CN1947329A - 用于汽车发电机单元的整体调节器 - Google Patents

用于汽车发电机单元的整体调节器 Download PDF

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CN1947329A
CN1947329A CNA2005800128470A CN200580012847A CN1947329A CN 1947329 A CN1947329 A CN 1947329A CN A2005800128470 A CNA2005800128470 A CN A2005800128470A CN 200580012847 A CN200580012847 A CN 200580012847A CN 1947329 A CN1947329 A CN 1947329A
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A·亨克尔
V·科尔施
R·米利克
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Abstract

本发明涉及一种用于汽车发电机单元的整体调节器(1)，它与冷却体固定连接。所述冷却体(4)最好是一个导热的陶瓷衬底(4)，它附加地配有导电连接(V1－V5)、最好是铜结构。所述整体调节器以无封装的形式与衬底固定连接。

Description

用于汽车发电机单元的整体调节器
技术领域
本发明涉及一种用于汽车发电机单元的整体调节器。
背景技术
由DE 101 50 380 A1已知用于汽车的具有冗余的发电机调节的电源。这种已知的尤其用于车载电网的供电的电源具有一个电池，在其上连接许多耗电器。此外它配有用于电池充电的发电机和用于调节发电机电压的调节器。该调节器具有一个控制器、一个由控制器控制的用于调节正常运行的发电机电压的第一开关和一个由控制器控制的用于在第一开关发生故障时调节发电机电压的第二开关。
用于汽车发电机单元的调节器在脉冲稳定性和EMV稳定性方面以及在静电放电方面必需满足越来越高的要求。这些高要求对于目前已知的整体调节器只能通过使用外部的附加器件满足。这种附加器件与整体调节器的连接对于现有的装配方案只能烦琐地实现。与此无关市场需求也是不一致的。对调节器设计的要求在很大程度上取决于各种在其中要安装调节器汽车。这使得调节器的大批量生产是明显困难的。
发明内容
一个具有权利要求1特征的整体调节器以简单的方式分别适配于现有的客户要求。如果客户要在对脉冲稳定性、EMV稳定性和静电放电(ESD稳定性)要求相对较低的情况中使用整体调节器，则可以使这个以无封装的(unverpackt)形式固定在衬底上的整体调节器无需使用附加的器件。这使得整体调节器的价格相对较低。如果其它客户要在对脉冲稳定性、EMV稳定性和/或静电放电要求较高的情况中使用整体调节器，则可以对这些其它客户提供以无封装的形式固定在衬底上的、具有一个或多个附加器件的整体调节器供使用，它们必需满足上述的高要求。在此为了加工上述两种调节器可以使用同一个加工线。
这种加工线也可以用于加工已知的整体调节器，它们与一个冷却体固定连接，其中该冷却体例如是由铜制成的实心体，其尺寸与具有导电连接的衬底的尺寸一致。
按照本发明的整体调节器的模块式方案还具有优点：可以将各所需的附加器件、最好是SMD器件简单且可经济地固定在衬底上。
最好安置在衬底上的连接片上用于使各SMD器件与整体调节器或与外部的器件电接通。为了节省外部布线使一个SMD器件与其它SMD器件的电接通通过在衬底内的导电连接实现。通过不是衬底组成部分的导线、即通过外部的布线实现SMD器件与整体调节器的电接通。通过不是衬底组成部分的导线实现SMD器件与不固定在衬底上的器件的电接通。
使整体调节器通过其背面固定在衬底上，例如粘接或钎焊。固定有整体调节器的那些衬底部位可以没有导电连接。通过位于整体调节器正面上的连接片在使用在衬底外部延伸的导线或细导线的情况下实现整体调节器与一个SMD器件或其它器件的电接通。
附图说明
由下面借助于附图的描述给出本发明的其它优点。附图中：
图1示出用于表示按照本发明的第一实施例的方框图，
图2示出用于表示在图1中所示的电路的机械结构的示意图，
图3示出用于表示按照本发明的第二实施例的方框图，
图4示出用于表示在图3中所示的电路的机械结构的示意图。
具体实施方式
图1示出用于表示按照本发明的第一实施例的方框图。按照这个实施例一个整体调节器1通过连接导线l1，...，l2与未示出的发电机单元连接。此外该整体调节器1通过连接导线la与连接点A连接、通过连接导线lb与连接点B连接并通过连接导线lm与大地连接。在连接导线la与连接导线lm之间连接第一附加器件2。在连接导线lb与连接导线lm之间连接第二附加器件3。该整体调节器1包括用于发电机单元调节器的所有功能，即也包括激励器和自振荡二极管。该整体调节器1以无封装芯片的形式出现，尤其是一个无封装的硅芯片。
附加器件2和3是设置在整体调节器1外部的独立附加器件，它们用于使整个装置具有高的脉冲稳定性和高的EMV稳定性以及满足静电放电方面的高要求。这些附加器件尤其是电容、电阻和二极管，它们相互连接。
通过连接点A和B连接汽车的电缆束，该电缆束通过连接导线la对整体调节器1提供控制信号并通过连接导线lb获得整体调节器的数据信号。这些数据信号包括关于发电机单元的瞬态信息或者影响调节特性。
图2示出用于表示在图1中所示的按照本发明的电路的机械结构的示意图。以无封装形式出现的整体调节器1通过其背面固定在冷却体4上，例如粘接或焊接在冷却体上。这个冷却体4是导热衬底，它具有导电连接V1，V2，V3，V4，V5。该衬底例如由陶瓷材料制成，其中将导电连接V1，V2，V3，V4，V5涂覆在陶瓷材料上。
使整体调节器1固定在冷却体4上的那个部位不带有电连接。
通过导线l1，...，l2实现整体调节器与发电机单元的电接通，在图2中示出导线l1和l2。导线l1的一端固定在位于整体调节器1正面的连接片1a上。该导线l1在冷却体4外部延伸并且不与冷却体电接通。导线l2的一端固定在整体调节器1的连接片1b上。该导线l2同样在冷却体4外部延伸并且也不与冷却体电接通。
此外使整体调节器1通过其连接片1c和导线lm1与安置在冷却体4上的连接片5连接。该导线lm1在冷却体4外部延伸。所述连接片5与导电连接V2处于电连接。这个电连接又与安置在冷却体4上的另一连接片6处于电连接，从该连接片使导线lm2接地。导线lm2在冷却体4外部延伸。
此外所述导电连接V2与附加器件3的接头连接。这个附加器件的另一接头与导电连接V1接通。这个导电连接又与分别安置在冷却体4上的其它连接片7和8电连接。在连接片7与整体调节器1的连接片1e之间延伸导线lb1。在连接片8与外部的连接点B之间延伸导线lb2。这些导线lb1和lb2在冷却体4外部延伸。
此外导电连接V2与附加器件2的接头连接。这个附加器件2的另一接头与导电连接V5连接。这个导电连接又通过导电连接V3与连接片9并通过导电连接V4与连接片10连接。所述连接片9和10安置在冷却体4上。由于位置的原因对于所示实施例也可以选择使连接V3和V4组合成在一个连接。所述连接片9还通过导线la1与整体调节器1的连接片1d连接，其中导线la1在冷却体4外部延伸。所述连接片10还通过导线la2与外部的连接点A处于连接，其中该导线la2在冷却体4外部延伸。
在图2中所示的附加器件2和3分别以SMD器件的形式实现。对于安置SMD器件的导电连接V1，V2和V5是SMD器件的容纳单元。这些容纳单元在面积上大于用于容纳在图2中所示的SMD器件2和3所需的面积。其优点是，在出现对于脉冲稳定性、EMV稳定性和ESD特性的其它要求时代替器件2和3也可以使用其它器件，其尺寸与器件2和3不同。
因此按照在图2中所示的结构不仅整体调节器1而且附加器件2和3都固定在冷却体上。冷却体是配有导电连接V1，V2，V3，V4，V5的导热衬底，它具有铜结构或者导电膏印刷(Pastendruck)。这些导电连接与安置在衬底4上的连接片5，6，7，8，9，10接通。所述衬底例如是陶瓷衬底。所述附加器件2和3分别设置在两个导电连接之间。通过这种方法实现电连接，它与在图1中所示的电连接一致。
图3示出用于表示按照本发明的第二实施例的方框图。对于在图3中所示的调节器对于脉冲稳定性、EMV稳定性和ESD特性比在图1中所示的调节器存在更低的要求。因此对于在图3中所示的实施例在整体调节器1与接头A，B与地线之间无需附加布线。与图1中所示的实施例一样通过导线l1，...，l2实现整体调节器1与发电机单元的连接。
图4示出用于表示在图3中所示的电路的机械结构的示意图。按照图4的结构与按照图2的结构在很大程度上是一致的。与图2所示结构的不同之处仅仅是，没有附加器件2和3。因此对于在图4中所示的实施例在导电连接V1与V2之间根本不存在电接触并且在导电连接V2与V5之间也根本不存在电接触。
按照图4所述整体调节器1的连接片le通过导线lb1、连接片7、导电连接V1、连接片8和导线lb2与外部的连接点B电连接。这个电连接对应于图3中的连接lb。
此外按照图4所述整体调节器1的连接片1c通过导线lm1、连接片5、导电连接V2、连接片6和导线lm2与大地连接。这个连接对应于图3中的连接lm。
此外按照图4所述整体调节器1的连接片1d通过导线la1、连接片9、导电连接V3、导电连接V5、导电连接V4、连接片10和导线la2与外部连接点A连接。这个连接对应于图3中的连接la。
本发明的主要优点是，在附图中所示的装置可以通过同一个加工线生产。如果客户对于调节器的加工在脉冲稳定性、EMV稳定性和静电特性方面没有高要求，则可以对于这个客户按照图4加工没有附加器件的装置。对于另一客户，他们想在对脉冲稳定性、EMV稳定性和/或静电放电要求较高的情况中使用整体调节器，则可以通过同一加工线加工按照图2的具有附加器件2和3的装置，其中附加器件以SMD器件的形式实现。此外通过同一加工线也可以加工按照现有技术的调节器，对于其冷却体例如是由铜制成的实心体，它不配有独立的导体结构。
为了节省成本除在图4中所示的实施例外还可以优化连接布线。

Claims (8)

1.一种用于汽车发电机单元的整体调节器，它与冷却体固定连接，其特征在于，所述冷却体(4)是配有导电连接(V1，V2，V3，V4，V5)的、导热的衬底，并且所述整体调节器(1)以无封装的形式与衬底固定连接。
2.如权利要求1所述的整体调节器，其特征在于，所述调节器通过其背面与衬底(4)连接。
3.如权利要求1或2所述的整体调节器，其特征在于，所述导电连接是铜结构或者由导电膏印刷制成。
4.如权利要求2或3所述的整体调节器，其特征在于，所述调节器在其正面上配有用于电接通的连接片(1a，1b，1c，1d，1e)。
5.如上述权利要求中任一项所述的整体调节器，其特征在于，所述调节器与至少一个附加器件(2，3)电接通，附加器件是SMD器件，并且所述SMD器件同样与衬底(4)固定连接。
6.如权利要求5所述的整体调节器，其特征在于，在衬底上具有两个SMD器件并且这些SMD器件通过衬底的导电连接(V2)相互电接通。
7.如权利要求2至6中任一项所述的整体调节器，其特征在于，所述衬底(4)的横截面积大于整体调节器(1)的横截面积。
8.如权利要求5至7中任一项所述的整体调节器，其特征在于，所述调节器通过位于其正面上的连接片(1a，1b，1c，1d，1e)之一、不是衬底(4)的组成部分的导线(lm1，la1，lb1)和位于衬底(4)上的连接片(5，6，7，8，9，10)之一与SMD器件(2，3)电接通。
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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417396B (zh) * 2009-11-24 2013-12-01 Univ Nat Taiwan 多孔性錫粒子及其製造方法
DE102011109129A1 (de) * 2011-07-14 2013-01-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrischer Energiewandler und Verfahren zu seiner Herstellung

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2610137A1 (de) * 1976-03-11 1977-09-29 Bosch Gmbh Robert Generator mit freilaufdiode und spannungsregler
US4310792A (en) * 1978-06-30 1982-01-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor voltage regulator
US4174496A (en) * 1978-08-02 1979-11-13 Rockwell International Corporation Monolithic solid state power controller
DE3629976A1 (de) * 1986-09-03 1988-04-07 Hueco Gmbh Fabrik Fuer Interna Spannungsregler fuer generatoren
US4902237A (en) * 1989-03-30 1990-02-20 American Telephone And Telegraph Company Adaptor for surface mount and through-hole components
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
US5608616A (en) * 1993-12-07 1997-03-04 Nippondenso Co., Ltd. Power converter
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
US5986885A (en) * 1997-04-08 1999-11-16 Integrated Device Technology, Inc. Semiconductor package with internal heatsink and assembly method
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
JP3519905B2 (ja) * 1997-05-13 2004-04-19 三菱電機株式会社 車両用発電機の制御装置
JP3614174B2 (ja) * 1997-09-11 2005-01-26 三菱電機株式会社 車両用交流発電機の制御装置
US6008532A (en) * 1997-10-23 1999-12-28 Lsi Logic Corporation Integrated circuit package having bond fingers with alternate bonding areas
JP3418673B2 (ja) * 1998-02-12 2003-06-23 株式会社日立製作所 車両用充電発電機の制御装置
US6060795A (en) * 1998-03-18 2000-05-09 Intersil Corporation Semiconductor power pack
FR2780577B1 (fr) * 1998-06-26 2000-09-15 Valeo Equip Electr Moteur Sous-ensemble a composants electroniques pour un alternateur de vehicule automobile
US6707680B2 (en) * 1998-10-22 2004-03-16 Board Of Trustees Of The University Of Arkansas Surface applied passives
US6229227B1 (en) * 1998-12-28 2001-05-08 Kawasaki Steel Corporation Programmable-value on-chip passive components for integrated circuit (IC) chips, and systems utilizing same
US6239977B1 (en) * 1999-05-17 2001-05-29 3Com Corporation Technique for mounting electronic components on printed circuit boards
KR101084526B1 (ko) * 1999-09-02 2011-11-18 이비덴 가부시키가이샤 프린트배선판 및 그 제조방법
US6781350B1 (en) * 1999-09-10 2004-08-24 Mitsubishi Denki Kabushiki Kaisha Automotive dynamo controller
US6737301B2 (en) * 2000-07-13 2004-05-18 Isothermal Systems Research, Inc. Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
US6867493B2 (en) * 2000-11-15 2005-03-15 Skyworks Solutions, Inc. Structure and method for fabrication of a leadless multi-die carrier
US6710433B2 (en) * 2000-11-15 2004-03-23 Skyworks Solutions, Inc. Leadless chip carrier with embedded inductor
US6787895B1 (en) * 2001-12-07 2004-09-07 Skyworks Solutions, Inc. Leadless chip carrier for reduced thermal resistance
JP3932259B2 (ja) * 2001-12-12 2007-06-20 株式会社ルネサステクノロジ 高周波電力増幅回路および無線通信用電子部品
US6878004B2 (en) * 2002-03-04 2005-04-12 Littelfuse, Inc. Multi-element fuse array
DE10228666A1 (de) * 2002-06-27 2004-01-29 Robert Bosch Gmbh Lichtmaschinenregler
DE10243981B4 (de) * 2002-09-20 2015-06-03 Robert Bosch Gmbh Elektronische Baueinheit, insbesondere Regler für Generatoren in Kraftfahrzeugen
KR100467834B1 (ko) * 2002-12-23 2005-01-25 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
KR100455891B1 (ko) * 2002-12-24 2004-11-06 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
JP2004214249A (ja) * 2002-12-27 2004-07-29 Renesas Technology Corp 半導体モジュール
US7353084B2 (en) * 2003-02-27 2008-04-01 Acutra, Inc. Generator controller
US6940724B2 (en) * 2003-04-24 2005-09-06 Power-One Limited DC-DC converter implemented in a land grid array package
JP4115882B2 (ja) * 2003-05-14 2008-07-09 株式会社ルネサステクノロジ 半導体装置
US7012324B2 (en) * 2003-09-12 2006-03-14 Freescale Semiconductor, Inc. Lead frame with flag support structure
JP4293004B2 (ja) * 2004-02-04 2009-07-08 株式会社デンソー 放電灯点灯装置
US7436678B2 (en) * 2004-10-18 2008-10-14 E.I. Du Pont De Nemours And Company Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof
JP4547231B2 (ja) * 2004-10-22 2010-09-22 日立オートモティブシステムズ株式会社 電力変換装置
US7564337B2 (en) * 2005-03-03 2009-07-21 Littelfuse, Inc. Thermally decoupling fuse holder and assembly
JP4538359B2 (ja) * 2005-03-31 2010-09-08 株式会社日立産機システム 電気回路モジュール
JP4818847B2 (ja) * 2005-11-07 2011-11-16 アスモ株式会社 モータ制御装置
US20080013298A1 (en) * 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
US7710236B2 (en) * 2006-08-01 2010-05-04 Delphi Technologies, Inc. Fuse systems with serviceable connections

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DE102004020172A1 (de) 2005-11-24
JP2007534290A (ja) 2007-11-22
CN1947329B (zh) 2012-06-27
WO2005104345A1 (de) 2005-11-03
US20080186680A1 (en) 2008-08-07
EP1743417A1 (de) 2007-01-17
BRPI0510178A (pt) 2007-10-02
EP1743417B1 (de) 2018-04-11

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