TW200533513A - Surface treatment method for copper foil and method for producing copper-coating laminated board - Google Patents

Surface treatment method for copper foil and method for producing copper-coating laminated board Download PDF

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Publication number
TW200533513A
TW200533513A TW094107008A TW94107008A TW200533513A TW 200533513 A TW200533513 A TW 200533513A TW 094107008 A TW094107008 A TW 094107008A TW 94107008 A TW94107008 A TW 94107008A TW 200533513 A TW200533513 A TW 200533513A
Authority
TW
Taiwan
Prior art keywords
copper foil
surface treatment
organic
treated copper
manufacturing
Prior art date
Application number
TW094107008A
Other languages
English (en)
Chinese (zh)
Other versions
TWI349612B (https=
Inventor
Ryuzo Shinta
Yasufumi Matsumura
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200533513A publication Critical patent/TW200533513A/zh
Application granted granted Critical
Publication of TWI349612B publication Critical patent/TWI349612B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002Pretreatement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00Metallic substrate
    • B05D2202/10Metallic substrate based on Fe

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
TW094107008A 2004-03-25 2005-03-08 Surface treatment method for copper foil and method for producing copper-coating laminated board TW200533513A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004089274 2004-03-25

Publications (2)

Publication Number Publication Date
TW200533513A true TW200533513A (en) 2005-10-16
TWI349612B TWI349612B (https=) 2011-10-01

Family

ID=35046942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094107008A TW200533513A (en) 2004-03-25 2005-03-08 Surface treatment method for copper foil and method for producing copper-coating laminated board

Country Status (3)

Country Link
KR (1) KR101058277B1 (https=)
CN (1) CN100452949C (https=)
TW (1) TW200533513A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789562B1 (ko) * 2005-12-01 2007-12-28 주식회사 엘지화학 금속적층판의 제조방법 및 이에 의해 제조된 금속적층판
CN109234752A (zh) * 2018-10-30 2019-01-18 广东坚美铝型材厂(集团)有限公司 一种铝合金表面处理剂及其制备方法和应用
TWI795879B (zh) * 2021-08-20 2023-03-11 柏群科技有限公司 表面結合劑及處理基材表面之方法
CN116275057B (zh) * 2023-03-17 2023-10-10 广西广投正润新材料科技有限公司 基于粉末烧结制备具有微电偶的电子铝箔的腐蚀预处理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909920B2 (ja) * 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
JP4016078B2 (ja) * 2000-01-18 2007-12-05 株式会社東亜電化 プリント配線板の製造方法および多層プリント配線板
KR100573999B1 (ko) * 2001-03-23 2006-04-25 가부시끼가이샤 후지꾸라 다층 배선판, 다층 배선판용 기재 및 그 제조 방법
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP2003013156A (ja) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
CN1180006C (zh) * 2002-11-22 2004-12-15 中国科学院长春应用化学研究所 聚醚酰亚胺柔性印刷线路基材的制备方法

Also Published As

Publication number Publication date
KR20060044767A (ko) 2006-05-16
TWI349612B (https=) 2011-10-01
CN100452949C (zh) 2009-01-14
CN1674769A (zh) 2005-09-28
KR101058277B1 (ko) 2011-08-22

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MM4A Annulment or lapse of patent due to non-payment of fees