TW200602692A - Dielectric multilayer filter and its manufacturing method, and solid-state imaging device - Google Patents

Dielectric multilayer filter and its manufacturing method, and solid-state imaging device

Info

Publication number
TW200602692A
TW200602692A TW094104532A TW94104532A TW200602692A TW 200602692 A TW200602692 A TW 200602692A TW 094104532 A TW094104532 A TW 094104532A TW 94104532 A TW94104532 A TW 94104532A TW 200602692 A TW200602692 A TW 200602692A
Authority
TW
Taiwan
Prior art keywords
dielectric multilayer
light
multilayer filter
solid
state imaging
Prior art date
Application number
TW094104532A
Other languages
English (en)
Inventor
Hiroyuki Mukaiyama
Akira Komatsu
Masami Hirayama
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200602692A publication Critical patent/TW200602692A/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/46—Systems using spatial filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G02B5/281—Interference filters designed for the infrared light
    • G02B5/282—Interference filters designed for the infrared light reflecting for infrared and transparent for visible light, e.g. heat reflectors, laser protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW094104532A 2004-02-17 2005-02-16 Dielectric multilayer filter and its manufacturing method, and solid-state imaging device TW200602692A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004040079A JP2005234038A (ja) 2004-02-17 2004-02-17 誘電体多層膜フィルタ及びその製造方法並びに固体撮像デバイス

Publications (1)

Publication Number Publication Date
TW200602692A true TW200602692A (en) 2006-01-16

Family

ID=34697987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094104532A TW200602692A (en) 2004-02-17 2005-02-16 Dielectric multilayer filter and its manufacturing method, and solid-state imaging device

Country Status (6)

Country Link
US (1) US20050180010A1 (zh)
EP (1) EP1564566A1 (zh)
JP (1) JP2005234038A (zh)
KR (1) KR20060041960A (zh)
CN (1) CN1657980A (zh)
TW (1) TW200602692A (zh)

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TWI557445B (zh) * 2013-10-17 2016-11-11 Jsr股份有限公司 光學濾波器、固體攝像裝置及照相機模組
US11231534B2 (en) 2017-03-16 2022-01-25 Sony Semiconductor Solutions Corporation Solid-state imaging device and electronic apparatus

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JP4644423B2 (ja) * 2003-09-30 2011-03-02 富士フイルム株式会社 カラー固体撮像素子及びこのカラー固体撮像素子を用いた固体撮像装置並びにデジタルカメラ
JP4533088B2 (ja) * 2004-11-01 2010-08-25 キヤノン株式会社 光学フィルタ及びそれを有する撮像装置
US7852562B2 (en) * 2005-02-28 2010-12-14 Nalux Co., Ltd. Optical element with laser damage suppression film
JP2007097631A (ja) * 2005-09-30 2007-04-19 Matsushita Electric Ind Co Ltd 虹彩撮影用レンズ
JP2007316498A (ja) * 2006-05-29 2007-12-06 Enplas Corp 光学部品、撮像装置、光学部品の製造方法および光学フィルタ
WO2008023802A1 (fr) * 2006-08-25 2008-02-28 Nalux Co., Ltd. Dispositif optique à film multicouche et procédé pour produire celui-ci
WO2008146644A1 (ja) * 2007-05-24 2008-12-04 Sharp Kabushiki Kaisha 撮像装置及びその製造方法、並びに該撮像装置を搭載した携帯情報端末及び撮像機器
CN101627662B (zh) * 2007-09-06 2012-02-01 索尼株式会社 光提取装置、光提取装置制造方法以及显示设备
KR20090033070A (ko) * 2007-09-27 2009-04-01 엘지이노텍 주식회사 카메라 모듈
JP2009088255A (ja) 2007-09-28 2009-04-23 Sharp Corp カラー固体撮像装置および電子情報機器
JP4696104B2 (ja) * 2007-09-28 2011-06-08 富士フイルム株式会社 裏面照射型固体撮像素子及びその製造方法
JP5175620B2 (ja) * 2008-05-29 2013-04-03 シャープ株式会社 電子素子ウェハモジュールおよびその製造方法、電子素子モジュール、電子情報機器
JP5435996B2 (ja) * 2009-03-24 2014-03-05 富士フイルム株式会社 近接型撮像装置、及び撮像フィルタ
JP2010251558A (ja) * 2009-04-16 2010-11-04 Toshiba Corp 固体撮像装置
JP2011187754A (ja) * 2010-03-10 2011-09-22 Toshiba Corp 固体撮像装置及びその製造方法
KR20110130708A (ko) * 2010-05-28 2011-12-06 삼성전자주식회사 3차원 안경 및 3차원 디스플레이 장치
JP2013536454A (ja) * 2010-06-28 2013-09-19 シンヴェント・アクチェセルスカベット 立体３ｄ表示装置のための視認補助具
KR20120016499A (ko) * 2010-08-16 2012-02-24 삼성전자주식회사 카메라 모듈
KR20120042212A (ko) * 2010-10-25 2012-05-03 삼성전자주식회사 입체영상용 셔터 안경 및 이를 포함하는 디스플레이 시스템
JP2013003542A (ja) * 2011-06-21 2013-01-07 Konica Minolta Advanced Layers Inc 光学素子集合体、光学素子、光学素子集合体の製造方法、及び、光学素子の製造方法
CN202177716U (zh) * 2011-07-22 2012-03-28 浙江水晶光电科技股份有限公司 高像素影像系统用滤光片
TWI467777B (zh) * 2012-06-06 2015-01-01 Pixart Imaging Inc 光學裝置之封裝結構
JP6241419B2 (ja) * 2012-11-30 2017-12-06 旭硝子株式会社 近赤外線カットフィルタ
JP5617063B1 (ja) * 2012-12-28 2014-10-29 旭硝子株式会社 近赤外線カットフィルタ
US8837870B1 (en) * 2013-04-29 2014-09-16 Photop Technologies, Inc. Fiber coupled laser device having high polarization extinction ratio and high stability
JPWO2017195302A1 (ja) * 2016-05-11 2019-03-07 オリンパス株式会社 レンズユニットの製造方法、及び撮像装置の製造方法
EP3529643A1 (en) * 2016-10-18 2019-08-28 Corning Incorporated Variable focus lens with integral optical filter and image capture device comprising the same
JP6791584B2 (ja) * 2017-02-01 2020-11-25 株式会社ディスコ 加工方法
WO2020036177A1 (ja) 2018-08-17 2020-02-20 Ａｇｃ株式会社 光学素子、光学系、および光学装置
CN112437222A (zh) * 2020-12-15 2021-03-02 维沃移动通信有限公司 摄像组件和电子设备
CN116888738A (zh) * 2021-03-30 2023-10-13 索尼半导体解决方案公司 摄像装置

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JPH10189929A (ja) * 1996-12-20 1998-07-21 Sony Corp 固体撮像素子
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TWI557445B (zh) * 2013-10-17 2016-11-11 Jsr股份有限公司 光學濾波器、固體攝像裝置及照相機模組
US9606275B2 (en) 2013-10-17 2017-03-28 Jsr Corporation Optical filter, solid-state image pickup device and camera module
US11231534B2 (en) 2017-03-16 2022-01-25 Sony Semiconductor Solutions Corporation Solid-state imaging device and electronic apparatus

Also Published As

Publication number Publication date
US20050180010A1 (en) 2005-08-18
EP1564566A1 (en) 2005-08-17
CN1657980A (zh) 2005-08-24
JP2005234038A (ja) 2005-09-02
KR20060041960A (ko) 2006-05-12

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