TW200604377A - Conductive microparticle, process for producing the same and anisotropic conductive material - Google Patents

Conductive microparticle, process for producing the same and anisotropic conductive material

Info

Publication number
TW200604377A
TW200604377A TW094123991A TW94123991A TW200604377A TW 200604377 A TW200604377 A TW 200604377A TW 094123991 A TW094123991 A TW 094123991A TW 94123991 A TW94123991 A TW 94123991A TW 200604377 A TW200604377 A TW 200604377A
Authority
TW
Taiwan
Prior art keywords
conductive microparticles
gold
conductive
producing
coating
Prior art date
Application number
TW094123991A
Other languages
English (en)
Chinese (zh)
Other versions
TWI377269B (enExample
Inventor
Takashi Kubota
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200604377A publication Critical patent/TW200604377A/zh
Application granted granted Critical
Publication of TWI377269B publication Critical patent/TWI377269B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW094123991A 2004-07-15 2005-07-15 Conductive microparticle, process for producing the same and anisotropic conductive material TW200604377A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004208914 2004-07-15

Publications (2)

Publication Number Publication Date
TW200604377A true TW200604377A (en) 2006-02-01
TWI377269B TWI377269B (enExample) 2012-11-21

Family

ID=35784023

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123991A TW200604377A (en) 2004-07-15 2005-07-15 Conductive microparticle, process for producing the same and anisotropic conductive material

Country Status (7)

Country Link
US (1) US20070056403A1 (enExample)
EP (1) EP1768132A1 (enExample)
JP (1) JP4740137B2 (enExample)
KR (1) KR101194201B1 (enExample)
CN (1) CN1981347A (enExample)
TW (1) TW200604377A (enExample)
WO (1) WO2006006687A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP2008218714A (ja) * 2007-03-05 2008-09-18 Bridgestone Corp 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子及びその製造方法
KR100892301B1 (ko) * 2007-04-23 2009-04-08 한화석유화학 주식회사 환원 및 치환금도금 방법을 이용한 도전볼 제조
JP5476210B2 (ja) * 2010-05-19 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5940760B2 (ja) * 2010-05-19 2016-06-29 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP6066348B2 (ja) * 2013-01-21 2017-01-25 東レ株式会社 導電性微粒子
TWM512217U (zh) * 2013-06-20 2015-11-11 Plant PV 太陽能電池
JP6777380B2 (ja) * 2014-05-27 2020-10-28 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
WO2017035103A1 (en) 2015-08-25 2017-03-02 Plant Pv, Inc Core-shell, oxidation-resistant particles for low temperature conductive applications
US10418497B2 (en) 2015-08-26 2019-09-17 Hitachi Chemical Co., Ltd. Silver-bismuth non-contact metallization pastes for silicon solar cells
US10233338B2 (en) 2015-11-24 2019-03-19 PLANT PV, Inc. Fired multilayer stacks for use in integrated circuits and solar cells

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US2976181A (en) * 1957-12-17 1961-03-21 Hughes Aircraft Co Method of gold plating by chemical reduction
US3300328A (en) * 1963-11-12 1967-01-24 Clevite Corp Electroless plating of gold
US3635824A (en) * 1969-07-03 1972-01-18 Bell Telephone Labor Inc Resistance heater and method for preparation thereof
US4167240A (en) * 1977-06-27 1979-09-11 Western Electric Company, Inc. Method of treating an electroplating solution comprising ions of gold and cyanide prior to electroplating and thermocompression bonding
JPS5554561A (en) * 1978-10-18 1980-04-21 Nippon Mining Co Ltd Metal plating method for powdered body by substitution method
US4450188A (en) * 1980-04-18 1984-05-22 Shinroku Kawasumi Process for the preparation of precious metal-coated particles
US4711814A (en) * 1986-06-19 1987-12-08 Teichmann Robert J Nickel particle plating system
US5882802A (en) * 1988-08-29 1999-03-16 Ostolski; Marian J. Noble metal coated, seeded bimetallic non-noble metal powders
DE4020795C1 (enExample) * 1990-06-28 1991-10-17 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
US5232492A (en) * 1992-01-23 1993-08-03 Applied Electroless Concepts Inc. Electroless gold plating composition
DE69224914T2 (de) * 1992-11-25 1998-10-22 Kanto Kagaku Stromloses goldbeschichtungsbad
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
EP0618307B1 (en) * 1993-03-26 1997-11-12 C. Uyemura & Co, Ltd Electroless gold plating bath
US5318621A (en) * 1993-08-11 1994-06-07 Applied Electroless Concepts, Inc. Plating rate improvement for electroless silver and gold plating
JP3436327B2 (ja) * 1995-05-16 2003-08-11 日本化学工業株式会社 導電性無電解めっき粉体
DE19745602C1 (de) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Verfahren und Lösung zur Herstellung von Goldschichten
JP4116718B2 (ja) * 1998-11-05 2008-07-09 日本リーロナール有限会社 無電解金めっき方法及びそれに使用する無電解金めっき液
US6383269B1 (en) * 1999-01-27 2002-05-07 Shipley Company, L.L.C. Electroless gold plating solution and process
US6991675B2 (en) * 2000-08-21 2006-01-31 Shipley Company, L.L.C. Electroless displacement gold plating solution and additive for use in preparing plating solution
WO2002022909A1 (fr) * 2000-09-18 2002-03-21 Hitachi Chemical Co., Ltd. Solution pour dorure autocatalytique et procede correspondant
KR100438408B1 (ko) * 2001-08-16 2004-07-02 한국과학기술원 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용
JP4375702B2 (ja) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． めっき組成物
US6838022B2 (en) * 2002-07-25 2005-01-04 Nexaura Systems, Llc Anisotropic conductive compound
JP4113403B2 (ja) * 2002-09-17 2008-07-09 積水化学工業株式会社 導電性微粒子、異方性導電材料及び導電性微粒子の製造方法
JP2004190075A (ja) * 2002-12-10 2004-07-08 Kanto Chem Co Inc 無電解金めっき液

Also Published As

Publication number Publication date
TWI377269B (enExample) 2012-11-21
KR101194201B1 (ko) 2012-10-25
JP4740137B2 (ja) 2011-08-03
KR20070033373A (ko) 2007-03-26
US20070056403A1 (en) 2007-03-15
JPWO2006006687A1 (ja) 2008-05-01
CN1981347A (zh) 2007-06-13
WO2006006687A1 (ja) 2006-01-19
EP1768132A1 (en) 2007-03-28

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