CN100452949C - 铜箔的表面处理方法及覆铜叠层板的制造方法 - Google Patents

铜箔的表面处理方法及覆铜叠层板的制造方法 Download PDF

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Publication number
CN100452949C
CN100452949C CNB200510059297XA CN200510059297A CN100452949C CN 100452949 C CN100452949 C CN 100452949C CN B200510059297X A CNB200510059297X A CN B200510059297XA CN 200510059297 A CN200510059297 A CN 200510059297A CN 100452949 C CN100452949 C CN 100452949C
Authority
CN
China
Prior art keywords
copper foil
surface treatment
amino
organic
manufacture method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200510059297XA
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English (en)
Chinese (zh)
Other versions
CN1674769A (zh
Inventor
新田龙三
松村康史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Publication of CN1674769A publication Critical patent/CN1674769A/zh
Application granted granted Critical
Publication of CN100452949C publication Critical patent/CN100452949C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/10—Metallic substrate based on Fe

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
CNB200510059297XA 2004-03-25 2005-03-25 铜箔的表面处理方法及覆铜叠层板的制造方法 Expired - Fee Related CN100452949C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004089274 2004-03-25
JP2004089274 2004-03-25

Publications (2)

Publication Number Publication Date
CN1674769A CN1674769A (zh) 2005-09-28
CN100452949C true CN100452949C (zh) 2009-01-14

Family

ID=35046942

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200510059297XA Expired - Fee Related CN100452949C (zh) 2004-03-25 2005-03-25 铜箔的表面处理方法及覆铜叠层板的制造方法

Country Status (3)

Country Link
KR (1) KR101058277B1 (https=)
CN (1) CN100452949C (https=)
TW (1) TW200533513A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789562B1 (ko) * 2005-12-01 2007-12-28 주식회사 엘지화학 금속적층판의 제조방법 및 이에 의해 제조된 금속적층판
CN109234752A (zh) * 2018-10-30 2019-01-18 广东坚美铝型材厂（集团）有限公司 一种铝合金表面处理剂及其制备方法和应用
TWI795879B (zh) * 2021-08-20 2023-03-11 柏群科技有限公司 表面結合劑及處理基材表面之方法
CN116275057B (zh) * 2023-03-17 2023-10-10 广西广投正润新材料科技有限公司 基于粉末烧结制备具有微电偶的电子铝箔的腐蚀预处理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1211896A (zh) * 1997-07-24 1999-03-24 美克株式会社 铜及铜合金的表面处理方法
CN1377217A (zh) * 2001-03-23 2002-10-30 株式会社藤仓 多层线路板组件,多层线路板组件单元及其制造方法
JP2003013156A (ja) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
US20030015345A1 (en) * 2001-06-27 2003-01-23 Hitoshi Arai Laminated base sheet for flexible printed circuit board
CN1410471A (zh) * 2002-11-22 2003-04-16 中国科学院长春应用化学研究所 聚醚酰亚胺柔性印刷线路基材的制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4016078B2 (ja) * 2000-01-18 2007-12-05 株式会社東亜電化 プリント配線板の製造方法および多層プリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1211896A (zh) * 1997-07-24 1999-03-24 美克株式会社 铜及铜合金的表面处理方法
CN1377217A (zh) * 2001-03-23 2002-10-30 株式会社藤仓 多层线路板组件,多层线路板组件单元及其制造方法
US20030015345A1 (en) * 2001-06-27 2003-01-23 Hitoshi Arai Laminated base sheet for flexible printed circuit board
JP2003013156A (ja) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
CN1410471A (zh) * 2002-11-22 2003-04-16 中国科学院长春应用化学研究所 聚醚酰亚胺柔性印刷线路基材的制备方法

Also Published As

Publication number Publication date
KR20060044767A (ko) 2006-05-16
TWI349612B (https=) 2011-10-01
TW200533513A (en) 2005-10-16
CN1674769A (zh) 2005-09-28
KR101058277B1 (ko) 2011-08-22

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: NIPPON STEEL + SUMITOMO METAL CORPORATION

Free format text: FORMER NAME: NIPPON SEEL CHEMICAL CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: Nippon Steel Chemical Co.

Address before: Tokyo, Japan

Patentee before: Nippon Seel Chemical Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090114

Termination date: 20170325