KR101058277B1 - 동박의 표면 처리방법 및 동장 적층판의 제조방법 - Google Patents

동박의 표면 처리방법 및 동장 적층판의 제조방법 Download PDF

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Publication number
KR101058277B1
KR101058277B1 KR1020050024958A KR20050024958A KR101058277B1 KR 101058277 B1 KR101058277 B1 KR 101058277B1 KR 1020050024958 A KR1020050024958 A KR 1020050024958A KR 20050024958 A KR20050024958 A KR 20050024958A KR 101058277 B1 KR101058277 B1 KR 101058277B1
Authority
KR
South Korea
Prior art keywords
copper foil
surface treatment
organic
copper
amino
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050024958A
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English (en)
Korean (ko)
Other versions
KR20060044767A (ko
Inventor
류조 신타
야스후미 마쯔무라
Original Assignee
신닛테츠가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 신닛테츠가가쿠 가부시키가이샤 filed Critical 신닛테츠가가쿠 가부시키가이샤
Publication of KR20060044767A publication Critical patent/KR20060044767A/ko
Application granted granted Critical
Publication of KR101058277B1 publication Critical patent/KR101058277B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/10—Metallic substrate based on Fe

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
KR1020050024958A 2004-03-25 2005-03-25 동박의 표면 처리방법 및 동장 적층판의 제조방법 Expired - Fee Related KR101058277B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004089274 2004-03-25
JPJP-P-2004-00089274 2004-03-25

Publications (2)

Publication Number Publication Date
KR20060044767A KR20060044767A (ko) 2006-05-16
KR101058277B1 true KR101058277B1 (ko) 2011-08-22

Family

ID=35046942

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050024958A Expired - Fee Related KR101058277B1 (ko) 2004-03-25 2005-03-25 동박의 표면 처리방법 및 동장 적층판의 제조방법

Country Status (3)

Country Link
KR (1) KR101058277B1 (https=)
CN (1) CN100452949C (https=)
TW (1) TW200533513A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789562B1 (ko) * 2005-12-01 2007-12-28 주식회사 엘지화학 금속적층판의 제조방법 및 이에 의해 제조된 금속적층판
CN109234752A (zh) * 2018-10-30 2019-01-18 广东坚美铝型材厂（集团）有限公司 一种铝合金表面处理剂及其制备方法和应用
TWI795879B (zh) * 2021-08-20 2023-03-11 柏群科技有限公司 表面結合劑及處理基材表面之方法
CN116275057B (zh) * 2023-03-17 2023-10-10 广西广投正润新材料科技有限公司 基于粉末烧结制备具有微电偶的电子铝箔的腐蚀预处理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203462A (ja) * 2000-01-18 2001-07-27 Toa Denka:Kk プリント配線板の製造方法および多層プリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909920B2 (ja) * 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
KR100573999B1 (ko) * 2001-03-23 2006-04-25 가부시끼가이샤 후지꾸라 다층 배선판, 다층 배선판용 기재 및 그 제조 방법
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP2003013156A (ja) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
CN1180006C (zh) * 2002-11-22 2004-12-15 中国科学院长春应用化学研究所 聚醚酰亚胺柔性印刷线路基材的制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203462A (ja) * 2000-01-18 2001-07-27 Toa Denka:Kk プリント配線板の製造方法および多層プリント配線板

Also Published As

Publication number Publication date
KR20060044767A (ko) 2006-05-16
TWI349612B (https=) 2011-10-01
CN100452949C (zh) 2009-01-14
TW200533513A (en) 2005-10-16
CN1674769A (zh) 2005-09-28

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