09 | 日本リーロナール有限会社 | 無電解金めっき方法及びそれに使用する無電解金めっき液 |
US6383269B1 (en) * | 1999-01-27 | 2002-05-07 | Shipley Company, L.L.C. | Electroless gold plating solution and process |
KR20030033034A (ko) * | 2000-08-21 | 2003-04-26 | 니혼 리로날 가부시키가이샤 | 치환 무전해 금 도금액, 및 상기 도금액 제조용 첨가제 |
AU2001286266A1 (en) * | 2000-09-18 | 2002-03-26 | Hitachi Chemical Co. Ltd. | Electroless gold plating solution and method for electroless gold plating |
KR100438408B1 (ko) * | 2001-08-16 | 2004-07-02 | 한국과학기술원 | 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용 |
JP4375702B2 (ja) * | 2001-10-25 | 2009-12-02 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | めっき組成物 |
US6838022B2 (en) * | 2002-07-25 | 2005-01-04 | Nexaura Systems, Llc | Anisotropic conductive compound |
JP4113403B2 (ja) * | 2002-09-17 | 2008-07-09 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料及び導電性微粒子の製造方法 |
JP2004190075A (ja) * | 2002-12-10 | 2004-07-08 | Kanto Chem Co Inc | 無電解金めっき液 |
-
2005
- 2005-07-14 EP EP05760135A patent/EP1768132A1/en not_active Withdrawn
- 2005-07-14 WO PCT/JP2005/013090 patent/WO2006006687A1/ja not_active Application Discontinuation
- 2005-07-14 CN CNA2005800222400A patent/CN1981347A/zh active Pending
- 2005-07-14 JP JP2006529162A patent/JP4740137B2/ja active Active
- 2005-07-14 KR KR1020067027261A patent/KR101194201B1/ko active IP Right Grant
- 2005-07-14 US US10/567,461 patent/US20070056403A1/en not_active Abandoned
- 2005-07-15 TW TW094123991A patent/TW200604377A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20070033373A (ko) | 2007-03-26 |
CN1981347A (zh) | 2007-06-13 |
JPWO2006006687A1 (ja) | 2008-05-01 |
KR101194201B1 (ko) | 2012-10-25 |
TWI377269B (zh) | 2012-11-21 |
WO2006006687A1 (ja) | 2006-01-19 |
EP1768132A1 (en) | 2007-03-28 |
JP4740137B2 (ja) | 2011-08-03 |
US20070056403A1 (en) | 2007-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |