TW200535026A - Monolithic controller for the generator unit of a motor vehicle - Google Patents
Monolithic controller for the generator unit of a motor vehicle Download PDFInfo
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- TW200535026A TW200535026A TW094109128A TW94109128A TW200535026A TW 200535026 A TW200535026 A TW 200535026A TW 094109128 A TW094109128 A TW 094109128A TW 94109128 A TW94109128 A TW 94109128A TW 200535026 A TW200535026 A TW 200535026A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/03—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Motor Or Generator Cooling System (AREA)
- Resistance Heating (AREA)
Description
200535026 九、發明說明: 【發明所屬之技術領域】 本發明關於一種汽車發電機的發電機單元用的單片式 (monolithisch)調節器 〇 【先前技術】 在4專利DE 1 01 50 380 A1提到了一種汽車用的能量 供應裝置,具有累贅式(redundant)發電機調節裝置。此習 •知的能量供應裝置〔它特別設置來作汽車的儀表供電網路 (Bordnetz)的供電用〕有一電瓶,有數個耗電的裝置接到該 電瓶。此外它設有一發電機以將電瓶充電,並有一調節器 以調節發電機電壓。調節器有一控制器、一第一開關(它 又控制益控制,以調節正常操作的發電機電壓)、一第二 開關(它受該控制器控制,以在第一開關功能故障時調節 該發電機電壓)。 汽車的發電機單元用的調節器在耐脈波性及耐電動勢 •電壓(EMV)方面及靜電放電的方面的要求日益提高。在迄 7白知的單片式調節器,這些高度要求只能藉使用外界之 附加構件而滿足。在現有的安裝觀念,要將這種附加構件 人單片式调節fg連接,只能很複雜地達成。姑不論此點, 另外市場的要求也不是統一的。對於調節器的設計的要 长係與要將调節器建入的汽車有很大關係。這點大大地 使調節器的大數量製造變得更加困難。 5 200535026 【發明内容】 具有申清專利範圍第1項的特點的單片式調節器可用 簡單方式配合各種現有的買主需求。如果—位買主在 環境使用該單片式調節器〔在此環境中,對於财脈波性、 对EMV丨生及靜電式放電(ESD)财受性的要求較低〕,則對 於此買主可提供無附加構件的單片式調節器,它呈未封裝 的形式口疋在基質上,這點使該單片式調節器的價格較 低。如果另-位買主要在另一種環境使用(在此環境中對 於财脈波性’耐EMV性及/或靜電式放電的要求很高), 則可將具有—個或數個附加構件(它們係要滿足上述高需 求=者)的=片式調節器(它呈未包封形式固定在基質 上述二種調節器。㈣早-條生產線來製造 此同樣的生產線也可用於生產習知的單片式調節器(它 們與:冷部體牢接),其中該冷卻體舉例而言,係為一個 由銅構成的實心塊,苴尺寸盥 質的尺寸-致。〃尺u具有導電的連接裝置的基 ;種依本發明的單片式調節器的模組式的構想另外還 有:即:各所需之附加構造(它們宜為SMD構件) 可簡單而廉價地固定到該基質上。 設在基質上的結合墊片(B〇ndpad)宜用於將一咖構 件與该早片式調節器或與—外界構件作導電式接觸 將一娜構件與另一 SMD構件作電接觸的方式(為二重 卻外接的配線)係利用基質内的導電連接裝置造成。而一 6 200535026 SMD構件與該單片式調節器的導電式接觸
不是基質的構件),亦即利用外接的配線達成。而線(匕 構件盥非图宏.兮#所 尺适成。而一 SMD 綠r二 基U的構件的導電式接觸也是利用導 線(匕們不是基質的構件)達成。 J用導 該單片式調節器用其背側固定在基質 合或軟銲固定。基質的一 利用黏 此區域)可以沒有導電的連接郎器固定在 一…或其他構件的導電式二 線達成。 片使用在基貝外延伸的導線或細電 本發明的其他有利的性質兹利用圖式在以下說明。 【實施方式】 第1圖顯示用於說明 依此實施例,有一單… …·J的-方塊圖。 有早片式凋節器⑴經由端子線路ϊ、 τ 與一發電機單元(圖未示Μ接。此外·= 經由一端子導線^與—端子點 ㈣⑴ 與一端子點Β連接,月f 、, "而子導線Ib τ 碳一端子導線1m接地。在端子莫綠 L與端子導線Ib之間接有一個在:子導線 節器(1)保有發電機I _ ° 。此單片式調 U干有“械早凡用的調節器的全 —驅動及_ a n 因=有 —未封^片的形式,特別s-未封裝的 該附加構件(2)與(3) : ° 同的附加構件,它們用认 早片式调即器⑴外的不 匕們用於使整個裝置有高度的脈波抿抗性 200535026 及问度的EMV抵抗性,且考慮到靜電式放電的高度要求。 化類附加構件特別是互相連接的電容器、電阻器與二極 體。 /、 一汽車的電纜束(Kabelbaum)經由端子點A與B連接, 這些端子點經由端子導線1&將控制信號送到該單片式調節 為(1) ’並經由端子導線lb從該單片式調節器收到資料 信號,這些資料信號包含有關發電機單元之瞬間狀態的資 訊’或影響該調節行為。 第2圖顯示一個用於說明第1圖所示電路的依本發明 的機械構造的草圖。呈未封裝的形式存在的單片式調節器 以其为側固定在一冷卻體(4)上,例如粘合或軟銲在其上。 此冷卻體(4)係一種導熱基質,該基質具有導電的連的連接 破置〇1)、〇2)、(”)、(V4)、(v5)。舉例而言,該基質由一 種陶瓷材料構成,其中該導電的連接裝置(V1)、(V2)、(VJ、 (V4)及〇5)施覆到該陶瓷材料上。 冷卻體(4)的某區域〔該單片式調節器(1)固定在此區域 上〕不帶有導電的連接裝置。 該單片式調節器(1)與發電機單元的導電性接觸係經由 $線(1)...(12)達成,其中只顯示第2圖所示的線路(10(12)。 線路的一端固定在一結合墊片(la)上,該結合墊片(la) <在單片調節器(1)的前側上。線路(jj在冷卻體(4)外延伸 且與冷卻體(4)不作導電式接觸。導線(12)的一端固定在該 單片式調節器(1)的結合墊片(lb)上。導線(12)同樣地在冷卻 體(4)外延伸且與冷卻體不接觸。 8 200535026 此外,該單片式調節器(1)經由其結合塾片(1C)及一導 線與-設在冷卻體(4)上的結合塾片⑺連接。導線(imi) 在冷卻體⑷外延伸。結合塾片(5)與該導電之連接裝置⑹ 呈導電連接。此導電連接裝置再與另—設在冷卻體⑷上的 結合墊片(6)呈導電連接,有一 導線(U從該結合墊片(6)開 始接地,導線(U在冷卻體(4)外延伸。
此外’該導電連接裝置(v2)更與附加元件⑺的一個端 子連接。此附加元件(3)的另一端子與該導電之連接裝置 接觸。此連接裝置(Vl)再與其他的結合墊片⑺與⑻呈導電 連接,該結合墊片(7)(8)各設在冷卻體(4)。有一導線 在該單片式調節器⑴的結合塾片⑺與結合墊片〇e)之間^ 有一導線(Ib)在該結合墊片(8)與外端子點(B)之間延伸。線 路(1^)與(lb2)在冷卻體(4)外延伸。
此外該導電的連接裝置(V2)與附加元件(2)的一端子連 接。此附加S件⑺的另—端子與該導電的連接裝置⑹連 接。此連接裝置(Vs)再經該導電連接裝置(”)與一結合墊片 (9)連接,並經導電連接裝置(V4)與一結合塾片⑽連接。 這些結合墊片(9)(1〇)設在冷卻體(4)上。為了節省空間之 故,這些連接裝置(V3)與(^)可以與所示實施例不同,·組合 成單-連接裝置。此外,結合墊片⑼經—導線(1“)與該單 片式調節器⑴連接,其中該導線⑸在冷卻體⑷外延^。 此外,該結合墊片(10)經一導線與外面的端子點(A)連 接,其中S亥導線(Ia2)在冷卻體(4)外延伸。 第2圖中所示之附加元件(2)與(3)各做成一 構件 9 200535026 SMD構件設在該導電之連接裝置(Μ⑹及⑹上, 这f連接裝置(V】)(V2)(V5)係為SMD構件用的容納元件。這 些容納元件的面積比起用於容納第2圖及第3圖所示的 SMD構件⑺(3)所需者更大。這點有一好處,即:當對於 耐脈波強度、EMV強度及ESD性質有其他要求時,也可 不用構件⑺⑺,而用其他構件〔其尺寸與構件⑺⑺不同〕。 _因此依第2圖中所示之設置,該單片調節器⑴及附加 7C件(2)與⑺係gj定在冷卻體(4)上4卻體係—種設有導 $之連接裝置的導熱基質,該導埶基質 具有銅構造,或用導電膏印刷。這些導電的連接裝置二設 在基質(4)上的結合墊片(5)(6)⑺⑻(9)(1〇)接觸。舉例而 言,基板為一種陶瓷基質,附加元件(2)(3)各設在這些導電 連接裝置之中的二個之間,用此方式造成之電配線與第i 圖所示的電配線一致。 第3圖顯示一個用於說明本發明第二實施例的方塊 圖。關於第3圖所示的調節器’對於耐脈波強度、耐e鮮 強度及ESD性質的要求比第i圖所示之調節器低。因此, 在第3圖中所示之實施例中’在該單片式調節器⑴與端子 (a)(b)及接地端間不需附加之配線。該單片式調節器(1)一 如在第丨圖所示之實施例係經由導線(Ιι)·..(ΐ2)與該發電機 單元連接。 第4圖顯示用於說明帛3目之電路的機械構造的一草 圖。依第4圖的構造又與第2圖的構造大致一致。它與第 2圖所示構造不同處只在於並沒有附加元件(2)(3)。因^, 200535026 在第4圖中所示的實施例中,在導電連接裝置(v】)與(^)之 間沒有電子式接觸,且在導電之連接裝置(Μ與⑹之严:也 沒有導電式接觸。 依第4圖,該單片式調節器(1)的結合墊片(1勾經由導 線(Ib】)、結合墊片(8)、與導線(1^)與外部之端子點(B)呈導 电連接。XI種連接裝置與第3圖的連接裝置(D相當。· 此外,依第4圖,該單片式調節器(1)的結合墊片(ic) 經由導線(Iml)、結合墊片(5)、導電連接裝置卜2)、結合墊 i片(6)、及導線U與接地端連接,此連接裝置相當於第3 圖的連接裝置。 此外,依第4圖,該單片式調節器(1)的結合墊片(ic) 經由導線(Iml)、結合墊片(5)、導電連接裝置(V2)、結合墊 片(6)與導線(Iw)接地,此連接裝置相當於第3圖中的連接 裝置(Im)。 此外,依第4圖,該單片式調節器(1)的結合墊片(ld) •經由導線(Ial)、結合墊片(9)、導電連接裝置(V3)、導電連 接裝置〇5)、導電連接裝置(v4)、結合墊片(1〇)及導線 與外面的端子點(A)連接。此連接裝置相當於第3圖中的連 接裝置(1J。 本發明的一主要優點在於:圖中所示裝置可利用單一 且相同的生產線製造。如果一買主希望製造調節器,而對 耐脈波強度、耐EMV強度及靜電性質沒有高度要求,則 對此買主可製造第4圖所示的不具附加元件的裝置。而為 另貝主要將該調節器用於對耐脈波強度、耐EMV強度 11 200535026 及靜電性質有高度要求的w 又赘承的婊i兄中時,則可利用同— 線製造第2圖所示之且古 條生產 之,、有附加凡件(2)(3)的裝置,复 附加元件做成SMD構件 ^ ψ 可製造習用的調節芎(兴 生產綠也 心塊,它不設有導線構造)。 钔n 為了節省成本,可以不始笛 配線作業最佳化。4圖所示實施例而將結合
【圖式簡單說明】 第1 第2 第3 第4 【主要元件符號說明】 (1) (^)(^)(1〇)(1,)(1€) (2)(3) (4) (5) (6)(7)(8)(9)(10) (Ιι)(Ι2) (A)(B) (Ia)(Ib)
圖係用於說明本發 圖係用於說明第i w係用於說明本發 圖係用於說明第3 明第一實施例的一方媿圖, 圖所示電路的機械構造的草圖, 明弟一實施例的一方瑰圖, 圖所示電路的機械構造的草圖。 單片式調節器 結合墊片 附加構件 冷卻體(陶瓷基質) 結合墊片 端子線路 端子點 端子導線(結合蛰片、連 接裝置) 12 200535026 (v】)(v2)(v3)(v4)(v5) (Ial)(Ia2)(Ibl)(Ib2)(Iml)(Im2) 連接裝置 導線
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Claims (1)
- 200535026 十、申請專利範圍·· 1 ·種α車發電機單元用的單片式調節器,該調節哭 與一冷卻體(4)牢接,其特徵在: … 該冷卻體(4)為一導熱陶£基質,設有導電之連接裝置 (VlKV2)(V3Kv4)(V5),且該單片㈣"⑴呈未封裝… 該基質牢接。 2·如申請專利範圍第丨項之單片式調節器,其中: 該調節器以其背側與基質(4)連接。 • 3·如申請專利範圍第1或第2項之單片式調節器,1 • 丨口u y、 中·· 鑪導電連接裝置為銅構造或由導電膏印刷構成。 4·如申請專利範圍第2項之單片式調節器,其中: 該調節n的前側設有結合墊Mla)(lb)(ie)⑽⑽, 用於作導電接觸。 5. 如申請專利範圍帛!或第2項之單片式調節器,其 中·· α • 該調節器與至少一附加構件(2)(3)呈導電接觸,該附加 構件係-種SMD構件,且該SMD構件與該基質牢接。 6. 如申請專利範圍第5項之單片式調節器,其中: 該基質上設有二個SMD構件’且這些smd構件經由 基質的一導電連接裝置(VO互相呈導電方式接觸。、工 7. 如申請專利範圍第2項之單片式調節器,其中: 該基質(4)的橫截面積大於該單片式調節器⑴的橫截面 14 200535026 8.如申睛專利蔚 ^ ^ ^ 圍弟5項之單片式調節器,其中: 周茚°。、,,工由其則側所設的結合墊片(la)(lb)(lc)(ld) 的部件〕及5又在基貝(4)上的結合塾片(5)(6)(7)(8)(9)(10)之 中的一結合墊片與該SMD構件(2)(3)之一呈導電式連接。 十^一、圖式·如次頁15
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JP4293004B2 (ja) * | 2004-02-04 | 2009-07-08 | 株式会社デンソー | 放電灯点灯装置 |
US7436678B2 (en) * | 2004-10-18 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof |
JP4547231B2 (ja) * | 2004-10-22 | 2010-09-22 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
US7564337B2 (en) * | 2005-03-03 | 2009-07-21 | Littelfuse, Inc. | Thermally decoupling fuse holder and assembly |
JP4538359B2 (ja) * | 2005-03-31 | 2010-09-08 | 株式会社日立産機システム | 電気回路モジュール |
JP4818847B2 (ja) * | 2005-11-07 | 2011-11-16 | アスモ株式会社 | モータ制御装置 |
US20080013298A1 (en) * | 2006-07-14 | 2008-01-17 | Nirmal Sharma | Methods and apparatus for passive attachment of components for integrated circuits |
US7710236B2 (en) * | 2006-08-01 | 2010-05-04 | Delphi Technologies, Inc. | Fuse systems with serviceable connections |
-
2004
- 2004-04-24 DE DE102004020172A patent/DE102004020172A1/de not_active Withdrawn
-
2005
- 2005-02-24 WO PCT/EP2005/050783 patent/WO2005104345A1/de active Application Filing
- 2005-02-24 CN CN2005800128470A patent/CN1947329B/zh active Active
- 2005-02-24 US US11/587,521 patent/US20080186680A1/en not_active Abandoned
- 2005-02-24 EP EP05716783.5A patent/EP1743417B1/de active Active
- 2005-02-24 BR BRPI0510178-6A patent/BRPI0510178A/pt active Search and Examination
- 2005-02-24 JP JP2007508883A patent/JP2007534290A/ja active Pending
- 2005-03-24 TW TW094109128A patent/TW200535026A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI417396B (zh) * | 2009-11-24 | 2013-12-01 | Univ Nat Taiwan | 多孔性錫粒子及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2005104345A1 (de) | 2005-11-03 |
CN1947329A (zh) | 2007-04-11 |
US20080186680A1 (en) | 2008-08-07 |
EP1743417B1 (de) | 2018-04-11 |
CN1947329B (zh) | 2012-06-27 |
BRPI0510178A (pt) | 2007-10-02 |
JP2007534290A (ja) | 2007-11-22 |
EP1743417A1 (de) | 2007-01-17 |
DE102004020172A1 (de) | 2005-11-24 |
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